HEAT SHRINKABLE POLYESTER FILM, METHOD FOR PRODUCING SAME, AND PACKAGED BODY
    2.
    发明申请
    HEAT SHRINKABLE POLYESTER FILM, METHOD FOR PRODUCING SAME, AND PACKAGED BODY 有权
    热收缩聚酯薄膜,其生产方法和包装体

    公开(公告)号:US20130034673A1

    公开(公告)日:2013-02-07

    申请号:US13639741

    申请日:2011-03-16

    摘要: Disclosed is a heat shrinkable polyester film which does not suffer (namely natural shrinkage), is suppressed in decrease of the shrinkage in the main shrinkage direction, and is able to be beautifully and efficiently fitted to a container or the like without changing the temperature conditions for heat shrinkage when the heat shrinkable polyester film is fitted, as a label, to the container or the like by means of heat shrinkage even after high-temperature summer storage in an out door warehouse which has no temperature control system. Specifically disclosed is a heat shrinkable polyester film which is formed from a polyester resin that is mainly composed of ethylene terephthalate and contains 3-12% by mole (inclusive) of one or more monomer components, which can be amorphous components, relative to all the polyester resin components. The heat shrinkable polyester film is characterized in that the shrinkage in 80° C. glycerin, the shrinkage in 130° C. glycerin and the tensile breaking strength in the longitudinal direction are controlled within specific ranges.

    摘要翻译: 公开了在主收缩方向上收缩率的降低抑制了不遭受(即自然收缩)的热收缩性聚酯膜,并且能够在不改变温度条件的情况下精美有效地装配到容器等上 即使在不具有温度控制系统的门禁仓库中,即使在高温夏季储存之后,热收缩性聚酯膜作为标签也可以通过热收缩而装配到容器等上的热收缩。 具体公开了一种热收缩聚酯膜,其由主要由对苯二甲酸乙二醇酯构成的聚酯树脂形成,并且含有3-12%(摩尔)的一种或多种单体组分,其可以是无定形组分,相对于所有 聚酯树脂组分。 热收缩聚酯薄膜的特征在于,甘油的收缩率为80℃,甘油130℃的收缩率和长度方向的拉伸断裂强度被控制在特定范围内。

    Semiconductor device having multilayer wiring structure
    3.
    发明授权
    Semiconductor device having multilayer wiring structure 有权
    具有多层布线结构的半导体装置

    公开(公告)号:US07719117B2

    公开(公告)日:2010-05-18

    申请号:US11828727

    申请日:2007-07-26

    IPC分类号: H01L23/48

    摘要: A semiconductor device includes a semiconductor substrate, a lower wiring layer formed on the semiconductor substrate, a first interlayer insulating film formed on the lower wiring layer and including a first upper surface and a second upper surface, the first upper surface being higher than the second upper surface relative to a surface of the semiconductor substrate, a contact plug formed in the interlayer insulating film and including a first bottom surface contacting to the lower wiring layer, a third upper surface flush with the second upper surface and a fourth upper surface flush with the first upper surface, an upper wiring layer formed on the first and third upper surfaces and including a first side surface and a second side surface opposite to the first side surface, and a second interlayer insulating film formed on the second and fourth upper surfaces.

    摘要翻译: 半导体器件包括半导体衬底,形成在半导体衬底上的下部布线层,形成在下部布线层上并包括第一上表面和第二上表面的第一层间绝缘膜,第一上表面高于第二上表面 相对于半导体基板的表面的上表面,形成在层间绝缘膜中并包括与下布线层接触的第一底面的接触塞,与第二上表面齐平的第三上表面和与第二上表面齐平的第四上表面 所述第一上表面,形成在所述第一和第三上表面上并包括第一侧表面和与所述第一侧表面相对的第二侧表面的上布线层,以及形成在所述第二和第四上表面上的第二层间绝缘膜。

    HEAT-SHRINKABLE POLYESTER FILM ROLL AND A PROCESS FOR PRODUCING THE SAME
    4.
    发明申请
    HEAT-SHRINKABLE POLYESTER FILM ROLL AND A PROCESS FOR PRODUCING THE SAME 审中-公开
    热收缩聚酯薄膜滚筒及其制造方法

