公开(公告)号：US20180137964A1

公开(公告)日：2018-05-17

申请号：US15814063

申请日：2017-11-15

Applicant: TDK CORPORATION

Inventor： Yoji TOZAWA ,  Masashi SHIMOYASU ,  Junichi OTSUKA ,  Tsutomu ONO ,  Hidekazu SATO

IPC: H01F27/245 ,  H01F27/28 ,  H01F27/29

Abstract: An electronic component includes a body and a pair of terminal electrodes. The body has a pair of end faces opposing each other in a first direction, a pair of main faces opposing each other in a second direction, and a pair of side faces opposing each other in a third direction. One of the main faces serves as a mounting face. A clearance in the first direction between an end edge of a conductive resin layer and the end edge of a base metal layer at an end portion of the one of the main faces in the third direction is longer than a clearance in the first direction between the end edge of the conductive resin layer and the end edge of the base metal layer at a central portion of the one of the main faces in the third direction.

公开(公告)号：US20240242883A1

公开(公告)日：2024-07-18

申请号：US18410188

申请日：2024-01-11

Applicant: TDK Corporation

Inventor： Yuya ISHIMA ,  Kenji KOMORITA ,  Shingo HATTORI ,  Yoji TOZAWA ,  Masaki TAKAHASHI ,  Hidenobu UMEDA ,  Yusuke NAGAI ,  Akihiko OIDE

IPC: H01F41/076 ,  H01F41/12

CPC classification number: H01F41/076 ,  H01F41/122

Abstract: A method for manufacturing a coil component including an element body, and a coil disposed inside the element body and including a first coil conductor and a second coil conductor having different shapes, the method comprises: applying a first photosensitive conductive paste on a substrate and exposing the first photosensitive conductive paste to light with a pattern corresponding to the first coil conductor to form a first curing pattern; after the forming of the first curing pattern, applying a second photosensitive conductive paste on the first photosensitive conductive paste and exposing the second photosensitive conductive paste to light with a pattern corresponding to the second coil conductor to form a second curing pattern; after the forming of the second curing pattern, developing portions of the first photosensitive conductive paste and the second photosensitive conductive paste that were not exposed; and after the developing, adding an insulating material on the substrate.

公开(公告)号：US20240128020A1

公开(公告)日：2024-04-18

申请号：US18474733

申请日：2023-09-26

Applicant: TDK CORPORATION

Inventor： Yuya OSHIMA ,  Junichi OTSUKA ,  Yohei TADAKI ,  Shinichi KONDO ,  Koki ITO ,  Yoji TOZAWA ,  Shigeshi OSAWA ,  Tsubasa OZAWA ,  Makoto YOSHINO

IPC: H01F41/12 ,  H01F17/00 ,  H01F27/32

CPC classification number: H01F41/12 ,  H01F17/0013 ,  H01F27/32

Abstract: In a method for manufacturing a laminated coil component, in which a laminated coil component is manufactured by laminating insulator sheets in order on which conductors having predetermined patterns are formed, the insulator sheets are laminated such that a distance in a lamination direction between a first lead-out conductor laminated first and a first coil conductor laminated next is larger than a distance in the lamination direction between a second lead-out conductor laminated last and a second coil conductor laminated immediately before the second lead-out conductor.

公开(公告)号：US20230317351A1

公开(公告)日：2023-10-05

申请号：US18188534

申请日：2023-03-23

Applicant: TDK CORPORATION

Inventor： Masashi SHIMOYASU ,  Yoji TOZAWA ,  Akihiko OIDE ,  Daiki KATO ,  Midori KISHIMOTO ,  Satoshi TAKASU ,  Yo SAITO ,  Rui TAKAHASHI ,  Kenta SASAKI ,  Makoto YOSHINO ,  Kazuhiro EBINA

IPC: H01F27/28 ,  H01F27/29

CPC classification number: H01F27/2804 ,  H01F27/292 ,  H01F2027/2809

Abstract: An electronic component has an element body; and an external electrode having a main body portion covering at least the second surface and a first wrapping-around portion wrapping around the third surface in the element body. The wrapping-around portion of the external electrode has a first part having a first distance, a second part having a second distance, a third part having a third distance, a fourth part having a fourth distance, and a fifth part having a fifth distance in the second direction in order from one side to the other side in the first direction. The second distance is longer than the first distance and the third distance. The fourth distance is longer than the third distance and the fifth distance.

公开(公告)号：US20200234877A1

公开(公告)日：2020-07-23

申请号：US16843228

申请日：2020-04-08

Applicant: TDK CORPORATION

Inventor： Yuya OSHIMA ,  Makoto YOSHINO ,  Yoji TOZAWA ,  Junichi OTSUKA ,  Kazuo IWAI ,  Yohei TADAKI ,  Shinichi KONDO ,  Kazuhiro EBINA ,  Mamoru KAWAUCHI

IPC: H01F41/04 ,  H01F27/28 ,  H01F17/00

Abstract: A method of manufacturing a laminated coil component is a method of manufacturing a laminated coil component provided with a laminate obtained by laminating a coil conductor forming a spiral coil and an insulator layer. The method of manufacturing a laminated coil component includes a step of providing a conductor pattern configured to become a coil conductor on a green sheet configured to become an insulator layer, and a step of laminating a plurality of green sheets provided with the conductor pattern. The conductor pattern includes a pair of first side surfaces opposed to each other in an orthogonal direction orthogonal to a laminating direction of the green sheet. At the step of laminating a plurality of green sheets, a depression is formed on at least one of the pair of first side surfaces.

