公开(公告)号：US07076867B2

公开(公告)日：2006-07-18

申请号：US10327176

申请日：2002-12-24

申请人： Akihiro Yamamoto ,  Sakae Kobayashi ,  Yoshikazu Yoshimura ,  Naoto Hosotani ,  Kenji Takahashi ,  Hiroshi Nasu ,  Naomi Kaino ,  Hidenobu Nishikawa

发明人： Akihiro Yamamoto ,  Sakae Kobayashi ,  Yoshikazu Yoshimura ,  Naoto Hosotani ,  Kenji Takahashi ,  Hiroshi Nasu ,  Naomi Kaino ,  Hidenobu Nishikawa

IPC分类号： H05K3/30

CPC分类号： H01L21/67092 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49169 ,  Y10T29/5313 ,  Y10T29/5317 ,  Y10T156/1084

摘要： A pressurizing method for pressurizing a second component arranged on a first component, against the first component by using a pressurizing apparatus having a stage on which the first component is mounted, a tool, and a protection sheet supplying section. The tool is disposed so as to face the stage and moved between a first position at which the tool faces the first and second components while spaced therefrom, and a second position at which the tool is biased toward the stage to pressurize the second component against the first component. When the tool is at the second position, the protection sheet supplying section supplies a protection sheet so that the protection sheet is placed between the second component and the tool.

摘要翻译： 一种加压方法，用于通过使用具有安装有所述第一部件的台阶的加压装置，工具和保护片材供给部来将布置在第一部件上的第二部件加压抵靠所述第一部件。 该工具被设置为面对台架并且在第一位置和第二位置之间移动，在该第一位置，工具面向第一和第二部件同时与第一位置隔开;第二位置，工具被偏压到台阶以对第二部件施加压力， 第一部分。 当工具处于第二位置时，保护片供给部提供保护片，使得保护片放置在第二部件和工具之间。

公开(公告)号：US06561408B2

公开(公告)日：2003-05-13

申请号：US10043158

申请日：2002-01-14

申请人： Naoto Hosotani ,  Shuji Ono ,  Hidenobu Nishikawa ,  Mitsuo Maeno ,  Hiroshi Nasu

发明人： Naoto Hosotani ,  Shuji Ono ,  Hidenobu Nishikawa ,  Mitsuo Maeno ,  Hiroshi Nasu

IPC分类号： B23Q1500

CPC分类号： B23K20/02 ,  B23K2101/40

摘要： There is provided an inclination prevention member for preventing a pressing part from inclining to a supporting part. Therefore a pressing face and a stage face can be arranged to be nearly parallel. The pressing face can be thus disposed with the higher parallelism to the bonding stage as compared with the conventional art, so that components and a circuit form object can be bonded with a high bonding quality.

公开(公告)号：US08125786B2

公开(公告)日：2012-02-28

申请号：US12160301

申请日：2007-01-26

申请人： Hidenobu Nishikawa ,  Daido Komyoji ,  Hiroyuki Yamada ,  Yutaka Nakamura ,  Shuichi Takeda ,  Yasuharu Kikuchi

发明人： Hidenobu Nishikawa ,  Daido Komyoji ,  Hiroyuki Yamada ,  Yutaka Nakamura ,  Shuichi Takeda ,  Yasuharu Kikuchi

IPC分类号： H05K1/14

CPC分类号： G06K19/077 ,  G06K19/07732 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/19105 ,  H05K1/0275 ,  H05K3/284 ,  H05K2201/10151 ,  H05K2201/10159 ,  H01L2924/00

摘要： Memory card includes a circuit board, a component mounted on a main face of the circuit board, casing covering at least the main face of the circuit board and the component, and bittering agent retained in a roughened area provided on casing or an exposed part of the circuit board.

摘要翻译： 存储卡包括电路板，安装在电路板的主面上的部件，至少覆盖电路板的主面和部件的壳体，以及保持在设置在壳体上的粗糙区域中的苦味剂或暴露部分 电路板。

公开(公告)号：US07910406B2

公开(公告)日：2011-03-22

申请号：US12066534

申请日：2006-10-19

申请人： Kentaro Kumazawa ,  Shigeru Kondou ,  Hidenobu Nishikawa

发明人： Kentaro Kumazawa ,  Shigeru Kondou ,  Hidenobu Nishikawa

IPC分类号： H01L21/00

CPC分类号： H01L24/50 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/49524 ,  H01L23/49575 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/32145 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/40137 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/8385 ,  H01L2224/85001 ,  H01L2224/85201 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An electronic circuit device includes at least one semiconductor element, a plurality of external connection terminals, connecting conductors electrically connecting the semiconductor element and external connection terminals, and an insulating resin covering the semiconductor element and supporting the connecting conductors integrally. The semiconductor element is buried in the insulating resin, and terminal surfaces of the external connection terminals are exposed from the insulating resin.

