公开(公告)号：US20130309794A1

公开(公告)日：2013-11-21

申请号：US13950845

申请日：2013-07-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae-won LEE ,  Bok-Ki MIN ,  Jun-youn KIM ,  Young-jo TAK ,  Hyung-su JEONG

IPC: H01L33/60

CPC classification number: H01L33/60 ,  H01L33/007 ,  H01L33/10 ,  H01L33/382 ,  H01L33/387 ,  H01L33/405 ,  H01L33/46 ,  H01L2933/0016

Abstract: A light emitting device may include a substrate, an n-type clad layer, an active layer, and a p-type clad layer. A concave-convex pattern having a plurality of grooves and a mesa between each of the plurality of grooves may be formed on the substrate, and a reflective layer may be formed on the surfaces of the plurality of grooves or the mesa between each of the plurality of grooves. Therefore, light generated in the active layer may be reflected by the reflective layer, and extracted to an external location.

Abstract translation: 发光器件可以包括衬底，n型覆盖层，有源层和p型覆盖层。 可以在基板上形成具有多个凹槽和每个凹槽之间的台面的凹凸图案，并且可以在多个凹槽或多个凹槽中的每一个之间的台面的表面上形成反射层 的凹槽。 因此，有源层中产生的光可以被反射层反射，并被提取到外部位置。

公开(公告)号：US20140077388A1

公开(公告)日：2014-03-20

申请号：US13750289

申请日：2013-01-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hong-Pyo HEO ,  Young-soo KWON ,  Jai-kwang SHIN ,  Young-tek OH ,  Hyung-su JEONG

IPC: H01L23/498 ,  H01L21/50

CPC classification number: H01L23/49827 ,  H01L21/50 ,  H01L23/3677 ,  H01L24/05 ,  H01L24/06 ,  H01L24/32 ,  H01L24/33 ,  H01L2224/0603 ,  H01L2224/06519 ,  H01L2224/291 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32227 ,  H01L2224/32235 ,  H01L2224/3303 ,  H01L2224/33519 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/15788 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor device includes a device chip coupled to an electrode chip. The device chip includes a first device electrode on a first substrate, and the electrode chip includes a first pad electrode extending at least partially through a second substrate. The first pad electrode is electrically connected to the first device electrode and includes spaced conductive sections which serve as a heat dissipating structure to transfer heat received from the device chip and the electrode chip. A method for making a semiconductor device includes using the substrate of the electrode chip as a support during thinning the substrate of the device chip.

Abstract translation: 半导体器件包括耦合到电极芯片的器件芯片。 器件芯片包括在第一衬底上的第一器件电极，并且电极芯片包括至少部分延伸穿过第二衬底的第一焊盘电极。 第一焊盘电极电连接到第一器件电极并且包括间隔的导电部分，其用作散热结构以传递从器件芯片和电极芯片接收的热量。 制造半导体器件的方法包括在薄化器件芯片的衬底期间使用电极芯片的衬底作为支撑体。

公开(公告)号：US20140057381A1

公开(公告)日：2014-02-27

申请号：US14067185

申请日：2013-10-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyung-su JEONG ,  Young-soo PARK ,  Su-hee CHAE ,  Bok-ki MIN ,  Jun-youn KIM ,  Hyun-gi HONG ,  Young-jo TAK ,  Jae-won LEE

IPC: H01L33/00 ,  H01L33/32

CPC classification number: H01L33/0025 ,  H01L27/156 ,  H01L33/32 ,  H01L33/38 ,  H01L33/42

Abstract: Example embodiments are directed to a light-emitting device including a patterned emitting unit and a method of manufacturing the light-emitting device. The light-emitting device includes a first electrode on a top of a semiconductor layer, and a second electrode on a bottom of the semiconductor layer, wherein the semiconductor layer is a pattern array formed of a plurality of stacks. A space between the plurality of stacks is filled with an insulating layer, and the first electrode is on the insulating layer.

Abstract translation: 示例性实施例涉及包括图案化发光单元的发光器件和制造发光器件的方法。 发光器件包括在半导体层的顶部上的第一电极和在半导体层的底部上的第二电极，其中半导体层是由多个堆叠形成的图案阵列。 多个堆叠之间的空间填充有绝缘层，并且第一电极在绝缘层上。