公开(公告)号：US20130119479A1

公开(公告)日：2013-05-16

申请号：US13736951

申请日：2013-01-09

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Wen-Han Hung ,  Tsai-Fu Chen ,  Shyh-Fann Ting ,  Cheng-Tung Huang ,  Kun-Hsien Lee ,  Ta-Kang Lo ,  Tzyy-Ming Cheng

IPC: H01L27/092

CPC classification number: H01L27/092 ,  H01L21/823807 ,  H01L21/823814 ,  H01L29/665 ,  H01L29/6656 ,  H01L29/66628 ,  H01L29/7848

Abstract: A transistor structure is provided in the present invention. The transistor structure includes: a substrate comprising a N-type well, a gate disposed on the N-type well, a spacer disposed on the gate, a first lightly doped region in the substrate below the spacer, a P-type source/drain region disposed in the substrate at two sides of the gate, a silicon cap layer covering the P-type source/drain region and the first lightly doped region and a silicide layer disposed on the silicon cap layer, and covering only a portion of the silicon cap layer.

Abstract translation: 在本发明中提供一种晶体管结构。 晶体管结构包括：包括N型阱的衬底，设置在N型阱上的栅极，设置在栅极上的间隔物，位于衬垫下方的衬底中的第一轻掺杂区域，P型源极/漏极 位于栅极两侧的衬底中的覆盖P型源/漏区和第一轻掺杂区的硅帽层和设置在硅帽层上的硅化物层，并且仅覆盖硅的一部分 盖层。

公开(公告)号：US12283637B2

公开(公告)日：2025-04-22

申请号：US17976888

申请日：2022-10-31

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Jian-Li Lin ,  Wei-Da Lin ,  Cheng-Guo Chen ,  Ta-Kang Lo ,  Yi-Chuan Chen ,  Huan-Chi Ma ,  Chien-Wen Yu ,  Kuan-Ting Lu ,  Kuo-Yu Liao

IPC: H01L29/94 ,  H01L29/66

Abstract: A MOS capacitor includes a substrate having a capacitor forming region thereon, an ion well having a first conductivity type in the substrate, a counter doping region having a second conductivity type in the ion well within the capacitor forming region, a capacitor dielectric layer on the ion well within the capacitor forming region, a gate electrode on the capacitor dielectric layer, a source doping region having the second conductivity type on a first side of the gate electrode within the capacitor forming region, and a drain doping region having the second conductivity type on a second side of the gate electrode within the capacitor forming region.

公开(公告)号：US20230335630A1

公开(公告)日：2023-10-19

申请号：US17742383

申请日：2022-05-11

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Jian-Li Lin ,  Cheng-Guo Chen ,  Ta-Kang Lo ,  Cheng-Han Wu

IPC: H01L29/778 ,  H01L29/66 ,  H01L29/40

CPC classification number: H01L29/7786 ,  H01L29/66462 ,  H01L29/404

Abstract: A high-electron mobility transistor includes a substrate, a gate electrode, a drain electrode, a source electrode and a first field plate. The substrate includes an active region. The gate electrode is disposed on the substrate. The drain electrode is disposed at one side of the gate electrode. The source electrode is disposed at another side of the gate electrode. The first field plate is electrically connected with the source electrode and extends from the source electrode toward the drain electrode. An overlapping area of the first field plate and the gate electrode is smaller than an overlapping area of the gate electrode and the active region.

公开(公告)号：US20180122705A1

公开(公告)日：2018-05-03

申请号：US15342114

申请日：2016-11-02

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Tai-You Chen ,  Cheng-Guo Chen ,  Kun-Yuan Wu ,  Chiu-Sheng Ho ,  Po-Kang Yang ,  Ta-Kang Lo ,  Shang-Jr Chen

IPC: H01L21/8238 ,  H01L27/092 ,  H01L29/66 ,  H01L21/306 ,  H01L21/308 ,  H01L21/28 ,  H01L29/49

CPC classification number: H01L21/823807 ,  H01L21/28088 ,  H01L21/30604 ,  H01L21/308 ,  H01L21/823412 ,  H01L21/823431 ,  H01L21/823821 ,  H01L21/823842 ,  H01L27/088 ,  H01L27/0922 ,  H01L27/0924 ,  H01L29/4966 ,  H01L29/66545 ,  H01L29/785

