公开(公告)号：US12165921B2

公开(公告)日：2024-12-10

申请号：US17723413

申请日：2022-04-18

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Enrique Sarile, Jr. ,  Chee Kay Chow ,  Dzafir Bin Mohd Shariff

IPC: H01L21/78 ,  B23Q1/03 ,  H01J37/32 ,  H01L21/67 ,  H01L21/683

Abstract: A wafer adaptor ring assembly for adapting an adapted sized wafer for plasma dicing by a plasma etch chamber designed for dicing a designed sized wafer, which is larger than the adapted sized wafer is disclosed. The wafer adaptor ring assembly includes a primary wafer ring designed for plasma dicing the designed sized wafer by the plasma, an adhesive sheet attached to a bottom surface of the primary wafer ring, and an adapted sized wafer disposed on the adhesive sheet between the primary wafer ring and the adapted sized wafer. A method for forming the wafer adaptor ring assembly is also disclosed.

公开(公告)号：US10566369B2

公开(公告)日：2020-02-18

申请号：US15839884

申请日：2017-12-13

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Tim Thian Hwee Tan ,  Boon Pek Liew ,  Chee Kay Chow ,  Teddy Joaquin Carreon

IPC: H01L27/146 ,  H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00

Abstract: A semiconductor package and a method for forming a semiconductor package are disclosed. The semiconductor package includes a multi-layer package substrate having interconnect structures embedded therein. A sensor chip having an image sensing element is disposed on a top surface of the package substrate, and an integrated circuit is mounted to a bottom surface of the package substrate. The integrated circuit is a flip-chip assembly. The sensor chip is electrically connected to the integrated circuit. An adhesive material bonds a transparent covering member to the sensor chip to enclose the image sensing element.

公开(公告)号：US20240136217A1

公开(公告)日：2024-04-25

申请号：US18490741

申请日：2023-10-18

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Hua Hong Tan ,  Chee Kay Chow ,  Zong Xiang Cai ,  Wei Ming Xian ,  Yao Hong Wu ,  Wing Keung Lam

IPC: H01L21/683 ,  H01L21/48 ,  H01L21/67 ,  H01L21/677

CPC classification number: H01L21/6838 ,  H01L21/4867 ,  H01L21/6715 ,  H01L21/67259 ,  H01L21/67736 ,  H01L21/67742 ,  H01L21/67766

Abstract: A manufacturing system includes a substrate disposed on a conveyer system. The conveyer system includes a pair of side supports. The substrate is moved on the conveyer system until the substrate is disposed over a bottom support block. The bottom support block is raised to physically contact the substrate. A transfer arm module is provided. The transfer arm module includes a flat bottom surface and an opening formed in the flat bottom surface. The transfer arm module is disposed with the flat bottom surface physically contacting the substrate opposite the bottom support block. A vacuum is enabled through the opening of the transfer arm module. The substrate is lifted off the bottom support block using the vacuum. The substrate is moved over a printing pallet using the transfer arm module. The vacuum is disabled when the substrate is in a positioning area of the printing pallet.

公开(公告)号：US11177301B2

公开(公告)日：2021-11-16

申请号：US16687659

申请日：2019-11-18

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Hua Hong Tan ,  Chee Kay Chow ,  Thian Hwee Tan ,  Wedanni Linsangan Micla ,  Enrique Jr Sarile ,  Mario Arwin Fabian ,  Dennis Tresnado ,  Antonino Ii Milanes ,  Ming Koon Ang ,  Kian Soo Lim ,  Mauro Jr. Dionisio ,  Teddy Joaquin Carreon

IPC: H01L27/14 ,  H01L27/146

Abstract: A method for forming a semiconductor package is disclosed. The method includes providing a package substrate having top and bottom major package substrate surfaces, the top major package surface including a die attach region. A die having first and second major die surfaces is attached onto the die attach region. The second major die surface is attached to the die attach region. The first major die surface includes an die active region and a cover adhesive region surrounding the die active region. The method also includes applying a cover adhesive to the cover adhesive region on the first major die surface. A protective cover with first and second major cover surfaces and side surfaces is attached to the die using the cover adhesive. The second major cover surface contacts the cover adhesive. The protective cover covers the die active region. The protective cover includes a discontinuity on at least one of the side surfaces. An encapsulant is disposed on the package substrate to cover exposed portions of the package substrate, die and bond wires and side surfaces of the protective cover, while leaving the first major cover surface exposed. The discontinuity enhances adhesion of the encapsulant to the protective cover.

