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公开(公告)号:US07959755B2
公开(公告)日:2011-06-14
申请号:US10832828
申请日:2004-04-26
CPC分类号: B32B27/32 , B29C65/106 , B29C65/1412 , B29C65/1432 , B29C65/1464 , B29C65/4835 , B29C65/485 , B29C66/001 , B29C66/00143 , B29C66/1122 , B29C66/45 , B29C66/71 , B29C66/723 , B29C66/83413 , B29C66/91221 , B29C66/91411 , B29L2009/00 , B32B7/12 , B32B15/085 , B32B15/20 , B32B27/08 , B32B27/306 , B32B27/34 , B32B27/36 , B32B37/1207 , B32B37/203 , B32B2309/105 , B32B2310/0445 , B32B2310/0481 , B32B2310/0825 , B32B2311/24 , B32B2323/04 , B32B2323/046 , B32B2439/40 , B32B2553/00 , C08L23/00 , C09J5/06 , C09J2400/163 , C09J2400/226 , C09J2423/00 , C09J2423/006 , C09J2467/006 , C09J2477/006 , B29K2023/0633 , B29K2023/06 , B29C65/00 , B29K2077/00 , B29K2067/003 , B29K2067/00 , B29K2023/18 , B29K2023/12 , B29K2023/08 , B29K2023/065 , B29K2023/00
摘要: This invention relates to a method of manufacturing a thermal laminate by laminating a first substrate film layer and a second substrate film layer through an adhesive resin layer, which involves the steps of, integrating the adhesive resin layer with the first substrate film layer, heating the surface of the adhesive resin layer by heat rays in the presence of oxygen to induce functional groups which contribute to adhesion, and then, superimposing the second substrate film layer on the adhesive resin layer to be bonded thereto with pressure. The thermal laminate has a strong laminated strength without using a solvent, and is excellent in the safety and hygiene of foods.
摘要翻译: 本发明涉及通过粘合树脂层层叠第一基板膜层和第二基板膜层来制造热层压体的方法,其包括以下步骤:将粘合树脂层与第一基板膜层整合,加热 通过在氧的存在下的热射线粘合树脂层的表面以引起有助于粘附的官能团,然后将第二基底膜层叠加在粘合树脂层上以与其粘合在一起。 热层压板在不使用溶剂的情况下具有强的层压强度,并且食品的安全和卫生性优异。