公开(公告)号：US20240395747A1

公开(公告)日：2024-11-28

申请号：US18638757

申请日：2024-04-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaekul Lee ,  Hyungsun Jang ,  Sanguk Han ,  Taehun Kim

IPC: H01L23/00

Abstract: A semiconductor package may include a semiconductor chip having a first surface and a second surface opposite to the first surface and having a plurality of circuit patterns provided in the second surface, a redistribution wiring layer on the second surface of the semiconductor chip and having a plurality of redistribution wirings and a plurality of bonding pads, the redistribution wirings being electrically connected to the circuit patterns, the bonding pads electrically connected to the redistribution wirings and exposed from a lower surface, a plurality of conductive bumps on the plurality of bonding pads, respectively, and a plurality of spacers on the lower surface of the redistribution wiring layer and configured to align the plurality of conductive bumps through respective through holes of a test socket and to space the redistribution wiring layer from the test socket.

公开(公告)号：US11670568B2

公开(公告)日：2023-06-06

申请号：US17029334

申请日：2020-09-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seonho Lee ,  Jinsu Kim ,  Junwoo Myung ,  Yongjin Park ,  Jaekul Lee

IPC: H01L23/373 ,  H01L23/498 ,  H01L23/053 ,  H01L23/31

CPC classification number: H01L23/3735 ,  H01L23/053 ,  H01L23/3128 ,  H01L23/49822

Abstract: A semiconductor device including a semiconductor chip having a first surface and a second surface opposite to the first surface, a first heat dissipation member on the second surface of the semiconductor chip, the first heat dissipation member having a vertical thermal conductivity in a direction perpendicular to the second surface, and a horizontal thermal conductivity in a direction parallel to the second surface, the first vertical thermal conductivity being smaller than the first horizontal thermal conductivity, and a second heat dissipation member comprising a vertical pattern penetrating the first heat dissipation member, the second heat dissipation member having a vertical thermal conductivity that is greater than the vertical thermal conductivity of the first heat dissipation member may be provided.

公开(公告)号：US20240142493A1

公开(公告)日：2024-05-02

申请号：US18497401

申请日：2023-10-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sanguk Han ,  Jaekul Lee ,  Hyungsun Jang ,  Taehun Kim

IPC: G01R1/04 ,  G01R31/28 ,  H01L23/00

CPC classification number: G01R1/0466 ,  G01R31/2863 ,  H01L24/13 ,  H01L24/29 ,  H01L2224/13006 ,  H01L2224/29022

Abstract: A socket for testing a semiconductor package includes a body having an internal space configured to accommodate a semiconductor package; and at least a first spacer on the body and positioned to contact a first surface of the semiconductor package when the semiconductor package is placed on the body. The body includes a lower socket portion provided with through-holes, configured through which to receive meter reading pins that contact external connection terminals of the semiconductor package, and an upper socket portion disposed above the lower socket portion, and the first spacer is disposed on a surface of the lower socket portion that faces the first surface of the semiconductor package when the semiconductor package is placed on the body.

公开(公告)号：US11088060B2

公开(公告)日：2021-08-10

申请号：US16675877

申请日：2019-11-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaekul Lee ,  Jinseon Park ,  Junwoo Myung

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/522 ,  H01L23/00 ,  H01L21/04 ,  H01L29/66 ,  H01L29/78 ,  H01L29/16

Abstract: A package module includes a core structure including a dummy member, one or more electronic components disposed around the dummy member, and an insulating material covering at least a portion of each of the dummy member and the electronic components, the core structure including a first penetration hole passing through the dummy member and the insulating material, a semiconductor chip disposed in the first penetration hole and having an active surface on which a connection pad is disposed and an inactive surface, an encapsulant covering at least a portion of each of the core structure and the semiconductor chip and filling at least a portion of the first penetration hole, and a connection structure disposed on the core structure and the active surface and including a redistribution layer electrically connected to the electronic components and the connection pad.

公开(公告)号：US20210375757A1

公开(公告)日：2021-12-02

申请号：US17403233

申请日：2021-08-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Bongju Cho ,  Myungsam Kang ,  Yonggwan Ko ,  Gun Lee ,  Jaekul Lee

IPC: H01L23/522 ,  H01L23/31 ,  H01L23/495 ,  H01L23/528 ,  H01L23/00

Abstract: A fan-out semiconductor package includes a first connection structure having first and second surfaces, a first semiconductor chip disposed on the first surface, a first encapsulant disposed on the first surface and covering at least a portion of the first semiconductor chip, a second semiconductor chip disposed on the second surface, one or more first metal members disposed on the second surface, one or more second metal members disposed on the second surface, a second encapsulant disposed on the second surface and respectively covering at least portions of the second semiconductor chip and the first and second metal members, and a second connection structure disposed on an opposite side of a side of the second encapsulant, on which the first connection structure is disposed.