    公开(公告)号:US20080284057A1

    公开(公告)日:2008-11-20

    申请号:US11933673

    申请日:2007-11-01

    IPC分类号: B29C47/88 C08L67/00

    摘要: A film roll of a heat-shrinkable polyester film meeting the following requirements: (1) when samples are cut off therefrom at an almost equal interval along the longitudinal direction, and immersed in hot water at 85° C. for 10 seconds, subsequently in water at 25° C. and withdrawn, heat-shrinkage percentages in the maximum shrinkage direction of all the samples are 20% or more; and (2) when raw polymers used for production of the film above comprises of a major constitutional unit and one or more sub constitutional units different therefrom, and the content of the primary sub constitutional unit in each sample is more than 7 mole % in 100% of all constitutional units, and the contents of the primary sub constitutional unit of all the samples fall within a range of ±2 mole % relative to the average.

    摘要翻译: 一种热收缩聚酯薄膜的卷筒,其满足以下要求:(1)当沿着纵向以几乎相等的间隔切割样品时,将其浸入85℃的热水中10秒钟,随后在 25℃下的水分,所有样品的最大收缩方向的热收缩百分比为20%以上; 和(2)当用于生产上述膜的原料聚合物包含主要结构单元和一个或多个与其不同的亚结构单元时,每个样品中的初级次级结构单元的含量大于100摩尔% 所有结构单位的百分比,所有样品的主要次级结构单位的含量相对于平均值在±2摩尔%的范围内。

    SEMICONDUCTOR DEVICE HAVING MULTILAYER WIRING STRUCTURE
    5.
    发明申请
    SEMICONDUCTOR DEVICE HAVING MULTILAYER WIRING STRUCTURE 有权
    具有多层布线结构的半导体器件

    公开(公告)号:US20080036089A1

    公开(公告)日:2008-02-14

    申请号:US11828727

    申请日:2007-07-26

    IPC分类号: H01L23/52

    摘要: A semiconductor device includes a semiconductor substrate, and an interlayer wiring structure further including a lower wiring layer formed on the semiconductor substrate, a first interlayer an interlayer wiring layer including an interlayer insulating film formed on the lower wiring layer and including a first upper surface and a second upper surface, the first upper surface being higher than the second upper surface relative to a surface of the semiconductor substrate, a contact plug formed in the interlayer insulating film and including a first bottom surface contacting to the lower wiring layer, a third upper surface flush with the second upper surface and a fourth upper surface flush with the first upper surface, an upper wiring layer formed on the first and third upper surfaces and including a first side surface and a second side surface opposite to the first side surface, and a second interlayer insulating film formed on the second and fourth upper surfaces. a plurality of contact plugs each formed so as to extend through the interlayer insulating film to be brought into electrical contact with the lower wiring layer, an upper wiring layer patterned so as to be in electrical contact with upper faces of the contact plugs, and a recessed portion formed by recessing the interlayer insulating film and the contact plugs exposed in the interlayer wiring layer with respect to at least a portion with a short distance between wirings so as to correspond to a shape of the upper wiring layer.

    摘要翻译: 半导体器件包括半导体衬底和还包括形成在半导体衬底上的下布线层的层间布线结构,第一层间夹层,形成在下布线层上并包括第一上表面的层间绝缘膜, 第二上表面,第一上表面相对于半导体衬底的表面高于第二上表面;形成在层间绝缘膜中并包括与下布线层接触的第一底表面的接触塞,第三上表面 与第二上表面齐平,第四上表面与第一上表面齐平,上布线层形成在第一和第三上表面上,并且包括第一侧表面和与第一侧表面相对的第二侧表面,以及 形成在第二和第四上表面上的第二层间绝缘膜。 多个接触插塞各自形成为延伸穿过层间绝缘膜以与下布线层电接触,图案化以与触头的上表面电接触的上布线层,以及 相对于布线之间的短距离的至少一部分,使层间绝缘膜和暴露在层间布线层中的接触插塞凹陷而形成的凹部,以对应于上布线层的形状。

