公开(公告)号：US20170092663A1

公开(公告)日：2017-03-30

申请号：US15375885

申请日：2016-12-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ye-chung CHUNG ,  Hee-seok LEE ,  Yun-seok CHOI ,  Keung-beum KIM

IPC: H01L27/12 ,  H05K1/14 ,  H01L23/00 ,  G09G3/20 ,  H01L25/10

CPC classification number: H01L27/1244 ,  G02F1/13452 ,  G09G3/20 ,  G09G2300/0426 ,  G09G2310/08 ,  G09G2330/021 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/13124 ,  H01L2224/13639 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2924/1426 ,  H05K1/148

Abstract: According to example embodiments, an image display panel assembly includes a flexible printed circuit (FPC), an image display panel, at least one gate driver integrated circuit (IC) package, and at least one source driver IC package. The FPC is configured to receive gate and source driving signals. The image display panel is electrically connected to the FPC, and includes a gate driving signal transfer pattern along a first edge of the image display panel, a source driving signal transfer pattern along a second edge adjacent to the first end, and a plurality of pixels. The at least one gate driver integrated circuit (IC) package is configured to receive the gate driving signal through the gate driving signal transfer pattern and configured to provide the gate driving signal to gate lines of the plurality of pixels. The at least one source driver IC package is configured to receive the source driving signal through the source driving signal transfer pattern and configured to provide the source driving signal to source lines of the plurality of pixels.

公开(公告)号：US20160300806A1

公开(公告)日：2016-10-13

申请号：US14978550

申请日：2015-12-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong-hoon KIM ,  Keung-beum KIM

IPC: H01L23/00

CPC classification number: H01L23/291 ,  H01L23/145 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3157 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/50 ,  H01L23/5389 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/19 ,  H01L24/20 ,  H01L24/73 ,  H01L2224/02379 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/73259 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/014

Abstract: Provided is a semiconductor package including a semiconductor chip having one surface on which chip pads are formed, and a redistribution structure formed on the one surface of the semiconductor chip. The redistribution structure includes a redistribution layer connected to the chip pads and a redistribution insulating layer interposed between the semiconductor chip and the redistribution layer. The redistribution insulating layer includes a first insulating portion having a first dielectric constant and a second insulating portion having a second dielectric constant that is different from the first dielectric constant. The first insulating portion and the second insulating portion are connected to each other in a horizontal direction.

Abstract translation: 提供了一种半导体封装，其包括其上形成有芯片焊盘的一个表面的半导体芯片和形成在半导体芯片的一个表面上的再分布结构。 再分配结构包括连接到芯片焊盘的再分配层和插入在半导体芯片和再分布层之间的再分布绝缘层。 再分布绝缘层包括具有第一介电常数的第一绝缘部分和具有不同于第一介电常数的第二介电常数的第二绝缘部分。 第一绝缘部分和第二绝缘部分在水平方向上彼此连接。