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1.发明申请ASSEMBLY FOR A MEMS ENVIRONMENTAL SENSOR DEVICE HAVING IMPROVED RESISTANCE, AND CORRESPONDING MANUFACTURING PROCESS 审中-公开具有改进电阻的MEMS环境传感器装置的组装以及相应的制造工艺公开(公告)号：US20150014798A1
公开(公告)日：2015-01-15
申请号：US14327272
申请日：2014-07-09
Inventor： Dino Faralli , Benedetto Vigna , Laura Maria Castoldi
CPC classification number: B81B3/00 , B81B7/0058 , B81B2201/0257 , B81B2201/0264 , B81B2201/0278 , B81B2203/0127 , B81C1/00 , B81C2203/0109 , G01F1/00 , G01H17/00 , G01K1/00 , G01L1/00 , H01L2224/48145 , H01L2224/73265 , H01L2924/1461 , H01L2924/16151 , H01L2924/16152 , H01L2924/00012
Abstract: Described herein is an assembly for a MEMS sensor device, which envisages: a first body made of semiconductor material, integrating a micromechanical detection structure at a first main face thereof; a cap element, set stacked on the first main face of the first body, above the micromechanical detection structure; and an adhesion structure set between the first body and the cap element, defining a gap in a position corresponding to the micromechanical detection structure. At least one first opening is defined through the adhesion structure in fluidic communication with the gap.
Abstract translation: 这里描述的是一种用于MEMS传感器装置的组件，其设想：由半导体材料制成的第一主体，在其第一主面处集成微机械检测结构; 设置在第一主体的第一主面上的盖元件，位于微机械检测结构的上方; 以及设置在第一主体和盖元件之间的粘合结构，在对应于微机械检测结构的位置中限定间隙。 通过与间隙流体连通的粘合结构限定至少一个第一开口。
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2.发明授权公开(公告)号：US09321628B2
公开(公告)日：2016-04-26
申请号：US14316583
申请日：2014-06-26
Inventor： Dino Faralli , Benedetto Vigna , Laura Maria Castoldi
CPC classification number: B81B7/0061 , B81B2201/0264 , B81B2203/0127 , B81B2207/012 , B81C1/00269 , B81C2203/0118 , H01L2224/32145 , H01L2224/48091 , H01L2224/73265 , H01L2924/10155 , H01L2924/15151 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
Abstract: A MEMS device wherein a die of semiconductor material has a first face and a second face. A membrane is formed in or on the die and faces the first surface. A cap is fixed to the first face of the first die and is spaced apart from the membrane by a space. The die is fixed, on its second face, to an ASIC, which integrates a circuit for processing the signals generated by the die. The ASIC is in turn fixed on a support. A packaging region coats the die, the cap, and the ASIC and seals them from the outside environment. A fluidic path is formed through the support, the ASIC, and the first die, and connects the membrane and the first face of the die with the outside, without requiring holes in the cap.
Abstract translation: 一种MEMS器件，其中半导体材料的管芯具有第一面和第二面。 在模具中或模具上形成膜并面向第一表面。 盖子固定在第一模具的第一面上并且与隔膜隔开一个空间。 芯片在其第二面被固定到ASIC，其集成了用于处理由芯片产生的信号的电路。 ASIC依次固定在支持上。 包装区域涂覆模具，盖子和ASIC，并将它们与外部环境密封。 通过支撑件，ASIC和第一模具形成流体路径，并且将膜和模具的第一面与外部连接，而不需要在盖中的孔。
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3.发明申请公开(公告)号：US20150001645A1
公开(公告)日：2015-01-01
申请号：US14316583
申请日：2014-06-26
Inventor： Dino Faralli , Benedetto Vigna , Laura Maria Castoldi
CPC classification number: B81B7/0061 , B81B2201/0264 , B81B2203/0127 , B81B2207/012 , B81C1/00269 , B81C2203/0118 , H01L2224/32145 , H01L2224/48091 , H01L2224/73265 , H01L2924/10155 , H01L2924/15151 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
Abstract: A MEMS device wherein a die of semiconductor material has a first face and a second face. A membrane is formed in or on the die and faces the first surface. A cap is fixed to the first face of the first die and is spaced apart from the membrane by a space. The die is fixed, on its second face, to an ASIC, which integrates a circuit for processing the signals generated by the die. The ASIC is in turn fixed on a support. A packaging region coats the die, the cap, and the ASIC and seals them from the outside environment. A fluidic path is formed through the support, the ASIC, and the first die, and connects the membrane and the first face of the die with the outside, without requiring holes in the cap.
