摘要:
A transparent conductive film has a cured layer mainly containing a curable resin and a transparent conductive thin film successively layered on a transparent plastic film base. The transparent conductive film is characterized in that it has 3-200 protrusions over the surface of the transparent conductive thin film per 100 &mgr;m2, each having a diameter of 0.05-3.0 &mgr;m and a height of 0.005-2.00 &mgr;m. The transparent conductive film is characterized in that a volatile component amount contained in the transparent conductive film is at most 30 Pa.
摘要:
Disclosed is a heat shrinkable polyester film which does not suffer (namely natural shrinkage), is suppressed in decrease of the shrinkage in the main shrinkage direction, and is able to be beautifully and efficiently fitted to a container or the like without changing the temperature conditions for heat shrinkage when the heat shrinkable polyester film is fitted, as a label, to the container or the like by means of heat shrinkage even after high-temperature summer storage in an out door warehouse which has no temperature control system. Specifically disclosed is a heat shrinkable polyester film which is formed from a polyester resin that is mainly composed of ethylene terephthalate and contains 3-12% by mole (inclusive) of one or more monomer components, which can be amorphous components, relative to all the polyester resin components. The heat shrinkable polyester film is characterized in that the shrinkage in 80° C. glycerin, the shrinkage in 130° C. glycerin and the tensile breaking strength in the longitudinal direction are controlled within specific ranges.
摘要:
A semiconductor device includes a semiconductor substrate, a lower wiring layer formed on the semiconductor substrate, a first interlayer insulating film formed on the lower wiring layer and including a first upper surface and a second upper surface, the first upper surface being higher than the second upper surface relative to a surface of the semiconductor substrate, a contact plug formed in the interlayer insulating film and including a first bottom surface contacting to the lower wiring layer, a third upper surface flush with the second upper surface and a fourth upper surface flush with the first upper surface, an upper wiring layer formed on the first and third upper surfaces and including a first side surface and a second side surface opposite to the first side surface, and a second interlayer insulating film formed on the second and fourth upper surfaces.
摘要:
A film roll of a heat-shrinkable polyester film meeting the following requirements: (1) when samples are cut off therefrom at an almost equal interval along the longitudinal direction, and immersed in hot water at 85° C. for 10 seconds, subsequently in water at 25° C. and withdrawn, heat-shrinkage percentages in the maximum shrinkage direction of all the samples are 20% or more; and (2) when raw polymers used for production of the film above comprises of a major constitutional unit and one or more sub constitutional units different therefrom, and the content of the primary sub constitutional unit in each sample is more than 7 mole % in 100% of all constitutional units, and the contents of the primary sub constitutional unit of all the samples fall within a range of ±2 mole % relative to the average.
摘要:
A semiconductor device includes a semiconductor substrate, and an interlayer wiring structure further including a lower wiring layer formed on the semiconductor substrate, a first interlayer an interlayer wiring layer including an interlayer insulating film formed on the lower wiring layer and including a first upper surface and a second upper surface, the first upper surface being higher than the second upper surface relative to a surface of the semiconductor substrate, a contact plug formed in the interlayer insulating film and including a first bottom surface contacting to the lower wiring layer, a third upper surface flush with the second upper surface and a fourth upper surface flush with the first upper surface, an upper wiring layer formed on the first and third upper surfaces and including a first side surface and a second side surface opposite to the first side surface, and a second interlayer insulating film formed on the second and fourth upper surfaces. a plurality of contact plugs each formed so as to extend through the interlayer insulating film to be brought into electrical contact with the lower wiring layer, an upper wiring layer patterned so as to be in electrical contact with upper faces of the contact plugs, and a recessed portion formed by recessing the interlayer insulating film and the contact plugs exposed in the interlayer wiring layer with respect to at least a portion with a short distance between wirings so as to correspond to a shape of the upper wiring layer.
摘要:
Disclosed is a heat-shrinkable polyester film having a specific composition. A heat shrinkage factor of a 10 cm square sample of the film in a maximal shrinkage direction of the film is not less than 20% under the condition that the sample is immersed in hot water of 85° C. for 10 seconds, and then in water of 25° C. for 10 seconds. The number of test pieces of the film having a rupture ratio of not more than 5% is not more than 10% to the total number of the test pieces under the condition that a tensile test of drawing the film in a direction orthogonal to the maximal shrinkage direction of the film is conducted with a distance between corresponding chucks of 100 mm, each test piece having 15 mm in width, a temperature of 23° C., and a drawing rate of 200 mm/min.
摘要:
A junction box comprises small size standard boxes. The small size standard box includes a main casing that contains many longitudinal bus bars disposed in parallel with one another at a given interval in distance therein, and male and female coupling portions provided on the outer opposite side surfaces of the main casing. Plural small size standard boxes are juxtaposed together in accordance with different kinds of automobile vehicles by interconnecting the male and female coupling portions successively. A lower casing member is attached to the main casing. The size of the lower casing member depends on the number of the standard boxes to be coupled for a special purpose. The lower casing member is provided with an attachment portion for a vehicle body projecting from the member.
摘要:
A connecting structure between an adjacently aligned junction box and electrical component connector block includes a connector block having an insertion bracket around which a channel or groove is formed at an insertion bracket base portion. This channel or groove is configured such that the point of material failure or fracture occurs on the connector block in the event that the connecting structure is subject to a large externally induced load.
摘要:
Heat-shrinkable polyester films, each having a heat shrinkability of 40% or higher in the main shrinkage direction of the film after treatment in hot water at 80° C. for 10 seconds, the change of heat shrinkability in the main shrinkage direction of the film after treatment in hot water at 55-75° C. for 10 seconds before and after the film is left under an atmosphere at 40° C. for 160 hours being 15% or lower, exhibit beautiful shrinkage finish in appearance involving only rare occurrence of shrinkage spots, wrinkles, strains, folding and other defects during shrinkage in the step of shrinking with hot air, and in particular, exhibit a quite small lowering in shrinkage finish after a lapse of time for storage and have low spontaneous shrinkability; therefore, these films are suitably used for applications such as labels and cap seals.
摘要:
A void-containing composite film including (A) a polyester base layer containing voids composed mainly of a polymer mixture of a polyester and a thermoplastic resin which is not compatible with the polyester and is selected from the group of polystyrene resins, polyolefin resins, polyacrylic resins, polycarbonate resins, polysulfone resins, cellulose resins, polysiloxane resins and silicone resins, and (B) at least one outer surface layer composed mainly of polyethylene terephthalate and formed on at least one side of the polyester base layer (A), the polyester base layer (A) and the at least one outer surface layer (B) being formed into a composite film by co-extrusion, followed by orientation in at least one direction, the void percentage of a surface portion having 3 .mu.m thickness from the surface of the polyester base layer (A) is 8% by volume or less, the average void percentage of the composite film is 10% to 50% by volume, and the composite film has substantially no voids at the interface between the polyester base layer (A) and the outer surface layer (B).