公开(公告)号：US11818835B2

公开(公告)日：2023-11-14

申请号：US17172769

申请日：2021-02-10

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. ,  TOMOEGAWA CO., LTD.

Inventor： Hiroaki Takahashi ,  Kiyotaka Komori ,  Masaya Koyama ,  Jun Tochihira ,  Ryu Harada

IPC: H05K1/02 ,  B32B27/20 ,  B32B27/32 ,  B32B15/08 ,  H05K1/03 ,  H05K3/02 ,  B32B15/085 ,  B32B15/20 ,  H05K3/46

CPC classification number: H05K1/024 ,  B32B15/08 ,  B32B15/085 ,  B32B15/20 ,  B32B27/20 ,  B32B27/32 ,  H05K1/036 ,  H05K1/0373 ,  H05K1/0393 ,  H05K3/022 ,  H05K3/4673 ,  B32B2270/00 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2457/08 ,  H05K2201/0133 ,  H05K2201/0141 ,  H05K2201/0158 ,  H05K2201/0195

Abstract: A multilayer printed wiring board including one or more insulating layers 2 and at least one conductive layer 1 which are stacked alternately is disclosed. The one or more insulating layers 2 include at least one liquid crystal polymer resin layer 4 so that each of the one or more insulating layers 2 includes at least one layer selected from a group consisting of at least one polyolefin resin layer 3 and the at least one liquid crystal polymer resin layer 4. A percentage by volume of the at least one liquid crystal polymer resin layer 4 relative to the one or more insulating layers 2 is within a range of 5 to 90%.

公开(公告)号：US10568201B2

公开(公告)日：2020-02-18

申请号：US16072680

申请日：2017-01-24

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. ,  TOMOEGAWA CO., LTD.

Inventor： Hiroaki Takahashi ,  Tomoyuki Aoki ,  Kiyotaka Komori ,  Jun Tochihira ,  Ryu Harada

IPC: H05K1/02 ,  H05K1/09 ,  H01B3/30 ,  H01B1/02 ,  H01B3/42 ,  H05K1/03

Abstract: A multilayer printed wiring board has excellent high-frequency characteristics. The multilayer printed wiring board includes one or more conductive layers and one or more insulating layers. In the multilayer printed wiring board, the one or more conductive layers and the one or more insulating layers are alternately stacked. Each insulating layer of the one or more insulating layers includes one or more of a polyolefin resin layer, a fluororesin layer, a polyphenylene ether resin layer, a polyamideimide resin layer, and a polyimide resin layer. At least one insulating layer of the one or more insulating layers includes a polyolefin resin layer.

公开(公告)号：US20180258324A1

公开(公告)日：2018-09-13

申请号：US15542115

申请日：2016-01-19

Applicant: Tomoegawa Co., Ltd.

Inventor： Jun Tochihira ,  Ryu Harada

IPC: C09J7/35 ,  B32B15/082 ,  B32B15/085 ,  B32B27/28 ,  B32B27/30 ,  B32B27/20 ,  C09J7/25 ,  C09J7/22 ,  C09J7/28

Abstract: This thermosetting adhesive composition contains as a component (A) a vinyl compound in which a terminal end of a bifunctional polyphenylene ether oligomer is converted to a vinyl group, as a component (B) a maleimide resin, and as a component (C) a thermoplastic elastomer, the equivalent ratio of vinyl groups in the component (A) and maleimide groups in the component (B) being 1.0:0.5 to 1.0:4.0, the proportion of the component (C) in the total weight of the component (A), the component (B), and the component (C) being 55 to 95% by weight, the ratio of styrene units of the component (C) with respect to the total weight of the component (C) being 10 to 40% by weight, the tensile stress at 100% elongation being 0.1 to 2.9 MPa, and the elongation at break being 100% or greater.

公开(公告)号：US12176237B2

公开(公告)日：2024-12-24

申请号：US17799956

申请日：2021-02-10

Applicant: Tomoegawa Co., Ltd.

Inventor： Tomoya Hagihara ,  Jun Tochihira

IPC: H01L21/683

Abstract: An electrostatic chuck device is provided in which the occurrence of cracking in a ceramic layer, the cracking being caused by a difference in thermal expansion between a substrate and a sleeve due to heat generated during formation of the ceramic layer, is suppressed. The electrostatic chuck device includes a substrate, a laminated body that is laminated on the substrate and that includes at least an internal electrode, and a ceramic layer that is laminated on the upper surface of the laminated body in the thickness direction. The electrostatic chuck device is such that the substrate has a through-hole provided so as to pass through in the thickness direction, a sleeve formed from an insulating material is inserted into the through-hole, and the sleeve is joined to the through-hole via a joining means at an upper portion of the substrate in the thickness direction.

公开(公告)号：US10822527B2

公开(公告)日：2020-11-03

申请号：US15542115

申请日：2016-01-19

Applicant: Tomoegawa Co., Ltd.

Inventor： Jun Tochihira ,  Ryu Harada

IPC: C09J7/35 ,  B32B27/00 ,  C09J7/20 ,  C09J4/06 ,  C08F290/06 ,  C08F257/02 ,  C09J7/25 ,  C09J7/22 ,  B32B15/082 ,  B32B15/085 ,  B32B27/20 ,  B32B27/28 ,  B32B27/30 ,  C08F222/40 ,  C08F212/34

Abstract: This thermosetting adhesive composition contains as a component (A) a vinyl compound in which a terminal end of a bifunctional polyphenylene ether oligomer is converted to a vinyl group, as a component (B) a maleimide resin, and as a component (C) a thermoplastic elastomer, the equivalent ratio of vinyl groups in the component (A) and maleimide groups in the component (B) being 1.0:0.5 to 1.0:4.0, the proportion of the component (C) in the total weight of the component (A), the component (B), and the component (C) being 55 to 95% by weight, the ratio of styrene units of the component (C) with respect to the total weight of the component (C) being 10 to 40% by weight, the tensile stress at 100% elongation being 0.1 to 2.9 MPa, and the elongation at break being 100% or greater.

公开(公告)号：US10751976B2

公开(公告)日：2020-08-25

申请号：US16072715

申请日：2017-01-24

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. ,  TOMOEGAWA CO., LTD.

Inventor： Yohsuke Ishikawa ,  Yoshiaki Esaki ,  Takayoshi Ozeki ,  Jun Tochihira ,  Ryu Harada

IPC: B32B3/00 ,  B32B15/088 ,  B32B15/08 ,  H05K3/46 ,  B32B15/20 ,  B32B27/08 ,  B32B27/28 ,  B32B27/32 ,  B32B27/34 ,  B32B27/42 ,  H05K1/03

Abstract: A resin-clad metal foil which enables a reduction in fluidity of a resin during molding and a reduction in extrusion of the resin while maintaining good adhesiveness, bendability, thermal resistance, and circuit filling property. A first insulating layer includes a polyimide resin layer, a polyamideimide resin layer, a liquid crystal polymer resin layer, a fluororesin layer, or a polyphenylene ether resin layer and a second insulating layer includes a polyolefin resin layer in a semi-cured state are disposed in this order on a metal foil. The polyolefin resin layer contains a component representing a polyolefin-based elastomer and a component representing a thermosetting resin. The percentage by mass of the component in the polyolefin resin layer ranges from 50 wt. % to 95 wt. %.