Abstract translation: 一种MEMS器件，其中半导体材料的管芯具有第一面和第二面。 在模具中或模具上形成膜并面向第一表面。 盖子固定在第一模具的第一面上并且与隔膜隔开一个空间。 芯片在其第二面被固定到ASIC，其集成了用于处理由芯片产生的信号的电路。 ASIC依次固定在支持上。 包装区域涂覆模具，盖子和ASIC，并将它们与外部环境密封。 通过支撑件，ASIC和第一模具形成流体路径，并且将膜和模具的第一面与外部连接，而不需要在盖中的孔。
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公开(公告)号：US20180065371A1
公开(公告)日：2018-03-08
申请号：US15812960
申请日：2017-11-14
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Mauro Cattaneo , Carlo Luigi Prelini , Lorenzo Colombo , Dino Faralli , Alessandra Sciutti , Lorenzo Tentori
CPC classification number: B41J2/1626 , B41J2/01 , B41J2/135 , B41J2/16 , B41J2/1607 , B41J2/161 , B41J2/162 , B41J2/1621 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1632 , Y10T29/49401
Abstract: A method for manufacturing a device for ejecting a fluid, including producing a nozzle plate including: forming a first nozzle cavity, having a first diameter, in a first semiconductor body; forming a hydrophilic layer at least in part in the first nozzle cavity; forming a structural layer on the hydrophilic layer; etching the structural layer to form a second nozzle cavity aligned to the first nozzle cavity in a fluid-ejection direction and having a second diameter larger than the first diameter; proceeding with etching of the structural layer for removing portions thereof in the first nozzle cavity, to reach the hydrophilic layer and arranged in fluid communication the first and second nozzle cavities; and coupling the nozzle plate with a chamber for containing the fluid.
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公开(公告)号：US20180236447A1
公开(公告)日：2018-08-23
申请号：US15960509
申请日：2018-04-23
Inventor： Praveen Kumar Radhakrishnan , Dino Faralli
CPC classification number: B01L3/502715 , B01L3/502707 , B01L2300/0627 , B01L2300/0848 , B01L2300/12 , G01F1/6845 , G01F1/6888 , G01K7/02 , G01K7/021 , H01L35/32 , H01L35/325
Abstract: A microfluidic-based sensor, comprising: a semiconductor body, having a first and a second side opposite to one another in a direction; a buried channel, extending within the semiconductor body; a structural layer, of dielectric or insulating material, formed over the first side of the semiconductor body at least partially suspended above the buried channel; and a first thermocouple element, including a first strip, of a first electrical conductive material, and a second strip, of a second electrical conductive material different from the first electrical conductive material, electrically coupled to the first strip. The first thermocouple element is buried in the structural layer and partially extends over the buried channel at a first location. A corresponding manufacturing method is disclosed.
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Patent Agency Ranking
公开(公告)号：US09849674B2
公开(公告)日：2017-12-26
申请号：US15179096
申请日：2016-06-10
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Mauro Cattaneo , Carlo Luigi Prelini , Lorenzo Colombo , Dino Faralli , Alessandra Sciutti , Lorenzo Tentori
CPC classification number: B41J2/1626 , B41J2/01 , B41J2/135 , B41J2/16 , B41J2/1607 , B41J2/161 , B41J2/162 , B41J2/1621 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1632 , Y10T29/49401
Abstract: A method for manufacturing a device for ejecting a fluid, including producing a nozzle plate including: forming a first nozzle cavity, having a first diameter, in a first semiconductor body; forming a hydrophilic layer at least in part in the first nozzle cavity; forming a structural layer on the hydrophilic layer; etching the structural layer to form a second nozzle cavity aligned to the first nozzle cavity in a fluid-ejection direction and having a second diameter larger than the first diameter; proceeding with etching of the structural layer for removing portions thereof in the first nozzle cavity, to reach the hydrophilic layer and arranged in fluid communication the first and second nozzle cavities; and coupling the nozzle plate with a chamber for containing the fluid.
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公开(公告)号：US20170203568A9
公开(公告)日：2017-07-20
申请号：US14523625
申请日：2014-10-24
Applicant: STMicroelectronics S.r.l. , STMicroelectronics, Inc.