    Heat-shrinkable polyester film
    6.
    发明授权
    Heat-shrinkable polyester film 有权
    热收缩聚酯薄膜

    公开(公告)号:US07001651B2

    公开(公告)日:2006-02-21

    申请号:US10491145

    申请日:2002-07-09

    IPC分类号: B32B7/00 C08G63/52

    摘要: Disclosed is a heat-shrinkable polyester film having a specific composition. A heat shrinkage factor of a 10 cm square sample of the film in a maximal shrinkage direction of the film is not less than 20% under the condition that the sample is immersed in hot water of 85° C. for 10 seconds, and then in water of 25° C. for 10 seconds. The number of test pieces of the film having a rupture ratio of not more than 5% is not more than 10% to the total number of the test pieces under the condition that a tensile test of drawing the film in a direction orthogonal to the maximal shrinkage direction of the film is conducted with a distance between corresponding chucks of 100 mm, each test piece having 15 mm in width, a temperature of 23° C., and a drawing rate of 200 mm/min.

    摘要翻译: 公开了具有特定组成的热收缩性聚酯膜。 在将样品浸入85℃的热水中10秒的条件下,膜的最大收缩方向的10cm见方的样品的热收缩率不小于20%,然后在 水25℃10秒。 断裂率为5%以下的膜的试验片数​​相对于试验片的总数不超过10%,条件是在与最大值正交的方向上拉伸膜的拉伸试验 膜的收缩方向以相应的卡盘之间的距离为100mm进行,每个试样的宽度为15mm,温度为23℃,拉伸速度为200mm / min。

    Junction box having a plurality of main casings and connectors designed for use with different types of automobiles
    7.
    发明授权
    Junction box having a plurality of main casings and connectors designed for use with different types of automobiles 有权
    接线盒具有多个主壳体和设计用于不同类型汽车的连接器

    公开(公告)号:US06846183B2

    公开(公告)日:2005-01-25

    申请号:US10725060

    申请日:2003-12-02

    摘要: A junction box comprises small size standard boxes. The small size standard box includes a main casing that contains many longitudinal bus bars disposed in parallel with one another at a given interval in distance therein, and male and female coupling portions provided on the outer opposite side surfaces of the main casing. Plural small size standard boxes are juxtaposed together in accordance with different kinds of automobile vehicles by interconnecting the male and female coupling portions successively. A lower casing member is attached to the main casing. The size of the lower casing member depends on the number of the standard boxes to be coupled for a special purpose. The lower casing member is provided with an attachment portion for a vehicle body projecting from the member.

    摘要翻译: 接线盒包括小尺寸标准盒。 小尺寸标准箱包括主壳体,其包含以规定间隔彼此平行地设置的多个纵向母线,以及设置在主壳体的相对侧面上的公耦合部分和阴连接部分。 根据不同种类的汽车,多个小尺寸的标准盒通过连接阳连接部和阴连接部而并置在一起。 下壳体构件附接到主壳体。 下壳体构件的尺寸取决于用于特殊目的要联接的标准箱的数量。 下壳体构件设置有用于从构件突出的车身的附接部。

    Joining Structure for junction box and electrical component connector block
    8.
    发明授权
    Joining Structure for junction box and electrical component connector block 有权
    接线盒和电气元件连接器块的接合结构

    公开(公告)号:US06753472B2

    公开(公告)日:2004-06-22

    申请号:US10441092

    申请日:2003-05-20

    申请人: Katsuya Ito

    发明人: Katsuya Ito

    IPC分类号: H02G308

    摘要: A connecting structure between an adjacently aligned junction box and electrical component connector block includes a connector block having an insertion bracket around which a channel or groove is formed at an insertion bracket base portion. This channel or groove is configured such that the point of material failure or fracture occurs on the connector block in the event that the connecting structure is subject to a large externally induced load.

