公开(公告)号：US20140057381A1

公开(公告)日：2014-02-27

申请号：US14067185

申请日：2013-10-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyung-su JEONG ,  Young-soo PARK ,  Su-hee CHAE ,  Bok-ki MIN ,  Jun-youn KIM ,  Hyun-gi HONG ,  Young-jo TAK ,  Jae-won LEE

IPC: H01L33/00 ,  H01L33/32

CPC classification number: H01L33/0025 ,  H01L27/156 ,  H01L33/32 ,  H01L33/38 ,  H01L33/42

Abstract: Example embodiments are directed to a light-emitting device including a patterned emitting unit and a method of manufacturing the light-emitting device. The light-emitting device includes a first electrode on a top of a semiconductor layer, and a second electrode on a bottom of the semiconductor layer, wherein the semiconductor layer is a pattern array formed of a plurality of stacks. A space between the plurality of stacks is filled with an insulating layer, and the first electrode is on the insulating layer.

Abstract translation: 示例性实施例涉及包括图案化发光单元的发光器件和制造发光器件的方法。 发光器件包括在半导体层的顶部上的第一电极和在半导体层的底部上的第二电极，其中半导体层是由多个堆叠形成的图案阵列。 多个堆叠之间的空间填充有绝缘层，并且第一电极在绝缘层上。

公开(公告)号：US20140014990A1

公开(公告)日：2014-01-16

申请号：US13835921

申请日：2013-03-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jun-youn KIM ,  Jae-kyun KIM ,  Joo-sung KIM ,  Moon-seung YANG ,  Su-hee CHAE ,  Young-jo TAK ,  Hyun-gi HONG

IPC: H01L33/58

CPC classification number: H01L33/58 ,  H01L25/0753 ,  H01L33/382 ,  H01L33/62 ,  H01L2224/13 ,  H01L2933/0066

Abstract: Lights-emitting device (LED) packages, and methods of manufacturing the same, include at least one light-emitting structure. The at least one light-emitting structure includes a first compound semiconductor layer, an active layer, and a second compound semiconductor layer that are sequentially stacked, at least one first metal layer connected to the first compound semiconductor layer, a second metal layer connected to the second compound semiconductor layer, a substrate having a conductive bonding layer on a first surface of the substrate, and a bonding metal layer configured for eutectic bonding between the at least one first metal layer and the conductive bonding layer.

Abstract translation: 发光装置（LED）封装及其制造方法包括至少一个发光结构。 所述至少一个发光结构包括依次堆叠的第一化合物半导体层，有源层和第二化合物半导体层，连接到第一化合物半导体层的至少一个第一金属层，连接到第一化合物半导体层的第二金属层 所述第二化合物半导体层，在所述基板的第一表面上具有导电接合层的基板以及被配置为在所述至少一个第一金属层和所述导电接合层之间共晶接合的接合金属层。

公开(公告)号：US20150093848A1

公开(公告)日：2015-04-02

申请号：US14564928

申请日：2014-12-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Su-hee CHAE ,  Young-soo PARK ,  Bok-ki MIN ,  Jun-youn KIM ,  Hyun-gi HONG

IPC: H01L33/00 ,  H01L33/24 ,  H01L33/12

CPC classification number: H01L33/0066 ,  H01L33/0075 ,  H01L33/0079 ,  H01L33/12 ,  H01L33/22 ,  H01L33/24 ,  H01L33/382 ,  H01L33/405 ,  H01L2933/0016

Abstract: Example embodiments are directed to light-emitting devices (LEDs) and methods of manufacturing the same. The LED includes a first semiconductor layer; a second semiconductor layer; an active layer formed between the first and second semiconductor layers; and an emission pattern layer including a plurality of layers on the first semiconductor layer, the emission pattern including an emission pattern for externally emitting light generated from the active layer.

Abstract translation: 示例性实施例涉及发光器件（LED）及其制造方法。 LED包括第一半导体层; 第二半导体层; 形成在所述第一和第二半导体层之间的有源层; 以及在所述第一半导体层上包括多层的发光图案层，所述发光图案包括用于从所述有源层产生的外部发射光的发射图案。

公开(公告)号：US20140113437A1

公开(公告)日：2014-04-24

申请号：US14146233

申请日：2014-01-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jun-youn KIM ,  Su-hee CHAE ,  Hyun-gi HONG ,  Young-jo TAK

IPC: H01L21/02

CPC classification number: H01L21/02658 ,  H01L21/0237 ,  H01L21/0242 ,  H01L21/02494 ,  H01L21/0254 ,  H01L21/02639 ,  H01L21/02647 ,  H01L21/0265 ,  H01L33/0079 ,  H01L33/12 ,  H01S5/005 ,  H01S5/0207 ,  H01S5/32341

Abstract: A substrate structure and method of manufacturing the same are disclosed. The substrate structure may includes a substrate on which a plurality of protrusions are formed on one surface thereof and a plurality of buffer layers formed according to a predetermined pattern and formed spaced apart from each other on the plurality of protrusions.

Abstract translation: 公开了一种基板结构及其制造方法。 基板结构可以包括在其一个表面上形成有多个突起的基板和根据预定图案形成并且在多个突起上彼此间隔开地形成的多个缓冲层。