Abstract:
A semiconductor device includes a first well in a substrate, a gate structure on the first well, a second well below the gate structure in the first well, a third well in a first side of the gate structure and in the first well to be adjacent to the second well, the third well having a conductivity type different from that of the second well, a fourth well overlapped with the third well, a fifth well in a second side of the gate structure and in the second well, a sixth well below the gate structure and in the second well, the sixth well being adjacent to the fifth well and having an impurity concentration higher than the impurity concentration of the second well, and a first device isolation layer overlapped with the second well and disposed farther away from the gate structure than the fifth well.
Abstract:
A semiconductor device has reduced ON resistance (Ron) as well as a reduced electric field emanating from a current path. The semiconductor device includes a fin pattern, a gate electrode intersecting the fin pattern, a source region which has a first conductivity type and is disposed on one side of the gate electrode, a body region which has a second conductivity type, is situated within the fin pattern under the source region, and extends in a loop around the source region, a drain region which has the first conductivity type and is disposed on the other side of the gate electrode, a field dispersion region which has the second conductivity type and is situated within the fin pattern between the gate electrode and the drain region, and a drift region which has the first conductivity type, is situated within the fin pattern under the drain region and the field dispersion region, and extends in a loop around the drain region and the field dispersion region.
Abstract:
Semiconductor devices include a channel layer on a substrate, the channel layer including a material having a lattice constant different from a lattice constant of the substrate, a first gate electrode on the channel layer, a first source region of a first conductivity type at a first side of the first gate electrode, a first body region of a second conductivity type under the first source region and contacting the first source region, a first drain region of the first conductivity type disposed at a second side of the first gate electrode, a first drift region of the first conductivity type under the first drain region and contacting the first drain region, and a first stud region in the channel layer and the first drift region. The first stud region has an impurity concentration higher than an impurity concentration of the first drift region.
Abstract:
An electrostatic discharge (ESD) protection device includes a substrate including a plurality of fins extending in a first direction, with an insulation layer on the fins. A gate electrode extending in a second direction, an electrode pattern of a capacitor, and a resistor are on the insulation layer. A drain is on a first side of the gate electrode, and a source is on a second side of the gate electrode. A connection structure electrically connects the electrode pattern, the gate electrode and the resistor. The electrode pattern is on the first side or the second side of the gate electrode, and the resistor is on the other of the first side or the second side. At least a portion of the resistor extends in the second direction.
Abstract:
In a method, a dummy gate layer structure and a mask layer are formed on a substrate. The mask layer is patterned to form masks. Spacers are formed on sidewalls of the mask. A dummy gate mask is formed between the spacers. The dummy gate layer structure is patterned using the dummy gate mask to form dummy gate structures. The dummy gate structure is replaced with a gate structure. When the mask is formed, an initial layout of masks extending in a first direction is designed. An offset bias in a second direction is provided for a specific region of the initial layout to design a final layout having a width in the second direction varying along the first direction. The mask layer is patterned according to the final layout to form the masks having a width varying along the first direction.
Abstract:
An electrostatic discharge (ESD) protection device includes a substrate including a plurality of active fins and a plurality of grooves. The ESD protection device includes an insulation layer on the active fins and the grooves, and a gate electrode on the active fins. The ESD protection device includes a first impurity region adjacent to a first side of the gate electrode, and a second impurity region adjacent to a second side of the gate electrode. The second side of the gate electrode may be arranged opposite to the first side. The ESD protection device includes an electrode pattern of a capacitor overlapping the first impurity region, a resistor overlapping the second impurity region, and a connection structure electrically connecting the electrode pattern, the gate electrode, and the resistor to each other.
Abstract:
A transistor and a semiconductor device, the semiconductor device including an active region; a gate electrode on the active region; and a gate dielectric between the gate electrode and the active region, wherein the active region includes a first part overlapped by the gate electrode, and second and third parts facing each other with the first part therebetween, the first part of the active region includes a first portion having a first width and a second portion having a second width, the second width being greater than the first width, and the second portion of the active region is closer to the second part of the active region than to the third part of the active region.
Abstract:
A three-dimensional optoelectrical simulation includes generating a process simulation result including a doping profile of a silicon substrate of image sensor, a structure simulation result with respect to a back end of line structure, and a merged result generated by merging a process simulation result and a structure simulation result, selectively extending the merged result to an extended result by using a process simulation result or a structure simulation result, generating a segmented result for each pixel based on a merged result or an extended result, an optical crosstalk simulation result of image sensor based on a structure simulation result and an optical mesh, and a final simulation result including an electrical crosstalk simulation result of the image sensor based on a segmented result for each pixel and an optical crosstalk simulation result.