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公开(公告)号：US20130344376A1
公开(公告)日：2013-12-26
申请号：US13695194
申请日：2012-03-01
IPC分类号： H01M2/02
CPC分类号： H01M2/0242 , H01M2/0262 , H01M2/0267 , H01M2/1077 , H01M2/1094 , H01M10/6555
摘要： The present invention provides a battery block that accommodates unit cells having higher capacities, and, even in case of abnormal heat generation in the unit cell, does not cause abnormal heat generation in the neighboring unit cells, thereby preventing a chain reaction of degradations and abnormalities of the accommodated unit cells. The battery block of the present invention includes a battery case having a minimum thickness section satisfying the relationship “K2/K1≧K3−1”. K1 is the thermal conductance between the battery case and the unit cell. K2 is the thermal conductance of the minimum thickness section of the battery case between two neighboring holes for accommodating the respective unit cells. K3 is a ratio between the abnormal heat temperature of a reference cell and the ambient temperature causing abnormal heat generation in this cell.
摘要翻译： 本发明提供了容纳具有较高容量的单电池的电池块，即使在单元电池中发生异常发热的情况下，也不会在相邻的单元电池中产生异常的发热，从而防止劣化和异常的链式反应 的容纳单元电池。 本发明的电池模块包括具有满足关系“K2 / K1> = K3-1”的最小厚度部分的电池盒。 K1是电池盒和单元电池之间的热导率。 K2是用于容纳各个单电池的两个相邻孔之间的电池壳体的最小厚度部分的热导率。 K3是参考电池的异常加热温度与引起该电池异常发热的环境温度之比。
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公开(公告)号：US09548477B2
公开(公告)日：2017-01-17
申请号：US13695194
申请日：2012-03-01
IPC分类号： H01M2/02 , H01M2/10 , H01M10/6555
CPC分类号： H01M2/0242 , H01M2/0262 , H01M2/0267 , H01M2/1077 , H01M2/1094 , H01M10/6555
摘要： The present invention provides a battery block that accommodates unit cells having higher capacities, and, even in case of abnormal heat generation in the unit cell, does not cause abnormal heat generation in the neighboring unit cells, thereby preventing a chain reaction of degradations and abnormalities of the accommodated unit cells. The battery block of the present invention includes a battery case having a minimum thickness section satisfying the relationship “K2/K1≧K3−1”. K1 is the thermal conductance between the battery case and the unit cell. K2 is the thermal conductance of the minimum thickness section of the battery case between two neighboring holes for accommodating the respective unit cells. K3 is a ratio between the abnormal heat temperature of a reference cell and the ambient temperature causing abnormal heat generation in this cell.
摘要翻译： 本发明提供了容纳具有较高容量的单电池的电池块，即使在单元电池中发生异常发热的情况下，也不会在相邻的单元电池中产生异常的发热，从而防止劣化和异常的链式反应 的容纳单元电池。 本发明的电池组包括电池壳体，其具有满足关系“K2 /K1≥K3-1”的最小厚度部分。 K1是电池盒和单元电池之间的热导率。 K2是用于容纳各个单电池的两个相邻孔之间的电池壳体的最小厚度部分的热导率。 K3是参考电池的异常加热温度与引起该电池异常发热的环境温度之比。
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公开(公告)号：US08835032B2
公开(公告)日：2014-09-16
申请号：US13813331
申请日：2011-05-02
IPC分类号： H01M10/50
CPC分类号： H01M2/1016 , H01M2/1022 , H01M2/1077 , H01M10/613 , H01M10/643 , H01M10/651 , H01M10/653 , H01M10/6555
摘要： A battery module in which the temperature of a cell with an increased high temperature due to an abnormal state can be quickly reduced so that the high temperature does not affect adjacent cells is provided.A battery module 200 has a configuration in which a plurality of cells 100 as secondary batteries are housed in a case 90 having a plurality of housing parts housing, but not in contact with, the cells 100, and when a gas is generated in one of the cells 100 to cause the cell 100 to expand, this cell 100 comes into contact with the associated one of the housing parts.
摘要翻译： 提供一种电池模块，其中可以快速降低由于异常状态而具有升高的高温的电池的温度，从而提供高温不影响相邻电池。 电池模块200具有这样的结构，其中作为二次电池的多个电池单元100被容纳在壳体90中，壳体90具有容纳但不与电池单元100接触的多个壳体部分，并且当在气体中产生气体 细胞100使细胞100膨胀，细胞100与相关联的一个外壳部分接触。
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公开(公告)号：US20130216884A1
公开(公告)日：2013-08-22
申请号：US13813331
申请日：2011-05-02
IPC分类号： H01M2/10
CPC分类号： H01M2/1016 , H01M2/1022 , H01M2/1077 , H01M10/613 , H01M10/643 , H01M10/651 , H01M10/653 , H01M10/6555
摘要： A battery module in which the temperature of a cell with an increased high temperature due to an abnormal state can be quickly reduced so that the high temperature does not affect adjacent cells is provided.A battery module 200 has a configuration in which a plurality of cells 100 as secondary batteries are housed in a case 90 having a plurality of housing parts housing, but not in contact with, the cells 100, and when a gas is generated in one of the cells 100 to cause the cell 100 to expand, this cell 100 comes into contact with the associated one of the housing parts.