摘要翻译： 电子电路装置包括至少一个半导体元件，多个外部连接端子，电连接半导体元件和外部连接端子的连接导体，以及覆盖半导体元件并将连接导体一体地支撑的绝缘树脂。 半导体元件被埋在绝缘树脂中，外部连接端子的端子表面从绝缘树脂露出。

公开(公告)号：US20100084762A1

公开(公告)日：2010-04-08

申请号：US12279915

申请日：2007-04-18

申请人： Hidenobu Nishikawa ,  Daido Komyoji ,  Atsunobu Iwamoto ,  Hiroyuki Yamada ,  Shuichi Takeda ,  Shigeru Kondou

发明人： Hidenobu Nishikawa ,  Daido Komyoji ,  Atsunobu Iwamoto ,  Hiroyuki Yamada ,  Shuichi Takeda ,  Shigeru Kondou

IPC分类号： H01L23/52 ,  G06K19/077

CPC分类号： H05K1/0271 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/19105 ,  H05K3/284 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/10674 ,  H01L2924/00014 ,  H01L2924/00

摘要： Memory card (1) includes at least semiconductor chip (3), circuit board (2) with semiconductor chip (3) mounted on main surface (21), having at least rigidity reducing portion (23) formed in main surface (21) or in a linear region of surface (22) opposite to the main surface, and cover portion (71) for covering semiconductor chip (3) on main surface (21) of circuit board (2), wherein circuit board (2) has a plurality of convex regions (201) which flex in a convex shape toward main surface (21) due to rigidity reducing portion (23).

摘要翻译： 存储卡（1）至少包括半导体芯片（3），具有安装在主表面（21）上的半导体芯片（3）的电路板（2），至少具有形成在主表面（21）中的刚性减小部分（23）或 在与所述主表面相对的表面（22）的直线区域中，以及用于覆盖电路板（2）的主表面（21）上的半导体芯片（3）的盖部分（71），其中电路板（2）具有多个 由刚性减小部分（23）向主表面（21）弯曲成凸形的凸区域（201）。

公开(公告)号：US20090173795A1

公开(公告)日：2009-07-09

申请号：US12160541

申请日：2007-02-26

申请人： Shozo Ochi ,  Osamu Uchida ,  Shigeaki Sakatani ,  Daisuke Sakurai ,  Masato Mori ,  Hiroshi Sakurai ,  Hidenobu Nishikawa

发明人： Shozo Ochi ,  Osamu Uchida ,  Shigeaki Sakatani ,  Daisuke Sakurai ,  Masato Mori ,  Hiroshi Sakurai ,  Hidenobu Nishikawa

IPC分类号： G06K19/077 ,  H01Q1/38 ,  H01Q7/00 ,  H05K3/00

CPC分类号： H01Q1/22 ,  G06K19/07732 ,  G06K19/07749 ,  H01Q7/06 ,  H05K1/0218 ,  H05K1/144 ,  H05K1/148 ,  H05K1/16 ,  H05K2201/043 ,  H05K2201/086 ,  Y10T29/4913

摘要： Card type information device includes wiring board having a wiring pattern with an electronic component mounted on a first face of wiring board and an antenna connecting electrode, antenna board having antenna pattern with antenna terminal electrodes formed on a first face of antenna board, magnetic material placed between wiring board and antenna board confronting each other, flexible wiring board for coupling the antenna connecting electrode to antenna terminal electrode, and housing for accommodating wiring board, antenna board, magnetic material, and flexible wiring board. Wiring board and antenna board are made from one and the same insulating motherboard.

摘要翻译： 卡类型信息装置包括具有安装在布线板的第一面上的电子部件和天线连接电极的布线图案的布线板，天线板天线阵列与天线端子电极形成在天线板的第一面上，磁性材料放置 在布线板和天线板之间，用于将天线连接电极耦合到天线端子电极的柔性布线板和用于容纳布线板，天线板，磁性材料和柔性布线板的壳体。 接线板和天线板由同一个绝缘母板制成。

公开(公告)号：US20090009976A1

公开(公告)日：2009-01-08

申请号：US12160301

申请日：2007-01-26

申请人： Hidenobu Nishikawa ,  Daido Komyoji ,  Hiroyuki Yamada ,  Yutaka Nakamura ,  Shuichi Takeda ,  Yasuharu Kikuchi

发明人： Hidenobu Nishikawa ,  Daido Komyoji ,  Hiroyuki Yamada ,  Yutaka Nakamura ,  Shuichi Takeda ,  Yasuharu Kikuchi

IPC分类号： H05K1/14

CPC分类号： G06K19/077 ,  G06K19/07732 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/19105 ,  H05K1/0275 ,  H05K3/284 ,  H05K2201/10151 ,  H05K2201/10159 ,  H01L2924/00

摘要： Memory card includes a circuit board, a component mounted on a main face of the circuit board, casing covering at least the main face of the circuit board and the component, and bittering agent retained in a roughened area provided on casing or an exposed part of the circuit board.

