公开(公告)号：US20040256711A1

公开(公告)日：2004-12-23

申请号：US10652184

申请日：2003-08-29

申请人： Sanyo Electric Co., Ltd., a Osaka, Japan Corporation

发明人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Yukio Okada ,  Yusuke Igarashi ,  Eiju Maehara ,  Kouji Takahashi

IPC分类号： H01L023/48

CPC分类号： H01L23/3135 ,  G11B5/4853 ,  H01L21/4832 ,  H01L23/4334 ,  H01L23/525 ,  H01L24/10 ,  H01L24/13 ,  H01L24/32 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/26175 ,  H01L2224/32013 ,  H01L2224/32059 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/83385 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01059 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K1/0204 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/10416 ,  H05K2201/10727 ,  H05K2201/10734 ,  H05K2201/2009 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A heat radiation electrode (15) is exposed from the back surface of an insulating resin (13), and a metal plate (23) is affixed to this heat radiation electrode (15). The back surface of this metal plate (23) and the back surface of a flexible sheet become substantially within a same plane, so that it is readily affixed to a second supporting member (24). In addition, the top surface of the heat radiation electrode (15) is made protrusive beyond the top surfaces of the pads (14) to reduce the distance between the semiconductor chip (16) and the heat radiation electrode (15). Accordingly, the heat generated by the semiconductor chip can be efficiently dissipated via the heat radiation electrode (15), the metal plate (23) and the second supporting member (24).

摘要翻译： 散热电极（15）从绝缘树脂（13）的背面露出，金属板（23）固定在该放热电极（15）上。 该金属板（23）的后表面和柔性片的后表面基本上在相同的平面内，从而容易地固定在第二支撑构件（24）上。 此外，散热电极（15）的顶表面被突出超过焊盘（14）的顶表面，以减小半导体芯片（16）和散热电极（15）之间的距离。 因此，可以通过散热电极（15），金属板（23）和第二支撑构件（24）有效地散发由半导体芯片产生的热量。