SEMICONDUCTOR MEMORY DEVICE AND METHOD OF OPERATING THE SAME

    公开(公告)号:US20230289072A1

    公开(公告)日:2023-09-14

    申请号:US18045590

    申请日:2022-10-11

    CPC classification number: G06F3/0625 G06F3/0673 G06F3/0629 G06F3/064

    Abstract: A semiconductor memory device includes a memory cell array, a row decoder and a timing/voltage control circuit. The memory cell array is divided into a plurality of row blocks by one or more row block identity bits, and each of the of row blocks includes sub-array blocks arranged in a first direction. A row address includes the one or more row block identity bits. The row decoder activates a first word-line coupled to a first memory cell, activates a second word-line coupled to a second memory cell in response to the row address, and outputs a row block information signal. The timing/voltage control circuit adjusts at least one of an operation interval and an operation voltage of a memory operation on the first memory cell and the second memory cell according to a distance in a second direction crossing the first direction from a reference position, based on the row block information signal.

    MEMORY DEVICE AND A METHOD OF OPERATING THE SAME DEVICE

    公开(公告)号:US20250123920A1

    公开(公告)日:2025-04-17

    申请号:US18764870

    申请日:2024-07-05

    Abstract: A memory device and a method of operating the memory device are provided. The memory device includes a memory cell array including a plurality of memory cells to store data, an error correction code (ECC) circuit, and an error check and scrub (ECS) circuit. The ECC circuit reads the data from the memory cell array and corrects errors in the data. The ECS circuit performs a scrubbing operation on the memory cell array and transmits a signal for an error address detected based on the scrubbing operation to an external circuit and stores the error address which was transmitted.

    SEMICONDUCTOR MEMORY DEVICES AND MEMORY SYSTEMS INCLUDING THE SAME

    公开(公告)号:US20240029808A1

    公开(公告)日:2024-01-25

    申请号:US18174186

    申请日:2023-02-24

    CPC classification number: G11C29/42 G11C29/46 G11C29/1201

    Abstract: A semiconductor memory device includes a memory cell array, an on-die error correction code (ECC) engine and a control logic circuit. The on-die ECC engine includes a first latch and a second latch. The control logic circuit sets the semiconductor memory device to a test mode in response to a first mode register set command. The on-die ECC engine, in the test mode, cuts off a connection with the memory cell array, receives a test data, stores the test data in the first latch, performs an ECC decoding on the test data stored in the first latch and a test parity data, stored in the second latch in response to a read command and provides an external device with a severity signal indicating whether the test data and the test parity data includes at least one error bit and the at least one error bit is correctable.

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