Abstract: First, a substrate having a first region and a second region is provided, a first gate structure is formed on the first region and a second gate structure is formed on the second region, an interlayer dielectric (ILD) layer is formed around the first gate structure and the second gate structure, and the first gate structure and the second gate structure are removed to expose the substrate on the first region and the second region. Next, part of the substrate on the first region is removed to form a first recess and part of the substrate on the second region is removed to form a second recess, in which the depths of the first recess and the second recess are different. Next, a first metal gate is formed on the first region and a second metal gate is formed on the second region.

公开(公告)号：US09634002B1

公开(公告)日：2017-04-25

申请号：US15057079

申请日：2016-02-29

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Chia-Chen Tsai ,  Hung-Chang Chang ,  Ta-Kang Lo ,  Tsai-Fu Chen ,  Shang-Jr Chen

IPC: H01L27/08 ,  H01L27/088 ,  H01L29/78 ,  H01L21/8234 ,  H01L21/311 ,  H01L29/66 ,  H01L29/165

CPC classification number: H01L21/823468 ,  H01L21/31144 ,  H01L21/823412 ,  H01L21/823418 ,  H01L21/823431 ,  H01L21/823437 ,  H01L21/823807 ,  H01L21/823814 ,  H01L21/823864 ,  H01L27/088 ,  H01L27/0886 ,  H01L27/092 ,  H01L29/165 ,  H01L29/6656 ,  H01L29/66636 ,  H01L29/7848

Abstract: A semiconductor device and method of manufacturing the same are provided in the present invention. Multiple spacer layers are used in the invention to form spacers with different predetermined thickness on different active regions or devices, thus the spacing between the strained silicon structure and the gate structure (SiGe-to-Gate) can be properly controlled and adjusted to achieve better and more uniform performance for various devices and circuit layouts.

公开(公告)号：US08823109B2

公开(公告)日：2014-09-02

申请号：US13736951

申请日：2013-01-09

Applicant: United Microelectronics Corp.

Inventor： Wen-Han Hung ,  Tsai-Fu Chen ,  Shyh-Fann Ting ,  Cheng-Tung Huang ,  Kun-Hsien Lee ,  Ta-Kang Lo ,  Tzyy-Ming Cheng

IPC: H01L29/76 ,  H01L29/94 ,  H01L27/092

CPC classification number: H01L27/092 ,  H01L21/823807 ,  H01L21/823814 ,  H01L29/665 ,  H01L29/6656 ,  H01L29/66628 ,  H01L29/7848

Abstract: A transistor structure is provided in the present invention. The transistor structure includes: a substrate comprising a N-type well, a gate disposed on the N-type well, a spacer disposed on the gate, a first lightly doped region in the substrate below the spacer, a P-type source/drain region disposed in the substrate at two sides of the gate, a silicon cap layer covering the P-type source/drain region and the first lightly doped region and a silicide layer disposed on the silicon cap layer, and covering only a portion of the silicon cap layer.

Abstract translation: 在本发明中提供一种晶体管结构。 晶体管结构包括：包括N型阱的衬底，设置在N型阱上的栅极，设置在栅极上的间隔物，位于衬垫下方的衬底中的第一轻掺杂区域，P型源极/漏极 位于栅极两侧的衬底中的覆盖P型源/漏区和第一轻掺杂区的硅帽层和设置在硅帽层上的硅化物层，并且仅覆盖硅的一部分 盖层。

公开(公告)号：US20230048684A1

公开(公告)日：2023-02-16

申请号：US17976888

申请日：2022-10-31

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Jian-Li Lin ,  Wei-Da Lin ,  Cheng-Guo Chen ,  Ta-Kang Lo ,  Yi-Chuan Chen ,  Huan-Chi Ma ,  Chien-Wen Yu ,  Kuan-Ting Lu ,  Kuo-Yu Liao

IPC: H01L29/94 ,  H01L29/66

Abstract: A MOS capacitor includes a substrate having a capacitor forming region thereon, an ion well having a first conductivity type in the substrate, a counter doping region having a second conductivity type in the ion well within the capacitor forming region, a capacitor dielectric layer on the ion well within the capacitor forming region, a gate electrode on the capacitor dielectric layer, a source doping region having the second conductivity type on a first side of the gate electrode within the capacitor forming region, and a drain doping region having the second conductivity type on a second side of the gate electrode within the capacitor forming region.

