公开(公告)号：US20200329315A1

公开(公告)日：2020-10-15

申请号：US16759775

申请日：2018-10-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hee Jun RYU ,  Ki Won KIM ,  Sang Hoon KIM ,  Sang Woo BAE ,  Yeo Jin KIM ,  Chang Tae KIM ,  Sung Bin HONG

IPC: H04R9/06 ,  H04R29/00 ,  H04M1/03 ,  H03F1/52 ,  H04R9/02 ,  H04R3/00

Abstract: An electronic device according to an embodiment may comprise: a speaker, an amplifier connected to the speaker through a first electrical path; and at least one processor electrically connected to the amplifier, wherein the at least one processor is configured to: provide a first audio signal set to a first volume level to the speaker via the amplifier; when the first volume level is less than a predetermined first value, output the first audio signal at the first volume level through the speaker; and when the first volume level is equal to or greater than the first value, control a volume level of the first audio signal on the basis of a temperature value of the speaker, which is estimated from the first audio signal.

公开(公告)号：US20240234177A1

公开(公告)日：2024-07-11

申请号：US18495224

申请日：2023-10-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hun Yong PARK ,  Yeon Tae KIM ,  Jang Hwi LEE ,  Sang Woo BAE ,  Kyung Su KIM ,  Tae Soon PARK ,  Jung Chul LEE ,  Sung Ho JANG ,  Won Don JOO

IPC: H01L21/67 ,  C23C16/44 ,  C23C16/452 ,  H01L21/02

CPC classification number: H01L21/67115 ,  C23C16/4412 ,  C23C16/452 ,  H01L21/0228

Abstract: A wafer processing apparatus may include a chamber providing an internal space; and a first rib on an outer side of a first sidewall of the chamber. An outer side of the first rib may include a first portion and a second portion. A light transmittance of the first portion may be different from a light transmittance of the second portion.

公开(公告)号：US20230102791A1

公开(公告)日：2023-03-30

申请号：US17740494

申请日：2022-05-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung Ho JANG ,  Min Hwan SEO ,  Jang Hwi LEE ,  Young Chul KWON ,  Sang Woo BAE ,  Akinori OKUBO ,  Jung Chul LEE ,  Won Don JOO

IPC: B23K26/53 ,  B23K26/38 ,  B23K26/03

Abstract: A method for dicing a substrate includes setting a target height for forming a first reforming region inside a target substrate, the target height being a distance from an upper surface of the target substrate to the first reforming region; irradiating a laser beam to a first sample substrate including a first film and a second film being in contact with the first film, and setting a target condition on the basis of a sample condition that results in forming a condensing point of the laser beam on an upper surface of the first film being in contact with the second film; and irradiating the target substrate with the laser beam according to the target condition to form the first reforming region inside the target substrate, wherein a thickness of the second film is the target height.

公开(公告)号：US20180164687A1

公开(公告)日：2018-06-14

申请号：US15809293

申请日：2017-11-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Tae-Hyun KIM ,  Sang Woo BAE ,  Sang Don JANG

IPC: G03F7/20 ,  G02B3/00

CPC classification number: G03F7/70825 ,  G02B3/0006 ,  G02B3/0056 ,  G03F7/2051 ,  G03F7/2057 ,  G03F7/70 ,  G03F7/70141 ,  G03F7/70258 ,  G03F7/70316

Abstract: A position adjusting unit according to some example embodiments includes a base; a mounting part, a driving unit, and a locking part on the base. The mounting part may be movably installed on the base and configured to have an optical element mounted thereto. The driving unit may include a plurality of actuators connected between the base and the mounting part. The driving unit may be configured to move the mounting part with respect to the base. The locking part may be configured to provide a fixing force for fixing a position of the mounting part. The locking part may be configured to release the fixing force when electricity is supplied to the locking part.

公开(公告)号：US20250076204A1

公开(公告)日：2025-03-06

申请号：US18623629

申请日：2024-04-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Min Hwan SEO ,  Junsuk RHO ,  Sang Woo BAE ,  Trevon James BADLOE ,  Yeseul KIM ,  Inki KIM ,  Joohoon KIM

IPC: G01N21/88 ,  G01N21/21

Abstract: An imaging system that includes a first polarization structure that polarizes light provided from a light source into first polarized light, a first power supply connected to the first polarization structure and that applies a first voltage to the first polarization structure, a meta-lens on which the first polarized light is incident, a second polarization structure that converts the first polarized light that passes through the meta-lens into second polarized light, a second power supply connected to the second polarization structure and that applies a second voltage to the second polarization structure, and an image sensor that senses the second polarized light. The first voltage and the second voltage are different from each other.

公开(公告)号：US20240120194A1

公开(公告)日：2024-04-11

申请号：US18377500

申请日：2023-10-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang Min LEE ,  Sang Woo BAE ,  Sung-Wook JUNG

IPC: H01L21/02 ,  G02B27/14 ,  G02B27/28 ,  H01L21/687

CPC classification number: H01L21/02266 ,  G02B27/145 ,  G02B27/283 ,  H01L21/68714

Abstract: A wafer processing system includes an optical apparatus including a beam splitter configured to receive a laser beam and to split the laser beam into a first beam in a first state of linear polarization and a second beam in a second state of linear polarization; and a beam delayer configured to delay the second beam so that a pulse of the second beam has a delay time with respect to a pulse of the first beam.