摘要翻译： 提供一种电池模块，其中可以快速降低由于异常状态而具有升高的高温的电池的温度，从而提供高温不影响相邻电池。 电池模块200具有这样的结构，其中作为二次电池的多个电池单元100被容纳在壳体90中，壳体90具有容纳但不与电池单元100接触的多个壳体部分，并且当在气体中产生气体 细胞100使细胞100膨胀，细胞100与相关联的一个外壳部分接触。
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5.发明授权Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components 失效用于安装电子部件的加热和加压装置，以及用于安装电子部件的装置和方法公开(公告)号：US07490652B2
公开(公告)日：2009-02-17
申请号：US11235183
申请日：2005-09-27
CPC分类号： H01L24/75 , H01L21/563 , H01L21/67144 , H01L24/29 , H01L24/83 , H01L2224/1134 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/75317 , H01L2224/83192 , H01L2924/01006 , H01L2924/01033 , H01L2924/01039 , H01L2924/01079 , H01L2924/14 , H05K13/0469 , Y10T29/5313 , Y10T29/53174 , Y10T29/53178 , Y10T156/16 , Y10T156/17 , Y10T156/1702 , H01L2924/00
摘要： A heating and pressurizing apparatus (101), to which a circuit board (70) with electronic components (8) pre-bonded thereto via bonding elements (9) is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member (1211) having a heating device (122). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.
摘要翻译： 提供了一种加热加压装置（101），其上带有经由接合元件（9）与其预粘合的电子部件（8）的电路板（70）。 加热加压装置通过具有加热装置（122）的接触构件（1211）加热和加压电子部件，将电子部件与电路板进行后接合。 通过相互独立地执行电子部件到电路板的预接合和后接合，与现有的情况相比，可以降低后接合所需的时间，并且整个安装线的生产率 可以改进。
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公开(公告)号：US07076867B2
公开(公告)日：2006-07-18
申请号：US10327176
申请日：2002-12-24
申请人： Akihiro Yamamoto , Sakae Kobayashi , Yoshikazu Yoshimura , Naoto Hosotani , Kenji Takahashi , Hiroshi Nasu , Naomi Kaino , Hidenobu Nishikawa
发明人： Akihiro Yamamoto , Sakae Kobayashi , Yoshikazu Yoshimura , Naoto Hosotani , Kenji Takahashi , Hiroshi Nasu , Naomi Kaino , Hidenobu Nishikawa
IPC分类号： H05K3/30
CPC分类号： H01L21/67092 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49169 , Y10T29/5313 , Y10T29/5317 , Y10T156/1084
摘要： A pressurizing method for pressurizing a second component arranged on a first component, against the first component by using a pressurizing apparatus having a stage on which the first component is mounted, a tool, and a protection sheet supplying section. The tool is disposed so as to face the stage and moved between a first position at which the tool faces the first and second components while spaced therefrom, and a second position at which the tool is biased toward the stage to pressurize the second component against the first component. When the tool is at the second position, the protection sheet supplying section supplies a protection sheet so that the protection sheet is placed between the second component and the tool.
摘要翻译： 一种加压方法，用于通过使用具有安装有所述第一部件的台阶的加压装置，工具和保护片材供给部来将布置在第一部件上的第二部件加压抵靠所述第一部件。 该工具被设置为面对台架并且在第一位置和第二位置之间移动，在该第一位置，工具面向第一和第二部件同时与第一位置隔开;第二位置，工具被偏压到台阶以对第二部件施加压力， 第一部分。 当工具处于第二位置时，保护片供给部提供保护片，使得保护片放置在第二部件和工具之间。
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公开(公告)号：US06839959B1
公开(公告)日：2005-01-11
申请号：US09959756
申请日：2000-05-01
申请人： Naoto Hosotani , Youichi Nakamura , Wataru Hirai , Kunio Sakurai
发明人： Naoto Hosotani , Youichi Nakamura , Wataru Hirai , Kunio Sakurai
IPC分类号： H01L21/00 , H01L21/683 , H05K13/04 , H05K3/30
CPC分类号： H01L21/67144 , H05K13/0409 , Y10S29/044 , Y10T29/4913 , Y10T29/49131 , Y10T29/53091 , Y10T29/53178 , Y10T29/53183 , Y10T29/53191 , Y10T29/53261
摘要： There are disclosed an apparatus for mounting electronic components, with which the electronic components can be reversed, up and down, and mounted onto a circuit board in a short mounting process time by performing picking up, delivering and receiving of components between heads, and mounting of the components onto the circuit board in parallel. A plurality of reverse-supply heads are mounted on a component supply holder for performing indexing rotation, while a plurality of mounting heads are mounted on a component mounting holder for performing indexing rotation in synchronization with the indexing rotation of the component supply holder. By (i) picking up an electronic component, (ii) delivering the electronic component from the reverse-supply head to the mounting head, and (iii) mounting the electronic component onto the circuit board at prescribed positions, operations from (i) to (iii) can be carried out in parallel. Thus, the electronic components can be mounted onto the circuit board in a short process time.
