公开(公告)号：US09293421B2

公开(公告)日：2016-03-22

申请号：US14591427

申请日：2015-01-07

Applicant: TDK CORPORATION

Inventor： Miyuki Yanagida ,  Makoto Orikasa ,  Susumu Taniguchi ,  Hisayuki Abe

IPC: H01L23/552 ,  H01L23/31

CPC classification number: H01L23/552 ,  H01L23/3114 ,  H01L23/562 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06537 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An electronic component module according to the present invention is provided with an electronic component, a sealing resin that seals the electronic component, and a metal film that covers a surface of the sealing resin. The sealing resin contains filler of oxide particles. Part of the filler in the sealing resin is exposed to the surface of the sealing resin. At least the part of the filler exposed to the surface of the sealing resin includes a crack that extends from an exposed surface of the filler into an inner portion. The crack is filled with at least one metal that constitutes the metal film.

Abstract translation: 根据本发明的电子部件模块设置有电子部件，密封电子部件的密封树脂和覆盖密封树脂的表面的金属膜。 密封树脂含有氧化物颗粒的填料。 密封树脂中的填料的一部分暴露于密封树脂的表面。 暴露于密封树脂表面的填料的至少一部分包括从填料的暴露表面延伸到内部的裂纹。 该裂纹填充有构成金属膜的至少一种金属。

公开(公告)号：US11869834B2

公开(公告)日：2024-01-09

申请号：US17314187

申请日：2021-05-07

Applicant: TDK CORPORATION

Inventor： Takashi Daitoku ,  Susumu Taniguchi ,  Akiko Seki ,  Atsushi Sato ,  Yuhei Horikawa ,  Makoto Orikasa ,  Hisayuki Abe

IPC: H01L23/498 ,  H01L33/62 ,  H05K1/09 ,  H01L21/48 ,  H05K3/40 ,  G06F3/044

CPC classification number: H01L23/49838 ,  G06F3/044 ,  H01L21/4857 ,  H01L23/49866 ,  H01L33/62 ,  H05K1/09 ,  H05K3/4007 ,  H01L2933/0066 ,  H05K2201/0338 ,  H05K2201/0341 ,  H05K2203/04

Abstract: An electroconductive substrate, including: a base material; a foundation layer disposed on the base material; a trench formation layer disposed on the foundation layer, and an electroconductive pattern layer including metal plating. A trench including a bottom surface to which the foundation layer is exposed, is formed. The trench is filled with the electroconductive pattern layer. The foundation layer includes a mixed region which is formed from a surface of the foundation layer on the electroconductive pattern layer side towards the inside thereof, and contains metal particles which contain a metal configuring the electroconductive pattern layer, and enter the foundation layer.

公开(公告)号：US09564179B2

公开(公告)日：2017-02-07

申请号：US15089801

申请日：2016-04-04

Applicant: TDK CORPORATION

Inventor： Susumu Taniguchi ,  Hisayuki Abe

IPC: G11B17/00 ,  G11B33/14

CPC classification number: G11B33/1426 ,  G11B17/00 ,  G11B25/043 ,  G11B33/1446 ,  G11B33/148

Abstract: A spoiler (40) that is a rectifying component for a magnetic disk device including a flat plate-like plate portion (41) arranged to face a magnetic disk (10), and a support portion (42) that supports the plate portion (41) includes a body portion (401) made of a resin, and a metal plating layer (402) that covers an entire surface of the body portion (401).

Abstract translation: 作为用于磁盘装置的整流部件的扰流器（40），包括布置成面对磁盘（10）的平板状板部分（41）和支撑板部分（41）的支撑部分（42） ）包括由树脂制成的主体部分（401）和覆盖主体部分（401）的整个表面的金属镀层（402）。

公开(公告)号：US11410855B2

公开(公告)日：2022-08-09

申请号：US16997092

申请日：2020-08-19

Applicant: TDK CORPORATION

Inventor： Takashi Daitoku ,  Susumu Taniguchi ,  Akiko Seki ,  Atsushi Sato ,  Yuhei Horikawa ,  Makoto Orikasa ,  Hisayuki Abe

IPC: H01L21/48 ,  G03F7/00 ,  H01L33/62 ,  C23C18/18 ,  C23C18/20 ,  C23C18/16 ,  C23C18/30 ,  C23C18/31 ,  H01L23/00 ,  C23C18/38 ,  H01L25/075

Abstract: A method of producing an electroconductive substrate including a base material, and an electroconductive pattern disposed on one main surface side of the base material includes: a step of forming a trench including a bottom surface to which a foundation layer is exposed, and a lateral surface which includes a surface of a trench formation layer, according to an imprint method; and a step of forming an electroconductive pattern layer by growing metal plating from the foundation layer which is exposed to the bottom surface of the trench.

公开(公告)号：US11088308B2

公开(公告)日：2021-08-10

申请号：US16794445

申请日：2020-02-19

Applicant: TDK CORPORATION

Inventor： Takasi Satou ,  Susumu Taniguchi ,  Hideyuki Kobayashi ,  Makoto Orikasa

IPC: H01L33/62 ,  H01L23/00

Abstract: A bonding structure is a bonding structure which bonds a light emitting element and a substrate and includes a first electrode formed on the light emitting element, a second electrode formed on the substrate, and a bonding layer which bonds the first electrode and the second electrode, and the bonding layer contains a first bonding metal component and a second bonding metal component different from the first bonding metal component.

公开(公告)号：US11031330B2

公开(公告)日：2021-06-08

申请号：US16811018

申请日：2020-03-06

Applicant: TDK CORPORATION

Inventor： Takashi Daitoku ,  Susumu Taniguchi ,  Akiko Seki ,  Atsushi Sato ,  Yuhei Horikawa ,  Makoto Orikasa ,  Hisayuki Abe

IPC: H01L23/498 ,  H01L33/62 ,  H05K1/09 ,  H01L21/48 ,  H05K3/40 ,  G06F3/044

Abstract: An electroconductive substrate, including: a base material; a foundation layer disposed on the base material; a trench formation layer disposed on the foundation layer, and an electroconductive pattern layer including metal plating. A trench including a bottom surface to which the foundation layer is exposed, is formed. The trench is filled with the electroconductive pattern layer. The foundation layer includes a mixed region which is formed from a surface of the foundation layer on the electroconductive pattern layer side towards the inside thereof, and contains metal particles which contain a metal configuring the electroconductive pattern layer, and enter the foundation layer.

公开(公告)号：US10784122B2

公开(公告)日：2020-09-22

申请号：US16038711

申请日：2018-07-18

Applicant: TDK CORPORATION

Inventor： Takashi Daitoku ,  Susumu Taniguchi ,  Akiko Seki ,  Atsushi Sato ,  Yuhei Horikawa ,  Makoto Orikasa ,  Hisayuki Abe

IPC: H01L21/48 ,  C23C18/20 ,  H01L33/62 ,  G03F7/00 ,  C23C18/18 ,  C23C18/16 ,  C23C18/30 ,  C23C18/31 ,  C23C18/38 ,  H01L23/00 ,  H01L25/075

Abstract: A method of producing an electroconductive substrate including a base material, and an electroconductive pattern disposed on one main surface side of the base material includes: a step of forming a trench including a bottom surface to which a foundation layer is exposed, and a lateral surface which includes a surface of a trench formation layer, according to an imprint method; and a step of forming an electroconductive pattern layer by growing metal plating from the foundation layer which is exposed to the bottom surface of the trench.