公开(公告)号：US09960083B1

公开(公告)日：2018-05-01

申请号：US15342114

申请日：2016-11-02

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Tai-You Chen ,  Cheng-Guo Chen ,  Kun-Yuan Wu ,  Chiu-Sheng Ho ,  Po-Kang Yang ,  Ta-Kang Lo ,  Shang-Jr Chen

IPC: H01L21/8238 ,  H01L27/092 ,  H01L29/66 ,  H01L21/306 ,  H01L21/308 ,  H01L21/28 ,  H01L29/49

CPC classification number: H01L21/823807 ,  H01L21/28088 ,  H01L21/30604 ,  H01L21/308 ,  H01L21/823412 ,  H01L21/823431 ,  H01L21/823821 ,  H01L21/823842 ,  H01L27/088 ,  H01L27/0922 ,  H01L27/0924 ,  H01L29/4966 ,  H01L29/66545 ,  H01L29/785

Abstract: First, a substrate having a first region and a second region is provided, a first gate structure is formed on the first region and a second gate structure is formed on the second region, an interlayer dielectric (ILD) layer is formed around the first gate structure and the second gate structure, and the first gate structure and the second gate structure are removed to expose the substrate on the first region and the second region. Next, part of the substrate on the first region is removed to form a first recess and part of the substrate on the second region is removed to form a second recess, in which the depths of the first recess and the second recess are different. Next, a first metal gate is formed on the first region and a second metal gate is formed on the second region.

公开(公告)号：US09779998B2

公开(公告)日：2017-10-03

申请号：US15450037

申请日：2017-03-06

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Chia-Chen Tsai ,  Hung-Chang Chang ,  Ta-Kang Lo ,  Tsai-Fu Chen ,  Shang-Jr Chen

IPC: H01L21/82 ,  H01L21/8234 ,  H01L21/8238 ,  H01L27/092 ,  H01L29/78

CPC classification number: H01L21/823468 ,  H01L21/31144 ,  H01L21/823412 ,  H01L21/823418 ,  H01L21/823431 ,  H01L21/823437 ,  H01L21/823807 ,  H01L21/823814 ,  H01L21/823864 ,  H01L27/088 ,  H01L27/0886 ,  H01L27/092 ,  H01L29/165 ,  H01L29/6656 ,  H01L29/66636 ,  H01L29/7848

Abstract: A method of manufacturing a semiconductor device is provided in the present invention. Multiple spacer layers are used in the invention to form spacers with different predetermined thickness on different active regions or devices, thus the spacing between the strained silicon structure and the gate structure (SiGe-to-Gate) can be properly controlled and adjusted to achieve better and more uniform performance for various devices and circuit layouts.

公开(公告)号：US20170221766A1

公开(公告)日：2017-08-03

申请号：US15450037

申请日：2017-03-06

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Chia-Chen Tsai ,  Hung-Chang Chang ,  Ta-Kang Lo ,  Tsai-Fu Chen ,  Shang-Jr Chen

IPC: H01L21/8234 ,  H01L27/092 ,  H01L21/8238

CPC classification number: H01L21/823468 ,  H01L21/31144 ,  H01L21/823412 ,  H01L21/823418 ,  H01L21/823431 ,  H01L21/823437 ,  H01L21/823807 ,  H01L21/823814 ,  H01L21/823864 ,  H01L27/088 ,  H01L27/0886 ,  H01L27/092 ,  H01L29/165 ,  H01L29/6656 ,  H01L29/66636 ,  H01L29/7848

Abstract: A method of manufacturing a semiconductor device is provided in the present invention. Multiple spacer layers are used in the invention to form spacers with different predetermined thickness on different active regions or devices, thus the spacing between the strained silicon structure and the gate structure (SiGe-to-Gate) can be properly controlled and adjusted to achieve better and more uniform performance for various devices and circuit layouts.