    摘要翻译: 在相邻对准的接线盒和电气部件连接器块之间的连接结构包括具有插入支架的连接器块,在插入支架基部处形成有槽或槽。 该通道或凹槽被构造成使得在连接结构受到大的外部引起的负载的情况下,在连接器块上发生材料故障或断裂的点。

    Heat-shrinkable polyester films
    9.
    发明授权
    Heat-shrinkable polyester films 有权
    热收缩聚酯薄膜

    公开(公告)号:US06465063B1

    公开(公告)日:2002-10-15

    申请号:US09967963

    申请日:2001-10-02

    IPC分类号: B23B2700

    摘要: Heat-shrinkable polyester films, each having a heat shrinkability of 40% or higher in the main shrinkage direction of the film after treatment in hot water at 80° C. for 10 seconds, the change of heat shrinkability in the main shrinkage direction of the film after treatment in hot water at 55-75° C. for 10 seconds before and after the film is left under an atmosphere at 40° C. for 160 hours being 15% or lower, exhibit beautiful shrinkage finish in appearance involving only rare occurrence of shrinkage spots, wrinkles, strains, folding and other defects during shrinkage in the step of shrinking with hot air, and in particular, exhibit a quite small lowering in shrinkage finish after a lapse of time for storage and have low spontaneous shrinkability; therefore, these films are suitably used for applications such as labels and cap seals.

    摘要翻译: 在80℃的热水中处理10秒后,膜的主收缩方向的热收缩率为40%以上的热收缩性聚酯膜,在主收缩方向上的热收缩率的变化为 薄膜在热水中在55-75℃下处理10秒,该膜在40℃的气氛下放置160小时,为15%或更低,在外观上仅显现出罕见的收缩率 在用热空气收缩的步骤中收缩期间的收缩斑点,皱纹,应变,折叠等缺陷,特别是在经过保存时间后,收缩率的降低显着降低,自发收缩性低; 因此,这些膜适用于诸如标签和盖子密封件的应用。

    Void-containing composite film of polyester type
    10.
    发明授权
    Void-containing composite film of polyester type 失效
    聚酯型空隙复合膜

    公开(公告)号:US5422175A

    公开(公告)日:1995-06-06

    申请号:US67813

    申请日:1993-05-27

    摘要: A void-containing composite film including (A) a polyester base layer containing voids composed mainly of a polymer mixture of a polyester and a thermoplastic resin which is not compatible with the polyester and is selected from the group of polystyrene resins, polyolefin resins, polyacrylic resins, polycarbonate resins, polysulfone resins, cellulose resins, polysiloxane resins and silicone resins, and (B) at least one outer surface layer composed mainly of polyethylene terephthalate and formed on at least one side of the polyester base layer (A), the polyester base layer (A) and the at least one outer surface layer (B) being formed into a composite film by co-extrusion, followed by orientation in at least one direction, the void percentage of a surface portion having 3 .mu.m thickness from the surface of the polyester base layer (A) is 8% by volume or less, the average void percentage of the composite film is 10% to 50% by volume, and the composite film has substantially no voids at the interface between the polyester base layer (A) and the outer surface layer (B).

    摘要翻译: 一种含空隙复合膜,其包括(A)聚酯基层,其主要由聚酯与热塑性树脂的聚合物混合物构成,所述聚合物基层与聚酯不相容,并且选自聚苯乙烯树脂,聚烯烃树脂,聚丙烯酸 树脂,聚碳酸酯树脂,聚砜树脂,纤维素树脂,聚硅氧烷树脂和有机硅树脂,以及(B)主要由聚对苯二甲酸乙二醇酯构成的至少一个外表面层,形成在聚酯基层(A)的至少一面上,聚酯 基底层(A)和至少一个外表面层(B)通过共挤出形成复合膜,然后在至少一个方向上取向,从具有3μm厚度的表面部分的空隙率 聚酯基层(A)的表面为8体积%以下,复合膜的平均空隙率为10〜50体积%,复合膜在第 e接合在聚酯基层(A)和外表面层(B)之间。