摘要:
A collective erasure type nonvolatile semiconductor memory device which allows use of redundant structure to word lines is provided. A row address buffer having address converting function simultaneously selects a plurality of physically adjacent word lines from a memory array in programming before erasure. Programming before erasure is effected on the memory cells on the simultaneously selected word lines. Even when physically adjacent word lines are short-circuited between each other, programming high voltage can be transmitted to the defective word lines, as these word lines are selected simultaneously. Therefore, the memory cells on the defective word lines can be programmed before erasure, so that over erasure at the time of collective erasing operation can be prevented. Thus, redundant structure for replacing defecting word lines by spare word lines can be utilized.
摘要:
A collective erasure type nonvolatile semiconductor memory device which allows use of redundant structure to word lines is provided. A row address buffer having address converting function simultaneously selects a plurality of physically adjacent word lines from a memory array in programming before erasure. Programming before erasure is effected on the memory cells on the simultaneously selected word lines. Even when physically adjacent word lines are short-circuited between each other, programming high voltage can be transmitted to the defective word lines, as these word lines are selected simultaneously. Therefore, the memory cells on the defective word lines can be programmed before erasure, so that over erasure at the time of collective erasing operation can be prevented. Thus, redundant structure for replacing defecting word lines by spare word lines can be utilized.
摘要:
A nonvolatile semiconductor memory device has a plurality of memory cells, which are arranged in a matrix form having rows and columns and each have floating a gate for holding an information charge, a plurality of bit lines, a plurality of word lines, a plurality of source lines, and a high voltage generator for generating a negative high voltage. The high voltage generator is connected to each word line and has a capacitor to which a predetermined clock is applied in response to a signal for selecting word lines. The semiconductor memory device further comprises an erasing device, which applies the negative high voltage generated by, the high voltage generator to the word line selected by the selection signal in the erasing operation. The erasing device grounds the source line connected to the source of the corresponding memory cell.
摘要:
The semiconductor device includes a voltage generator for generating selectively a signal of a first level or a second level onto a first supply line, and a voltage converter using voltage signals on the first supply line and a second supply line for producing a signal of the voltage level on the first or the second supply line in accordance with an input signal, and a voltage level shifter for detecting the level of the voltage on the first supply line to shift in voltage level a signal on the second power supply line toward the first level when the voltage on the first supply line approaches the first level. The difference of the voltages on the first and second supply lines can be reduced to improve the break-down characteristics of a transistor included in the voltage converter, resulting in a reliable semiconductor device.
摘要:
A column latch and a high voltage switch connected to each bit line are eliminated, and an address counter and the data latch are newly provided. The data latch is arranged between an I/O buffer and a Y gate. In a programming cycle, the address counter is activated and transfer gates in the Y gate are successively selected. Consequently, a high voltage Vpp or 0 V is applied periodically to bit lines in the memory cell array in accordance with the write data stored in the data latch.
摘要:
In erasing, electrons are simultaneously injected into floating gates from sources of a plurality of memory cells. Thus, the threshold voltages of the plurality of memory cells are increased. In programming, electrons are emitted from a floating gate of a selected memory cell to a drain. Thus, the threshold voltage of the selected memory cell is reduced.
摘要:
In erasing, electrons are simultaneously injected into floating gates from sources of a plurality of memory cells. Thus, the threshold voltages of the plurality of memory cells are increased. In programming, electrons are emitted from a floating gate of a selected memory cell to a drain. Thus, the threshold voltage of the selected memory cell is reduced.
摘要:
A column latch and a high voltage switch connected to each bit line are eliminated, and an address counter and the data latch are newly provided. The data latch is arranged between an I/O buffer and a Y gate. In a programming cycle, the address counter is activated and transfer gates in the Y gate are successively selected. Consequently, a high voltage Vpp or 0V is applied periodically to bit lines in the memory cell array in accordance with the write data stored in the data latch.
摘要:
A column latch and a high voltage switch connected to each bit line are eliminated, and an address counter and the data latch are newly provided. The data latch is arranged between an I/O buffer and a Y gate. In a programming cycle, the address counter is activated and transfer gates in the Y gate are successively selected. Consequently, a high voltage Vpp or 0 V is applied periodically to bit lines in the memory cell array in accordance with the write data stored in the data latch.
摘要:
In erasing, electrons are simultaneously injected into floating gates from sources of a plurality of memory cells. Thus, the threshold voltages of the plurality of memory cells are increased. In programming, electrons are emitted from a floating gate of a selected memory cell to a drain. Thus, the threshold voltage of the selected memory cell is reduced.