摘要翻译： 存储卡包括电路板，安装在电路板的主面上的部件，至少覆盖电路板的主面和部件的壳体，以及保持在设置在壳体上的粗糙区域中的苦味剂或暴露部分 电路板。

公开(公告)号：US08007627B2

公开(公告)日：2011-08-30

申请号：US11064122

申请日：2005-02-23

申请人： Kazuto Nishida ,  Hidenobu Nishikawa ,  Yoshinori Wada ,  Hiroyuki Otani

发明人： Kazuto Nishida ,  Hidenobu Nishikawa ,  Yoshinori Wada ,  Hiroyuki Otani

IPC分类号： B32B37/00 ,  B29C65/00

CPC分类号： H01L24/31 ,  H01L21/563 ,  H01L23/295 ,  H01L24/11 ,  H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/29082 ,  H01L2224/29083 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29344 ,  H01L2224/2949 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48624 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/78301 ,  H01L2224/81048 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/81903 ,  H01L2224/83048 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83851 ,  H01L2224/83856 ,  H01L2224/9211 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K3/323 ,  Y10T29/4913 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A chip is bonded on a circuit board by aligning in position bumps with board electrodes with interposition of an anisotropic conductive layer between the chip and the circuit board. The anisotropic conductive layer is a mixture of an insulating resin, conductive particles and an inorganic filler. The chip is pressed against the board with a pressure force of not smaller than 20 gf per bump by virtue of a tool, while warp of the chip is corrected and the board is connected, the bumps are compressed, and the insulating resin is hardened.

摘要翻译： 芯片通过在位置凸块与板电极之间对准而在电路板上粘合，在芯片和电路板之间插入各向异性导电层。 各向异性导电层是绝缘树脂，导电颗粒和无机填料的混合物。 利用工具，以每个凸起不超过20gf的压力将该芯片压靠在板上，同时校正芯片的翘曲并且板被连接，凸块被压缩，并且绝缘树脂硬化。

公开(公告)号：US20090166064A1

公开(公告)日：2009-07-02

申请号：US12161907

申请日：2007-01-31

申请人： Hidenobu Nishikawa ,  Daido Komyoji

发明人： Hidenobu Nishikawa ,  Daido Komyoji

IPC分类号： H05K1/00 ,  B32B37/00

CPC分类号： H05K3/321 ,  G06K19/07749 ,  H01L21/6835 ,  H01L23/49855 ,  H01L24/11 ,  H01L24/12 ,  H01L24/28 ,  H01L24/29 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11001 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/1182 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/29036 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/90 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K1/189 ,  H05K3/305 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2201/10984 ,  Y10T29/49002 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/05599

摘要： The invention includes: applying an anisotropic conductive resin including conductive particles only to a plurality of bumps of an electronic component; placing the electronic component above a main surface of a flexible wiring board via the anisotropic conductive resin; and pressurizing the electronic component to the wiring board and curing the anisotropic conductive resin applied to the plurality of bumps to join the plurality of bumps to the electrodes of the wiring board. This can prevent a defective mounting of the electronic component.

摘要翻译： 本发明包括：将仅包含导电颗粒的各向异性导电树脂施加到电子部件的多个凸块; 通过各向异性导电树脂将电子部件放置在柔性布线板的主表面上方; 并将所述电子部件加压到所述布线基板，并固化施加到所述多个凸块的各向异性导电树脂，以将所述多个凸块接合到所述布线板的电极。 这可以防止电子部件的安装不良。

公开(公告)号：US20090051606A1

公开(公告)日：2009-02-26

申请号：US12296509

申请日：2007-04-25

申请人： Shozo Ochi ,  Hidenobu Nishikawa ,  Hiroshi Sakurai

发明人： Shozo Ochi ,  Hidenobu Nishikawa ,  Hiroshi Sakurai

IPC分类号： H01Q1/00 ,  H01Q1/22

CPC分类号： H01Q9/27 ,  G06K19/07732 ,  G06K19/07749 ,  G06K19/07771 ,  H01L2224/16225 ,  H01Q1/2225 ,  H01Q7/08 ,  H05K1/141 ,  H05K1/16 ,  H05K3/305 ,  H05K3/4084 ,  H05K3/4611 ,  H05K2201/0397 ,  H05K2201/086 ,  H05K2201/09972 ,  Y10T29/49016

摘要： An electronic circuit module with a built-in antenna (1) includes the following elements: a mounting module having a wiring board (2), a passive component, and a semiconductor device; a resin sheet substrate (11) having an antenna pattern (12) formed on a first principle surface of a base thereof; and a magnetic layer interposed between the mounting module and the resin sheet substrate (11). These elements are housed in a case (16).

摘要翻译： 具有内置天线（1）的电子电路模块包括以下元件：具有布线板（2），无源元件和半导体器件的安装模块; 具有形成在其基材的第一主面上的天线图案的树脂片基板（11） 以及介于所述安装模块和所述树脂片基板（11）之间的磁性层。 这些元件容纳在壳体（16）中。