公开(公告)号：US20180158492A1

公开(公告)日：2018-06-07

申请号：US15626574

申请日：2017-06-19

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Sangsu LEE ,  Yusuf CINAR ,  Nam-Hoon KIM ,  Heeyoub KANG ,  Young-Rok OH

IPC分类号： G11C7/04 ,  G11C11/406 ,  G11C13/00 ,  G11C16/10 ,  G11C16/34 ,  G11C11/16

CPC分类号： G11C7/04 ,  G06F13/00 ,  G11C7/1045 ,  G11C11/1673 ,  G11C11/1695 ,  G11C11/40626 ,  G11C13/0069 ,  G11C16/10 ,  G11C16/34 ,  G11C16/3418

摘要： A storage device includes memories and a controller. The controller controls first and second program operations on the memory. When a temperature of the memory is lower than a reference value, the controller controls execution of the first program operation. When the temperature of the memory is equal to or higher than the reference value, the controller controls execution of the second program operation which consumes a smaller amount of power than the first program operation. The controller adjusts an operational condition of the memory such that bandwidth on the memory remains equivalent during the first and second program operations.

公开(公告)号：US20140117528A1

公开(公告)日：2014-05-01

申请号：US14066008

申请日：2013-10-29

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Jaebum BYUN ,  Heeyoub KANG ,  Dongok KWAK ,  Junghoon KIM ,  Joonyoung OH ,  Won-Hwa LEE ,  Jae-Woo JEONG ,  Jinyoung CHOI

IPC分类号： H01L23/367

CPC分类号： H01L23/3675 ,  H01L23/367 ,  H01L23/38 ,  H01L23/42 ,  H01L23/552 ,  H01L24/06 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/06181 ,  H01L2224/06183 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73253

摘要： A semiconductor module may include a heat-transferring part connecting at least one of a control device, a buffer semiconductor device, and a memory device to a connector. The heat-transferring part may be configured to have a thermal conductivity higher than the substrate. Accordingly, during the operation of the semiconductor module, the connector can have a temperature lower than the devices.

摘要翻译： 半导体模块可以包括将控制装置，缓冲半导体装置和存储装置中的至少一个连接到连接器的传热部。 传热部件可以被配置为具有比基板高的导热性。 因此，在半导体模块的操作期间，连接器可以具有比器件低的温度。

公开(公告)号：US20170052551A1

公开(公告)日：2017-02-23

申请号：US15098427

申请日：2016-04-14

申请人： Samsung Electronics Co., Ltd.

发明人： Kwangkyu BANG ,  Heeyoub KANG ,  HyoJae BANG ,  Kitaek LEE

IPC分类号： G05D23/19 ,  G05B15/02 ,  G06F3/06

CPC分类号： G05B15/02 ,  G06F1/206 ,  G06F3/0616 ,  G06F3/0659 ,  G06F3/0673

摘要： A storage device may include a nonvolatile memory including a plurality of memory blocks and a memory controller configured to determine a comparison between an idle current value of the nonvolatile memory and a reference current value and to adjust, based on the comparison, a start temperature at which the storage device begins operating speed control of the storage device.

摘要翻译： 存储装置可以包括包括多个存储器块的非易失性存储器和被配置为确定非易失性存储器的空闲电流值与参考电流值之间的比较的存储器控​​制器，并且基于比较来调整开关温度 存储设备开始对存储设备进行速度控制。

公开(公告)号：US20170048970A1

公开(公告)日：2017-02-16

申请号：US15093111

申请日：2016-04-07

申请人： Samsung Electronics Co., Ltd.

发明人： Iksung Park ,  Heeyoub KANG ,  Young-Min KIM ,  Eunji YOU ,  Hwi-jong YOO

IPC分类号： H05K1/02 ,  H01L25/18 ,  G11C5/00 ,  H01L23/60 ,  G11C5/02 ,  H01L25/065 ,  H01L23/538

CPC分类号： H05K1/0259 ,  G11C5/005 ,  G11C5/025 ,  G11C5/04 ,  H01L23/5386 ,  H01L23/60 ,  H01L25/0655 ,  H01L25/18 ,  H05K1/0268 ,  H05K3/0052 ,  H05K2201/10159

摘要： Disclosed is a printed circuit hoard. The printed circuit board includes a plurality of insulation layers and a plurality of pattern layers alternately stacked, The printed circuit board includes a plurality of device areas on which semiconductor packages are mounted and a peripheral area adjacent the device areas. An electrostatic discharge pattern is in a respective pattern layer among the plurality of pattern layers and is disposed at a boundary region between a respective device area of the plurality of device areas and the peripheral area.

摘要翻译： 公开了印刷电路板。 印刷电路板包括交替堆叠的多个绝缘层和多个图案层。印刷电路板包括多个装配区域，半导体封装件安装在该区域上以及与该区域相邻的外围区域。 静电放电图案位于多个图案层中的各图案层中，并且设置在多个器件区域的各个器件区域与周边区域之间的边界区域。