公开(公告)号：US20240279003A1

公开(公告)日：2024-08-22

申请号：US18371707

申请日：2023-09-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyun Joo JEON ,  Jin Hyuk CHOI ,  Kyu Sang LEE ,  Myung Ki SONG ,  Ji Ho UH ,  Kong Woo LEE ,  Hyun Soo CHUN ,  Beom Soo HWANG

IPC: B65G47/90

CPC classification number: B65G47/90

Abstract: A wafer transfer apparatus includes a plate, a first belt unit on a first surface of the plate and including a first linear motion (LM) guide movable up and down, a second belt unit on the first surface of the plate and including a second LM guide movable up and down, a robot between the first belt unit and the second belt unit connected to the first LM guide and the second LM guide, and configured to transfer a wafer in a vertical direction, and a buffer unit between the first belt unit and the second belt unit in a first direction and disposed between the plate and the robot in a second direction perpendicular to the first direction, wherein the buffer unit includes a plurality of centrifugal fans configured to discharge fluid from an inner space of the buffer unit to an outside of the buffer unit.

公开(公告)号：US20160187938A1

公开(公告)日：2016-06-30

申请号：US14939427

申请日：2015-11-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwang Soo HAN ,  Chung Keun YOO ,  Jin Hyuk CHOI ,  Byoung Soo LEE ,  Jae Woo LEE ,  Ji Hoon PARK

IPC: G06F1/16

CPC classification number: G06F1/1684 ,  G06F1/1615 ,  H04M1/0216

Abstract: An electronic device capable of maintaining an angle between two display units at a certain angle, without any hinge structure is provided. The electronic device includes a display unit including a first display unit and a functional unit spaced apart from each other, the functional unit being equipped with an electronic component, a cover unit including a first cover part and a second cover part, to which the first display unit and the functional unit are respectively attached, and a connection unit including a shape-preserving member, which is configured to allow the display unit and the functional unit to be maintained at a certain angle, when an angle between the first cover part and the second cover part is changed by an external force.

Abstract translation: 提供能够以一定角度保持两个显示单元之间的角度而不具有任何铰链结构的电子设备。 所述电子设备包括显示单元，所述显示单元包括第一显示单元和彼此间隔开的功能单元，所述功能单元配备有电子元件，盖单元包括第一盖部和第二盖部， 分别安装有显示单元和功能单元;以及连接单元，其包括形状保持构件，其被配置为允许显示单元和功能单元保持在一定角度，当第一盖部分和 第二盖部分被外力改变。

公开(公告)号：US20150253819A1

公开(公告)日：2015-09-10

申请号：US14605326

申请日：2015-01-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin Hyuk CHOI ,  Jee Young JUNG ,  Seung Soo HAN ,  Young Bae JI

IPC: G06F1/18

CPC classification number: G06F1/182 ,  G06F1/1656 ,  G06F1/1684 ,  G06F1/1688 ,  H04R1/44

Abstract: An electronic device is provided. The electronic device includes a housing having a base plate and a sidewall, the sidewall having a shape bent and extended from an end of the base plate, a duct in the base plate that is parallel to a surface of the base plate and having an external end open to the sidewall of the housing, an electronic part placed on an internal surface of the base plate to cover at least a portion of the duct, and a waterproof sheet disposed between the duct and the electronic part to protect the electronic part.

Abstract translation: 提供电子设备。 电子设备包括具有基板和侧壁的壳体，该侧壁具有从基板的端部弯曲并延伸的形状，基板中的与基板的表面平行的管道， 端部朝向壳体的侧壁开口，设置在基板的内表面上以覆盖管道的至少一部分的电子部件，以及设置在管道和电子部件之间以防止电子部件的防水片材。

公开(公告)号：US20130126094A1

公开(公告)日：2013-05-23

申请号：US13684272

申请日：2012-11-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Tae Ki HONG ,  Jin Hyuk CHOI ,  Sang Chul HAN

IPC: B05C9/00

CPC classification number: B05C9/00 ,  H01J37/32238 ,  H01J37/32651

Abstract: Disclosed is a substrate processing apparatus with an improved structure to reduce impurities in a chamber being attached to a substrate during processing of the substrate. The substrate processing apparatus generates plasma to process a substrate and includes a sidewall configured to receive the substrate on a receiving portion surrounded by the sidewall and a dielectric coupled to an upper part of the sidewall configured to hermetically seal the receiving portion, wherein the dielectric includes a shielding portion protruding from a bottom of the dielectric opposite the substrate to an inside of the receiving portion and a curved portion in a region at which the bottom and the shielding portion are connected to each other.

Abstract translation: 公开了一种基板处理装置，其具有改进的结构，以减少在处理基板期间附着到基板的室中的杂质。 衬底处理装置产生等离子体以处理衬底并且包括被配置为在由侧壁包围的接收部分上接收衬底的侧壁和耦合到被配置为密封接收部分的侧壁的上部的电介质，其中电介质包括 从与所述基板相对的所述电介质的底部突出到所述接收部的内侧的屏蔽部和在所述底部和所述屏蔽部彼此连接的区域中的弯曲部。

公开(公告)号：US20240120224A1

公开(公告)日：2024-04-11

申请号：US18465533

申请日：2023-09-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin Hyuk CHOI ,  Beom Soo HWANG ,  Kong Woo LEE ,  Myung Ki SONG ,  Ja-Yul KIM ,  Kyu Sang LEE ,  Hyun Joo JEON ,  Nam Young CHO

IPC: H01L21/673 ,  H01L21/67 ,  H01L21/677 ,  H01L21/68

CPC classification number: H01L21/67386 ,  H01L21/67259 ,  H01L21/67294 ,  H01L21/67742 ,  H01L21/68 ,  H01L21/6833

Abstract: A semiconductor manufacturing equipment may include a process chamber for treating a substrate; a front-end module including a first transfer robot, wherein the first transfer robot may be configured to transport the substrate received in a container; a transfer chamber between the front-end module and the process chamber, wherein the transfer chamber may be configured to load or unload the substrate into or out of the process chamber; and a cassette capable of receiving a replaceable component capable of being used in the process chamber. The front-end module may include a seat plate configured to move in a sliding manner so as to retract or extend into or from the front-end module. The cassette may be configured to be loaded into the front-end module while the cassette is seated on the seat plate.

公开(公告)号：US20170338232A1

公开(公告)日：2017-11-23

申请号：US15432697

申请日：2017-02-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang Chul HAN ,  Do Hyung KIM ,  Tae ki HONG ,  Jin Hyuk CHOI ,  Moon Hyeong HAN

IPC: H01L27/108 ,  H01L21/67 ,  H01L21/3215 ,  H01L21/02 ,  H01L21/311 ,  H01L21/285 ,  H01L49/02 ,  H01L21/324

CPC classification number: H01L27/10852 ,  C23C16/24 ,  H01L21/02274 ,  H01L21/02532 ,  H01L21/0257 ,  H01L21/28556 ,  H01L21/76877 ,  H01L27/10814 ,  H01L28/90 ,  H01L28/91

Abstract: A method of fabricating semiconductor device is provided. The method includes providing a substrate having a trench, plasma-ionizing a gas which comprises a deposition material precursor and a doping material precursor to respectively obtain a plasma-ionized deposition material and a plasma-ionized doping material, and depositing the plasma-ionized deposition material and the plasma-ionized doping material in the trench by applying a bias voltage to a bottom surface of the trench, wherein the bottom surface of the trench comprises a first material, and sidewalls of the trench comprise a second material different from the first material.