摘要翻译： 公开了一种用于安装电子部件的装置，电子部件可以通过其在头部之间的拾取，传送和接收以及头部之间的部件的拾取，传送和接收而在短时间内上下颠倒并安装到电路板上 的组件并联到电路板上。 多个反向供给头安装在用于进行转位旋转的部件供给保持器上，同时多个安装头安装在与部件供应保持器的分度旋转同步的分度旋转的部件安装保持器上。 通过（i）拾取电子元件，（ii）将电子元件从反向供给头传送到安装头，以及（iii）将电子元件安装在电路板上的规定位置，操作从（i）到 （iii）可以并行进行。 因此，电子部件可以在短的处理时间内安装到电路板上。
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公开(公告)号：US06506222B2
公开(公告)日：2003-01-14
申请号：US09873347
申请日：2001-06-05
申请人： Shozo Minamitani , Takashi Shimizu , Shinji Kanayama , Kenji Takahashi , Kazushi Higashi , Satoshi Shida , Naoto Hosotani
发明人： Shozo Minamitani , Takashi Shimizu , Shinji Kanayama , Kenji Takahashi , Kazushi Higashi , Satoshi Shida , Naoto Hosotani
IPC分类号： H01L2100
CPC分类号： H05K13/0417 , H01L21/67144 , H01L21/6838 , H01L24/75 , H01L2924/12041 , Y10T29/41 , H01L2924/00
摘要： A divided component separated individually beforehand is supplied in a state while stored in a storage body, taken outside by a take-out and storage unit, and a component is mounted on the divided component by a mounting unit, and thereby a divided component with the component is produced. A plurality of the produced divided components with the components mounted thereon are collected into the storage body. Since the component is mounted on the already divided component, as compared with the prior art, no trouble is given rise to at a junction part between the divided component and the component, thus contributing to an improvement in product quality.
摘要翻译： 在预先分离的分割部件以存储在存储体中的状态下被供给，由取出和存储单元取出外部，并且通过安装单元将部件安装在分割部件上，从而将分割部件与 组件生产。 多个产生的具有安装在其上的部件的分割部件被收集到存储体中。 由于与现有技术相比，组件安装在已经分离的部件上，所以在分割部件和部件之间的连接部分没有引起麻烦，从而有助于提高产品质量。
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公开(公告)号：US06544377B1
公开(公告)日：2003-04-08
申请号：US09554721
申请日：2000-05-18
IPC分类号： B32B3120
CPC分类号： H05K13/0469 , H01L21/563 , H01L21/67144 , H01L24/29 , H01L24/75 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/1134 , H01L2224/13099 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83192 , H01L2924/00013 , H01L2924/00014 , H01L2924/01006 , H01L2924/01033 , H01L2924/01039 , H01L2924/01058 , H01L2924/01079 , H01L2924/14 , Y10T29/4913 , Y10T29/49137 , Y10T29/53178 , Y10T156/1092 , Y10T156/1744 , Y10T156/1768 , H01L2924/00 , H01L2224/05599
摘要： A heating and pressurizing apparatus (101), to which a circuit board (70) with electronic components (8) pre-bonded thereto via bonding elements (9) is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member (1211) having a heating device (122). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.
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10.发明授权Apparatus and method for bonding electronic component, circuit board, and electronic component mounting apparatus 失效电子部件，电路板和电子部件安装装置的接合装置及其方法公开(公告)号：US06995342B2
公开(公告)日：2006-02-07
申请号：US10919264
申请日：2004-08-17
CPC分类号： H01L21/67144 , B23K3/087 , B23K2101/40 , H01L24/75 , H01L2924/12042 , H01L2924/14 , H05K3/3494 , H05K2203/0165 , H05K2203/082 , H05K2203/1581 , H01L2924/00
摘要： Disclosed are an apparatus and a method for bonding electronic components, a circuit board, and an electronic component mounting apparatus, whereby various kinds of circuit boards can be manufactured, each by a small amount, with high productivity as compared with the conventional art. There are provided a stage member and a heating device, so that a circuit board is heated by the heating device while held in contact with the stage member, which stage member has a size almost equal to that of one circuit board. Generation of losses can be reduced for compact circuit boards, and heating can be performed individually, correspondingly, for each kind of circuit board. Manufacturing various kinds of circuit boards, each by a small amount, with high productivity as compared with the conventional art is enabled accordingly.
摘要翻译： 公开了一种用于接合电子部件的装置和方法，电路板和电子部件安装装置，由此与现有技术相比，能够以高生产率少量地制造各种电路板。 设置有台架构件和加热装置，使得电路板在与台架构件保持接触的状态下被加热装置加热，该台架构件的尺寸几乎等于一个电路板的尺寸。 对于紧凑型电路板，可以减少损耗的产生，并且可以相应地针对各种电路板单独执行加热。 与现有技术相比，能够高生产率地制造各种各样的电路板。
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