Inventor： Dino Faralli , Michele Palmieri
IPC: B41J2/16
CPC classification number: B41J2/162 , B41J2/1433 , B41J2/1601 , B41J2/1623 , B41J2/1626 , B41J2/1628 , B41J2/1629 , B41J2/1632 , B41J2/1639 , B41J2/164 , B41J2/1642 , B41J2002/14475 , Y10T29/49401
Abstract: A nozzle plate for a fluid-ejection device, comprising: a first substrate made of semiconductor material, having a first side and a second side; a structural layer extending on the first side of the first substrate, the structural layer having a first side and a second side, the second side of the structural layer facing the first side of the first substrate; at least one first through hole, having an inner surface, extending through the structural layer, the first through hole having an inlet section corresponding to the first side of the structural layer and an outlet section corresponding to the second side of the structural layer; a narrowing element adjacent to the surface of the first through hole, and including a tapered portion such that the inlet section of the first through hole has an area larger than a respective area of the outlet section of the first through hole.
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8.发明申请公开(公告)号：US20140159717A1
公开(公告)日：2014-06-12
申请号：US14102899
申请日：2013-12-11
Applicant: STMicroelectronics S.r.l.
Inventor： Dario Paci , Dino Faralli , Andrea Picco
CPC classification number: G01R33/09 , G01R33/0011 , G01R33/0052 , G01R33/096
Abstract: An integrated magnetoresistive sensor, formed in a chip including a substrate having a surface and an insulating region covering the surface of the substrate. A magnetoresistor, of a first ferromagnetic material, is formed in the insulating region and has a sensitivity plane parallel to the surface. A concentrator of a second ferromagnetic material is formed in the substrate and has at least one arm extending in a transverse direction to the sensitivity plane. The arm has one end in contact with the magnetoresistor.
Abstract translation: 一种集成磁阻传感器，其形成在包括具有覆盖基板的表面的表面和绝缘区域的基板的芯片中。 第一铁磁材料的磁阻电阻器形成在绝缘区域中并且具有平行于表面的灵敏度平面。 第二铁磁材料的集中器形成在基板中，并且具有至少一个在横向方向上延伸到灵敏度平面的臂。 臂的一端与磁电阻接触。
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公开(公告)号：US12058938B2
公开(公告)日：2024-08-06
申请号：US17722713
申请日：2022-04-18
Applicant: STMicroelectronics S.r.l.
Inventor： Maria Fortuna Bevilacqua , Flavio Francesco Villa , Rossana Scaldaferri , Valeria Casuscelli , Andrea Di Matteo , Dino Faralli
IPC: H10N30/30 , H02N2/18 , H10N30/01 , H10N30/03 , H10N30/06 , H10N30/082 , H10N30/853 , H10N30/87 , H10N30/88
CPC classification number: H10N30/308 , H02N2/186 , H10N30/01 , H10N30/03 , H10N30/06 , H10N30/082 , H10N30/304 , H10N30/8554 , H10N30/87 , H10N30/88
Abstract: A process for manufacturing a MEMS piezoelectric device includes: forming a membrane at a first surface of wafer of semiconductor material further having a second surface (the first and second surfaces being opposite along a vertical axis and extending parallel to a horizontal plane formed by first and second horizontal axes); forming a cavity within the wafer so that the membrane is suspended above the cavity; forming a piezoelectric material layer above a first surface of the membrane; forming an electrode arrangement in contact with the piezoelectric material layer; and forming a proof mass coupled to a second surface of the membrane opposite to the first surface along the vertical axis. The proof mass deforms the membrane in response to environmental mechanical vibrations. Forming the proof mass includes forming a connection element at a central position between the membrane and the proof mass in the direction of the vertical axis.
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公开(公告)号：US10682645B2
公开(公告)日：2020-06-16
申请号：US15960509
申请日：2018-04-23
Inventor： Praveen Kumar Radhakrishnan , Dino Faralli
Abstract: A microfluidic-based sensor, comprising: a semiconductor body, having a first and a second side opposite to one another in a direction; a buried channel, extending within the semiconductor body; a structural layer, of dielectric or insulating material, formed over the first side of the semiconductor body at least partially suspended above the buried channel; and a first thermocouple element, including a first strip, of a first electrical conductive material, and a second strip, of a second electrical conductive material different from the first electrical conductive material, electrically coupled to the first strip. The first thermocouple element is buried in the structural layer and partially extends over the buried channel at a first location. A corresponding manufacturing method is disclosed.
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