公开(公告)号：US11121079B2

公开(公告)日：2021-09-14

申请号：US16588269

申请日：2019-09-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Bongju Cho ,  Myungsam Kang ,  Younggwan Ko ,  Gun Lee ,  Jaekul Lee

IPC: H01L23/522 ,  H01L23/31 ,  H01L23/495 ,  H01L23/528 ,  H01L23/00

Abstract: A fan-out semiconductor package includes a first connection structure having first and second surfaces, a first semiconductor chip disposed on the first surface, a first encapsulant disposed on the first surface and covering at least a portion of the first semiconductor chip, a second semiconductor chip disposed on the second surface, one or more first metal members disposed on the second surface, one or more second metal members disposed on the second surface, a second encapsulant disposed on the second surface and respectively covering at least portions of the second semiconductor chip and the first and second metal members, and a second connection structure disposed on an opposite side of a side of the second encapsulant, on which the first connection structure is disposed.

公开(公告)号：US20200161237A1

公开(公告)日：2020-05-21

申请号：US16588269

申请日：2019-09-30

Applicant: SAMSUNG ELECTRONICS CO., LTD

Inventor： Bongju Cho ,  Myungsam Kang ,  Younggwan Ko ,  Gun Lee ,  Jaekul Lee

IPC: H01L23/522 ,  H01L23/31 ,  H01L23/495 ,  H01L23/00 ,  H01L23/528

Abstract: A fan-out semiconductor package includes a first connection structure having first and second surfaces, a first semiconductor chip disposed on the first surface, a first encapsulant disposed on the first surface and covering at least a portion of the first semiconductor chip, a second semiconductor chip disposed on the second surface, one or more first metal members disposed on the second surface, one or more second metal members disposed on the second surface, a second encapsulant disposed on the second surface and respectively covering at least portions of the second semiconductor chip and the first and second metal members, and a second connection structure disposed on an opposite side of a side of the second encapsulant, on which the first connection structure is disposed.

公开(公告)号：US12154840B2

公开(公告)日：2024-11-26

申请号：US18310284

申请日：2023-05-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seonho Lee ,  Jinsu Kim ,  Junwoo Myung ,  Yongjin Park ,  Jaekul Lee

IPC: H01L23/373 ,  H01L23/053 ,  H01L23/31 ,  H01L23/498

Abstract: A semiconductor device including a semiconductor chip having a first surface and a second surface opposite to the first surface, a first heat dissipation member on the second surface of the semiconductor chip, the first heat dissipation member having a vertical thermal conductivity in a direction perpendicular to the second surface, and a horizontal thermal conductivity in a direction parallel to the second surface, the first vertical thermal conductivity being smaller than the first horizontal thermal conductivity, and a second heat dissipation member comprising a vertical pattern penetrating the first heat dissipation member, the second heat dissipation member having a vertical thermal conductivity that is greater than the vertical thermal conductivity of the first heat dissipation member may be provided.

公开(公告)号：US11967578B2

公开(公告)日：2024-04-23

申请号：US17479042

申请日：2021-09-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaekul Lee ,  Hyungsun Jang ,  Gayoung Kim ,  Minjeong Shin

IPC: H01L23/48 ,  H01L23/00 ,  H01L25/10

CPC classification number: H01L24/20 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/2101 ,  H01L2224/2105 ,  H01L2224/221 ,  H01L2224/73101 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058

Abstract: A semiconductor package includes a lower redistribution layer disposed on a lower surface of the semiconductor chip including an insulating laver, a redistribution pattern, a via, an under bump metal (UBM), and a post disposed on the redistribution pattern. The post vertically overlaps with the UBM. A mold layer is on the lower redistribution layer and surrounds the semiconductor chip. A connecting terminal is connected to the UBM. The UBM includes a first section contacting the redistribution pattern, and a second section contacting the insulating layer. The lost has a ring shape having an inner surface and an outer surface when viewed a top view. A maximum width of the inner surface is less than a Maximum width of an upper surface of the first section. A maximum width of the outer surface is greater than the maximum width of the upper surface of the first section.

公开(公告)号：US11837537B2

公开(公告)日：2023-12-05

申请号：US17403233

申请日：2021-08-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Bongju Cho ,  Myungsam Kang ,  Younggwan Ko ,  Gun Lee ,  Jaekul Lee

IPC: H01L23/522 ,  H01L23/31 ,  H01L23/495 ,  H01L23/528 ,  H01L23/00

CPC classification number: H01L23/5226 ,  H01L23/3157 ,  H01L23/49531 ,  H01L23/49534 ,  H01L23/5283 ,  H01L24/09 ,  H01L2224/02372 ,  H01L2224/02377 ,  H01L2224/02379 ,  H01L2924/3511

Abstract: A fan-out semiconductor package includes a first connection structure having first and second surfaces, a first semiconductor chip disposed on the first surface, a first encapsulant disposed on the first surface and covering at least a portion of the first semiconductor chip, a second semiconductor chip disposed on the second surface, one or more first metal members disposed on the second surface, one or more second metal members disposed on the second surface, a second encapsulant disposed on the second surface and respectively covering at least portions of the second semiconductor chip and the first and second metal members, and a second connection structure disposed on an opposite side of a side of the second encapsulant, on which the first connection structure is disposed.