公开(公告)号：US10340248B2

公开(公告)日：2019-07-02

申请号：US15644292

申请日：2017-07-07

Applicant: TOKYO ELECTRON LIMITED

Inventor： Masataka Matsunaga ,  Takashi Koga ,  Takeshi Tamura ,  Takahiro Masunaga ,  Yuji Mimura ,  Masaru Honda ,  Toshifumi Inamasu ,  Satoshi Nishimura

IPC: H01L21/18 ,  H01L21/67 ,  H01L23/00 ,  H05K13/00 ,  H01L21/677

Abstract: A bonding system includes a substrate transfer device configured to transfer a first substrate and a second substrate in a normal pressure atmosphere, a surface modifying apparatus configured to modify surfaces of the first substrate and the second substrate to be bonded with each other in a depressurized atmosphere, a load lock chamber in which the first substrate and the second substrate are delivered between the substrate transfer device and the surface modifying apparatus and in which an internal atmosphere of the load lock chamber is switchable between an atmospheric pressure atmosphere and the depressurized atmosphere, a surface hydrophilizing apparatus configured to hydrophilize the modified surfaces of the first substrate and the second substrate, and a bonding apparatus configured to bond the hydrophilized surfaces of the first substrate and the second substrate by an intermolecular force.

公开(公告)号：US09741595B2

公开(公告)日：2017-08-22

申请号：US14950281

申请日：2015-11-24

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kenji Sugakawa ,  Yuji Mimura ,  Shuhei Matsumoto ,  Takahiro Masunaga ,  Makoto Tsukishima

IPC: H01L21/67 ,  H01L21/66 ,  H01L23/00 ,  H01L21/68 ,  H01L21/822

CPC classification number: H01L21/67248 ,  H01L21/67092 ,  H01L21/681 ,  H01L21/8221 ,  H01L22/12 ,  H01L22/20 ,  H01L24/08 ,  H01L24/75 ,  H01L24/80 ,  H01L24/94 ,  H01L2224/08145 ,  H01L2224/7501 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/75601 ,  H01L2224/7565 ,  H01L2224/75702 ,  H01L2224/75704 ,  H01L2224/75705 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/75802 ,  H01L2224/75804 ,  H01L2224/75822 ,  H01L2224/75823 ,  H01L2224/75824 ,  H01L2224/759 ,  H01L2224/75981 ,  H01L2224/80003 ,  H01L2224/80013 ,  H01L2224/80048 ,  H01L2224/8013 ,  H01L2224/80132 ,  H01L2224/80201 ,  H01L2224/80894 ,  H01L2224/80908 ,  H01L2224/83201 ,  H01L2224/94 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2224/80 ,  H01L2924/00014

Abstract: There is provided a method of bonding substrates to each other, which includes: holding a first substrate on a lower surface of a first holding part; adjusting a temperature of a second substrate by a temperature adjusting part to become higher than a temperature of the first substrate; holding the second substrate on an upper surface of a second holding part; inspecting a state of the second substrate by imaging a plurality of reference points of the second substrate with a first imaging part, measuring positions of the reference points, and comparing a measurement result with a predetermined permissible range; and pressing a central portion of the first substrate with a pressing member, bringing the central portion of the first substrate into contact with a central portion of the second substrate, and sequentially bonding the first substrate and the second substrate.

公开(公告)号：US10424502B2

公开(公告)日：2019-09-24

申请号：US15644318

申请日：2017-07-07

Applicant: TOKYO ELECTRON LIMITED

Inventor： Masataka Matsunaga ,  Takahiro Masunaga ,  Takashi Koga ,  Yasuharu Iwashita ,  Shingo Katsuki ,  Masaaki Umitsuki ,  Kazutoshi Ishimaru ,  Fumio Sakata

IPC: H01L21/683 ,  H01L21/67 ,  H01L21/68 ,  B29C65/78 ,  H01L21/687

Abstract: A substrate transfer device for transferring a first substrate and a second substrate to a bonding apparatus configured to bond the first substrate and the second substrate, includes a first holding part configured to hold the first substrate from an upper surface side, a lower surface of the first substrate serving as a bonding surface, and a second holding part provided below the first holding part and configured to hold the second substrate from a lower surface side so that the second substrate faces the first substrate, a upper surface of the second substrate serving as a bonding surface to be bonded to the lower surface of the first substrate.

公开(公告)号：US09401291B2

公开(公告)日：2016-07-26

申请号：US14525502

申请日：2014-10-28

Applicant: Tokyo Electron Limited

Inventor： Yuji Mimura ,  Tetsuya Maki ,  Shigeto Tsuruta ,  Tatsumi Oonishi ,  Daisuke Ikemoto ,  Takahiro Masunaga

IPC: B05B12/02 ,  B05B1/04 ,  B05C5/02 ,  B05C11/10 ,  H01L21/67

CPC classification number: H01L21/6715 ,  B05C5/0254 ,  B05C11/1013 ,  B05C11/1047 ,  H01L21/67253

Abstract: A coating apparatus includes: a slit nozzle including a retention chamber that retains the coating material; a moving mechanism that moves the slit nozzle; a pressure regulation unit that regulates a pressure inside the retention chamber; and a control unit that controls the moving mechanism and the pressure regulation unit to relatively move the slit nozzle with respect to the substrate while changing the pressure inside the retention chamber toward an atmospheric pressure from a negative pressure, wherein the control unit is configured to control the pressure regulation unit so that a change in the pressure inside the retention chamber in a start zone including a coating start position and an end zone including a coating end position becomes slower than a change in the pressure inside the retention chamber in a middle zone except the start zone and the end zone.

Abstract translation: 涂布装置包括：狭缝喷嘴，其包括保持涂料的保留室; 使狭缝喷嘴移动的移动机构; 压力调节单元，其调节保持室内的压力; 以及控制单元，其控制所述移动机构和所述压力调节单元，以使所述狭缝喷嘴相对于所述基板相对移动，同时将所述保持室内的压力从负压变为大气压，其中，所述控制单元被配置为控制 压力调节单元，使得在包括涂层开始位置和包括涂层终止位置的端部区域的起始区域内的保持室内的压力变化比在中间区域中的保持室内部的压力变化慢，除了 起始区和结束区。