公开(公告)号：US20220129657A1

公开(公告)日：2022-04-28

申请号：US17500434

申请日：2021-10-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaehyun LIM ,  Younghwan PARK ,  Kwangjin LEE ,  Inho CHOI ,  Hyuntaek CHOI

IPC: G06K9/00

Abstract: A fingerprint sensor package includes a package substrate including an upper surface in which a sensing region and a peripheral region surrounding the sensing region are defined, and a lower surface facing the upper surface; a plurality of first sensing patterns located are arranged in the sensing region, are apart from each other in a first direction, and extend in a second direction crossing the first direction; a plurality of second sensing patterns that are arranged in the sensing region, are apart from each other in the second direction, and extend in the first direction; a coating member covering the sensing region; an upper ground pattern in the peripheral region and apart from the coating member to surround the coating member in the first and second directions; and a controller chip on the lower surface of the package substrate; and a plurality of capacitors.

公开(公告)号：US20200335469A1

公开(公告)日：2020-10-22

申请号：US16822300

申请日：2020-03-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yonghoon KIM ,  Jaehyun LIM ,  Yuntae LEE ,  Sayoon KANG

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/48 ,  H01L25/065

Abstract: Provided is a semiconductor package including a package structure including a base connection member including a redistribution layer, a first semiconductor chip including a plurality of first connection pads connected to the redistribution layer, an encapsulant disposed on the base connection member and covering at least a portion of the first semiconductor chip, and a backside connection member disposed on the encapsulant and including a backside wiring layer electrically connected to the redistribution layer, and a second semiconductor chip disposed on the base connection member or the backside connection member, the second semiconductor chip including a plurality of second connection pads connected to the redistribution layer or the backside wiring layer, the second semiconductor chip including a logic circuit, the first semiconductor chip including a logic input and output terminals that are connected to the logic circuit through at least one of the redistribution layer and the backside wiring layer.

公开(公告)号：US20220383948A1

公开(公告)日：2022-12-01

申请号：US17824464

申请日：2022-05-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaehyun LIM ,  Taehyung KIM ,  Sangshin HAN

IPC: G11C11/419 ,  H01L27/11 ,  H01L27/02

Abstract: A semiconductor device includes a first memory column group including a plurality of memory columns in which a plurality of bit cells are disposed; and a first peripheral column group including a plurality of peripheral columns in which a plurality of standard cells are disposed, wherein the plurality of standard cells are configured to perform an operation of reading/writing data from/to the plurality of bit cells through a plurality of bit lines, wherein the first memory column group and the first peripheral column group correspond to each other in a column direction, and wherein at least one of the plurality of peripheral columns has a cell height different from cell heights of the other peripheral columns, the cell height being measured in a row direction in which a gate line is extended.

公开(公告)号：US20170026041A1

公开(公告)日：2017-01-26

申请号：US15211459

申请日：2016-07-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangwook HAN ,  Thomas Byunghak CHO ,  Jaehyun LIM ,  Sung-Jun LEE ,  Joonhee LEE ,  Jongwon CHOI

IPC: H03K19/0175 ,  H01L27/02

CPC classification number: H03K19/017509 ,  H01L27/0248

Abstract: An integrated circuit (IC), a method of testing the IC, and a method of manufacturing the IC are provided. The IC includes analog circuitry, digital circuitry, at least one first connector, and a switching unit operatively coupled with the at least one first connector and configured to, if a first signal is received, couple the analog circuitry and the at least one first connector, and, if a second signal is received, couple the digital circuitry and the at least one first connector.

Abstract translation: 提供集成电路（IC），IC的测试方法以及IC的制造方法。 所述IC包括模拟电路，数字电路，至少一个第一连接器以及与所述至少一个第一连接器可操作耦合的开关单元，并且被配置为如果接收到第一信号则将所述模拟电路和所述至少一个第一连接器 并且如果接收到第二信号，则耦合数字电路和至少一个第一连接器。

公开(公告)号：US20240096991A1

公开(公告)日：2024-03-21

申请号：US18219232

申请日：2023-07-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaehyun LIM ,  Subin KIM ,  Jiwon OH ,  Jinho PARK ,  Joongwon JEON

IPC: H01L29/423 ,  H01L27/088 ,  H01L29/06 ,  H01L29/775

CPC classification number: H01L29/42376 ,  H01L27/088 ,  H01L27/0886 ,  H01L29/0673 ,  H01L29/42392 ,  H01L29/775

Abstract: A semiconductor device includes a substrate including first and second regions; a first active fin extending in a first direction on the first region; a second active fin extending in the first direction on the second region; an isolation pattern on the substrate between the first and second regions; a first gate structure on the first active fin, extending in a second direction perpendicular to the first direction, and onto an upper surface of the isolation pattern; and a second gate structure on the second active fin, extending in the second direction, and onto the upper surface of the isolation pattern, wherein the first gate structure includes a first portion having a first width and a second portion having a second width that is less than the first width, and the second gate structure includes a third portion having the first width and a fourth portion having the second width.

