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    ELECTRONIC DEVICES WITH IMPROVED SHELF LIVES
    2.
    发明申请
    ELECTRONIC DEVICES WITH IMPROVED SHELF LIVES 有权
    具有改进的生活的电子设备

    公开(公告)号：US20130334510A1

    公开(公告)日：2013-12-19

    申请号：US13917137

    申请日：2013-06-13

    Applicant: Universal Display Corporation

    Inventor： Prashant Mandlik ,  Ruiqing Ma ,  Siddharth Harikrishna Mohan

    IPC: H01L51/52

    CPC classification number: H01L51/5203 ,  H01L51/50 ,  H01L51/52 ,  H01L51/5212 ,  H01L51/5253

    Abstract: Embodiments of the present invention provide electronic devices such as OLEDs that have enhanced mechanical integrity and prolonged shelf, by minimizing the spread of a delamination region using topographical non-uniformities introduced in the device structure. For example, a device may be made deliberately non-planar by introducing multiple energy barriers which can prevent or minimize the propagation of a delamination, because the delamination will have to cross the energy barriers in order to spread to a larger area.

    Abstract translation: 本发明的实施例通过使用在设备结构中引入的形貌不均匀性最小化分层区域的扩展来提供诸如具有增强的机械完整性和延长搁架的OLED的电子器件。 例如，通过引入可以防止或最小化分层的传播的多个能量屏障，可以有意地制造非平面装置，因为分层必须穿过能量屏障以扩散到更大的区域。

    Flexible Lighting Devices
    6.
    发明申请
    Flexible Lighting Devices 审中-公开
    柔性照明设备

    公开(公告)号：US20140248727A1

    公开(公告)日：2014-09-04

    申请号：US14202430

    申请日：2014-03-10

    Applicant: Universal Display Corporation

    Inventor： Prashant Mandlik ,  Peter Levermore ,  Huiqing Pang ,  Emory Krall ,  Jason Paynter ,  Ruiqing Ma

    IPC: H01L51/56 ,  H01L51/00

    CPC classification number: H01L51/56 ,  H01L51/0097 ,  H01L2227/326 ,  H01L2251/5338 ,  Y02E10/549 ,  Y02P70/521

    Abstract: A first device and methods for manufacturing the first device are provided. The first device may comprise a flexible substrate and at least one organic light emitting device (OLED) disposed over the flexible substrate. The first device may have a flexural rigidity between 10−1 Nm and 10−6 Nm, and the ratio of the critical strain energy release rate to the material density factor for the first device may be greater than 0.05 J m/Kg.

    Abstract translation: 提供了用于制造第一装置的第一装置和方法。 第一器件可以包括柔性衬底和设置在柔性衬底上的至少一个有机发光器件（OLED）。 第一装置可以具有在10-1Nm至10-6Nm之间的弯曲刚度，并且临界应变能释放速率与第一装置的材料密度因子的比可以大于0.05Jm / Kg。

    MANUFACTURING FLEXIBLE ORGANIC ELECTRONIC DEVICES
    7.
    发明申请
    MANUFACTURING FLEXIBLE ORGANIC ELECTRONIC DEVICES 审中-公开
    制造柔性有机电子器件

    公开(公告)号：US20140166989A1

    公开(公告)日：2014-06-19

    申请号：US13716435

    申请日：2012-12-17

    Applicant: UNIVERSAL DISPLAY CORPORATION

    Inventor： Ruiqing Ma ,  Jeff Silvernail ,  Prashant Mandlik ,  Julia J. Brown ,  John Felts

    IPC: H01L51/00 ,  H01L51/50

    CPC classification number: H01L51/001 ,  C23C14/562 ,  C23C14/568 ,  H01L51/0021 ,  H01L51/0085 ,  H01L51/0097 ,  H01L51/50 ,  H01L51/5253 ,  H01L2251/5338 ,  H01L2251/56

    Abstract: A method of forming microelectronic systems on a flexible substrate includes depositing (typically sequentially) on a first side of the flexible substrate at least one organic thin film layer, at least one electrode and at least one thin film encapsulation layer over the at least one organic thin film layer and the at least one electrode, wherein depositing the at least one organic thin film layer, depositing the at least one electrode and depositing the at least one thin film encapsulation layer each occur under vacuum and wherein no physical contact of the at least one organic thin film layer or the at least one electrode with another solid material occurs prior to depositing the at least one thin film encapsulation layer.

    Abstract translation: 在柔性衬底上形成微电子系统的方法包括在柔性衬底的第一侧上沉积（通常顺序地）至少一个有机薄膜层，至少一个电极和至少一个有机薄膜封装层上的至少一个薄膜封装层 薄膜层和所述至少一个电极，其中沉积所述至少一个有机薄膜层，沉积所述至少一个电极并沉积所述至少一个薄膜封装层，每个都在真空下进行，并且其中至少一个 一个有机薄膜层或至少一个具有另一固体材料的电极在沉积至少一个薄膜封装层之前发生。

    Barrier film for electronic devices and substrates
    10.
    发明授权
    Barrier film for electronic devices and substrates 有权

    公开(公告)号：US10862073B2

    公开(公告)日：2020-12-08

    申请号：US14018449

    申请日：2013-09-05

    Applicant: Universal Display Corporation ,  The Trustees of Princeton University

    Inventor： Prashant Mandlik ,  Ruiqing Ma ,  Sigurd Wagner ,  Bhadrinarayana Lalgudi Visweswaran

    IPC: H01L51/56 ,  H01L51/52 ,  H01L51/00

    Abstract: Methods for forming a coating over a surface are disclosed. A method includes directing a first source of barrier film material toward a substrate in a first direction at an angle θ relative to the substrate, wherein θ is greater than about 0° and less than about 85°. Additionally, a method of depositing a barrier film over a substrate includes directing a plurality of N sources of barrier film material toward a substrate, each source being directed at an angle θN relative to the substrate, wherein for each θN, θ is greater than about 0° and less than about 180°. For at least a first of the θN, θN is greater than about 0° and less than about 85°, and for at least a second of the θN, θN is greater than about 95° and less than about 180°.

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