公开(公告)号：US09601460B2

公开(公告)日：2017-03-21

申请号：US14618413

申请日：2015-02-10

Applicant: XINTEC INC.

Inventor： Yen-Shih Ho ,  Tsang-Yu Liu ,  Chia-Sheng Lin ,  Chia-Ming Cheng ,  Shu-Ming Chang ,  Tzu-Wen Tseng

IPC: H01L23/06 ,  H01L23/00 ,  H01L23/31 ,  H01L29/06 ,  H01L23/525

CPC classification number: H01L24/94 ,  H01L23/3114 ,  H01L23/3178 ,  H01L23/525 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L29/0657 ,  H01L2224/0224 ,  H01L2224/02245 ,  H01L2224/02255 ,  H01L2224/0226 ,  H01L2224/02375 ,  H01L2224/02379 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05548 ,  H01L2224/05571 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05669 ,  H01L2224/06165 ,  H01L2224/10135 ,  H01L2224/10145 ,  H01L2224/94 ,  H01L2924/3512 ,  H01L2224/03 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/0665

Abstract: A chip package including a semiconductor substrate is provided. A recess is in the semiconductor substrate and adjoins a side edge of the semiconductor substrate, wherein the semiconductor substrate has at least one spacer protruding from the bottom of the recess. A conducting layer is disposed on the semiconductor substrate and extends into the recess.