公开(公告)号：US20220293507A1

公开(公告)日：2022-09-15

申请号：US17514088

申请日：2021-10-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaehyun LIM ,  Younghwan PARK ,  Kwangjin LEE ,  Dongha LEE ,  Hyuntaek CHOI

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  G06K9/00

Abstract: A fingerprint sensor package includes a first substrate including a core insulating layer; a first bonding pad on the core insulating layer; and an external connection pad between an edge of the second surface of the core insulating layer and the first bonding pad, a second substrate on the core insulating layer, the second substrate including: a plurality of first sensing patterns spaced apart in a first direction and extending in a second direction intersecting with the first direction; a plurality of second sensing patterns spaced apart from each other in the second direction and extending in the first direction; and a second bonding pad, a conductive wire connecting the first bonding pad to the second bonding pad; a controller chip on the second substrate; and a molding layer covering the second substrate and the first bonding pad and spaced apart from the external connection pad.

公开(公告)号：US20250131230A1

公开(公告)日：2025-04-24

申请号：US18672381

申请日：2024-05-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yechung CHUNG ,  Woonbae KIM ,  Youngjun YOON ,  Soyoung LIM ,  Jaehyun LIM ,  Inho CHOI

IPC: G06K19/07 ,  G06K19/077 ,  G06V40/13

Abstract: A fingerprint sensor package carrier includes: a film member including through-holes formed in sides of the film member; and a plurality of fingerprint sensor packages arranged on the film member, wherein each of the plurality of fingerprint sensor packages includes a substrate and a controller chip disposed on the substrate, wherein the substrate of each of the plurality of fingerprint sensor packages includes a plurality of first sensing patterns and a plurality of second sensing patterns, wherein the plurality of first sensing patterns are spaced apart from each other in a first direction and extend in a second direction intersecting the first direction, and the plurality of second sensing patterns are spaced apart from each other in the second direction and extend in the first direction, and wherein the film member has adhesiveness, such that the plurality of fingerprint sensor packages are configured to be detached from the film member.

公开(公告)号：US20240243038A1

公开(公告)日：2024-07-18

申请号：US18515384

申请日：2023-11-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eojin LEE ,  Taehyung KIM ,  Hoyoung TANG ,  Jaehyun LIM

IPC: H01L23/48 ,  H01L29/06 ,  H01L29/417 ,  H01L29/423 ,  H01L29/78 ,  H10B10/00

CPC classification number: H01L23/481 ,  H01L29/0673 ,  H01L29/41733 ,  H01L29/41791 ,  H01L29/42392 ,  H01L29/7851 ,  H10B10/125

Abstract: An integrated circuit includes: a substrate including a cell area and a dummy area, wherein a plurality of cells are arranged in the cell area; a front-side wiring layer arranged over a front surface of the substrate in a vertical direction, wherein the front-side wiring layer includes a first pattern extending in a first direction across the cell area and the dummy area and a second pattern extending in a second direction intersecting the first direction and contacting the first pattern; a through via overlapping the front-side wiring layer in the vertical direction in the dummy area and passing through the substrate; and a back-side wiring layer arranged on a rear surface of the substrate, wherein the back-side wiring layer is connected through the through via and the front-side wiring layer to at least one transistor included in the plurality of cells.

公开(公告)号：US20240046692A1

公开(公告)日：2024-02-08

申请号：US18131133

申请日：2023-04-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Gwangjin LEE ,  Jaehyun LIM ,  Heeyoub KANG ,  Hyunjong MOON ,  Yun Seok CHOI ,  Inho CHOI

IPC: G06V40/13 ,  G06K19/073

CPC classification number: G06V40/1306 ,  G06K19/07354

Abstract: A fingerprint sensor package includes a first substrate having a core insulating layer with a first surface and a second surface, and a through-hole passing through the first surface and the second surface, a first bonding pad disposed on the second surface of the core insulating layer, and an external connection pad, a second substrate disposed in the through-hole of the core insulating layer and including a plurality of first sensing patterns, a plurality of second sensing patterns, and a second bonding pad, a conductive wire connecting the first bonding pad and the second bonding pad to each other, a controller chip disposed on the second substrate, and a molding layer disposed on the second surface of the core insulating layer, filling the through-hole, covering the second substrate and the first bonding pad, and spaced apart from the external connection pad.

公开(公告)号：US20230177300A1

公开(公告)日：2023-06-08

申请号：US17863688

申请日：2022-07-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gwangjin LEE ,  Jaehyun LIM ,  Hyunjong MOON

IPC: G06K19/07 ,  G06V40/13

CPC classification number: G06K19/0718 ,  G06V40/13

Abstract: Provided is a fingerprint sensor package including a first substrate including first bonding pads and an external connection pad, a second substrate attached to the first substrate, the second substrate including a plurality of first sensing patterns spaced apart from each other in a first direction and extending in a second direction intersecting the first direction, a plurality of second sensing patterns spaced apart from each other in the second direction and extending in the first direction, second bonding pads, and test pads, conductive wires electrically connecting the first bonding pads and the second bonding pads, a controller chip connected to the second substrate, and a molding layer covering the controller chip and the second substrate and in contact with the first bonding pads, the second bonding pads, the test pads, and the conductive wires.