公开(公告)号：US20220068565A1

公开(公告)日：2022-03-03

申请号：US17521500

申请日：2021-11-08

Applicant: TDK CORPORATION

Inventor： Yoji TOZAWA ,  Masashi SHIMOYASU ,  Makoto YOSHINO ,  Takuo ABE ,  Akihiko OIDE ,  Tsutomu ONO ,  Shinichi SATO ,  Makoto MORITA ,  Shinichi SATO ,  Hidekazu SATO

IPC: H01G4/232 ,  H01G4/252 ,  H01G13/00 ,  H05K1/03 ,  H01B1/22 ,  H01G4/30 ,  H03H7/42 ,  H01F17/00 ,  H01F27/29 ,  H01F27/32

Abstract: An electronic component includes an element body, an external electrode, and a resin film having electrical insulation properties. The element body includes a principal surface and a side surface adjacent to the principal surface. The external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the side surface. The resin film is disposed on the principal surface and is in contact with the principal surface. Each of the first electrode portion and the second electrode portion includes a conductive resin layer disposed on the element body. A conductive resin layer included in the first electrode portion is disposed on the resin film and is in contact with the resin film.

公开(公告)号：US20190280667A1

公开(公告)日：2019-09-12

申请号：US16334991

申请日：2017-08-21

Applicant: TDK CORPORATION

Inventor： Akihiko OIDE ,  Naoki UCHIDA ,  Yoji TOZAWA ,  Makoto YOSHINO ,  Seiichi NAKAGAWA ,  Shinichi SATO ,  Hiroshi ONO ,  Takashi ENDO

IPC: H03H7/01 ,  H03H1/00

Abstract: A multilayer LC filter array includes an element body of a rectangular parallelepiped shape, a first filter including a first inductor and a first capacitor that are disposed in the element body, a second filter including a second inductor and a second capacitor that are disposed in the element body, a first input terminal electrode and a first output terminal electrode that are connected to the first inductor, a second input terminal electrode and a second output terminal electrode that are connected to the second inductor, and a ground terminal electrode that is connected to the first capacitor and the second capacitor. The element body includes first and second principal surfaces opposing each other. The ground terminal electrode is disposed at a center of the first principal surface. The first input terminal electrode, the first output terminal electrode, the second input terminal electrode, and the second output terminal electrode are disposed at respective different corner portions of the element body when viewed from a direction orthogonal to the first principal surface.

公开(公告)号：US20180337001A1

公开(公告)日：2018-11-22

申请号：US15821998

申请日：2017-11-24

Applicant: TDK CORPORATION

Inventor： Yoji TOZAWA ,  Masashi SHIMOYASU ,  Makoto YOSHINO ,  Takuo ABE ,  Akihiko OIDE ,  Tsutomu ONO ,  Shinichi SATO ,  Makoto MORITA ,  Shinichi SATO ,  Hidekazu SATO ,  Masashi KITAZAKI ,  Naoki UCHIDA ,  Masahiro KATO

IPC: H01G4/232 ,  H01G4/252 ,  H01G13/00 ,  H05K1/03 ,  H01B1/22 ,  H01G4/30 ,  H01F17/00 ,  H03H7/42

CPC classification number: H01G4/2325 ,  H01B1/22 ,  H01F17/0013 ,  H01F2017/0093 ,  H01G4/12 ,  H01G4/252 ,  H01G4/30 ,  H01G13/006 ,  H03H7/427 ,  H03H2001/0085 ,  H05K1/0306

Abstract: An electronic component includes an element body, an external electrode, and a resin film having electrical insulation properties. The element body includes a principal surface and a side surface adjacent to the principal surface. The external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the side surface. The resin film is disposed on the principal surface and is in contact with the principal surface. Each of the first electrode portion and the second electrode portion includes a conductive resin layer disposed on the element body. A conductive resin layer included in the first electrode portion is disposed on the resin film and is in contact with the resin film.

公开(公告)号：US20240120142A1

公开(公告)日：2024-04-11

申请号：US18480760

申请日：2023-10-04

Applicant: TDK CORPORATION

Inventor： Yoji TOZAWA ,  Masashi SHIMOYASU ,  Akihiko OIDE ,  Daiki KATO ,  Makoto YOSHINO ,  Takashi ENDO ,  Takuya KODAMA ,  Akira AKASAKA ,  Ken ITOH

IPC: H01F27/02 ,  H01F27/29

CPC classification number: H01F27/022 ,  H01F27/29

Abstract: The electronic component includes an element body, an internal conductor, a cover layer, and a conductor layer. The internal conductor is disposed in the element body. The cover layer is disposed on an outer surface of the element body and has an electrical insulation property. The conductor layer is disposed on the cover layer and is electrically connected to the internal conductor. The conductor layer includes a portion. The portion protrudes toward the element body through the cover layer and is physically and electrically connected to the internal conductor. The conductor layer is electrically connected to the internal conductor.

公开(公告)号：US20210383960A1

公开(公告)日：2021-12-09

申请号：US17337985

申请日：2021-06-03

Applicant: TDK CORPORATION

Inventor： Daiki KATO ,  Masashi SHIMOYASU ,  Yoji TOZAWA ,  Seiichi NAKAGAWA ,  Akihiko OIDE ,  Makoto YOSHINO ,  Kazuhiro EBINA

IPC: H01F27/28 ,  H01F27/29 ,  H01F41/04

Abstract: A multilayer conductor component includes an element body, an internal conductor, and an external electrode. The external electrode includes a sintered metal layer. The sintered metal layer is disposed on an end surface, a pair of side surfaces, a first main surface, and a second main surface of the element body. An electrode length, which is a length in the first direction from an edge of the sintered metal layer to a reference plane including the end surface, at a central portion of the first main surface in the third direction, is shorter than the electrode length at each of the ridge portions. The electrode length at a central portion of each of the pair of side surfaces in the second direction is equal to or less than the electrode length at each of the ridge portions.