公开(公告)号：US20220336283A1

公开(公告)日：2022-10-20

申请号：US17722416

申请日：2022-04-18

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Enrique Jr Sarile ,  Chee Kay Chow ,  Dzafir Bin Mohd Shariff

IPC: H01L21/78 ,  H01L21/683 ,  H01L21/67

Abstract: A wafer adaptor ring assembly for adapting an adapted sized wafer for plasma dicing by a plasma etch chamber designed for dicing a designed sized wafer, which is larger than the adapted sized wafer is disclosed. The wafer adaptor ring assembly includes a primary wafer ring designed for plasma dicing the designed sized wafer by the plasma, an adhesive sheet attached to a bottom surface of the primary wafer ring, and an adapted sized wafer disposed on the adhesive sheet between the primary wafer ring and the adapted sized wafer. A system for assembling and disassembling the wafer adaptor ring assembly is also disclosed.

公开(公告)号：US20220331917A1

公开(公告)日：2022-10-20

申请号：US17723413

申请日：2022-04-18

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Enrique Sarile, JR. ,  Chee Kay Chow ,  Dzafir Bin Mohd Shariff

IPC: B23Q1/03 ,  H01L21/683 ,  H01J37/32

Abstract: A wafer adaptor ring assembly for adapting an adapted sized wafer for plasma dicing by a plasma etch chamber designed for dicing a designed sized wafer, which is larger than the adapted sized wafer is disclosed. The wafer adaptor ring assembly includes a primary wafer ring designed for plasma dicing the designed sized wafer by the plasma, an adhesive sheet attached to a bottom surface of the primary wafer ring, and an adapted sized wafer disposed on the adhesive sheet between the primary wafer ring and the adapted sized wafer. A method for forming the wafer adaptor ring assembly is also disclosed.

公开(公告)号：US20250038037A1

公开(公告)日：2025-01-30

申请号：US18393621

申请日：2023-12-21

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： IL KWON SHIM ,  Dzafir Bin Mohd Shariff ,  Ronnie M. De Villa ,  Enrique E. SARILE, JR. ,  Chee Kay Chow ,  Jackson Fernandez Rosario ,  Chan Loong Neo

IPC: H01L21/683 ,  H01L21/67 ,  H01L21/687

Abstract: Lamination systems and methods of fabricating devices are disclosed. The lamination system includes multiple processing modules for delaminating a backgrinding (BG) from a surface of the wafer and laminating a dicing tape on the surface of the wafer. The system includes a wafer receiving module which is configured to hold the wafer in place with a position chuck throughout the delamination and lamination process. By using a single positioning chuck, more efficient processing is achieved. For example, there is no need to re-lign the wafer when it is moved from one chuck to another.

公开(公告)号：US20240234195A9

公开(公告)日：2024-07-11

申请号：US18490741

申请日：2023-10-19

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Hua Hong Tan ,  Chee Kay Chow ,  Zong Xiang Cai ,  Wei Ming Xian ,  Yao Hong Wu ,  Wing Keung Lam

IPC: H01L21/683 ,  H01L21/48 ,  H01L21/67 ,  H01L21/677

CPC classification number: H01L21/6838 ,  H01L21/4867 ,  H01L21/6715 ,  H01L21/67259 ,  H01L21/67736 ,  H01L21/67742 ,  H01L21/67766

Abstract: A manufacturing system includes a substrate disposed on a conveyer system. The conveyer system includes a pair of side supports. The substrate is moved on the conveyer system until the substrate is disposed over a bottom support block. The bottom support block is raised to physically contact the substrate. A transfer arm module is provided. The transfer arm module includes a flat bottom surface and an opening formed in the flat bottom surface. The transfer arm module is disposed with the flat bottom surface physically contacting the substrate opposite the bottom support block. A vacuum is enabled through the opening of the transfer arm module. The substrate is lifted off the bottom support block using the vacuum. The substrate is moved over a printing pallet using the transfer arm module. The vacuum is disabled when the substrate is in a positioning area of the printing pallet.

公开(公告)号：US20240055292A1

公开(公告)日：2024-02-15

申请号：US18448667

申请日：2023-08-11

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Roel Adeva Robles ,  Chee Kay Chow

IPC: H01L21/683

CPC classification number: H01L21/6836 ,  H01L2221/68354 ,  H01L2221/68309 ,  H01L2221/68318

Abstract: A first carrier has a first plate. A tape is disposed on the first plate. A second plate is disposed over the first plate. The second plate has a trench aligned to the tape and an opening formed through the second plate over the tape. A singulated semiconductor package is disposed on the tape in the opening of the second plate. A second carrier has a static datum and a movable datum. The movable datum is moved toward the static datum. An aperture substrate is disposed around the static datum and movable datum. A manufacturing process is performed on the aperture substrate.