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公开(公告)号：US20120073944A1
公开(公告)日：2012-03-29
申请号：US13311848
申请日：2011-12-06
IPC分类号： H01H13/14
CPC分类号： H01H13/7006 , H01H13/702 , H01H2203/03 , H01H2203/038 , H01H2205/024 , H01H2205/026 , H01H2215/02 , H01H2221/002 , H01H2223/003
摘要： A switch integrated type housing includes a housing body, a switch button sheet, a conductor and a cover sheet. The housing body is provided with a plurality of concave sections on an outer surface of the housing body. The switch button sheet is provided on the outer surface to cover the plurality of concave sections. The conductor has a dome shape downwardly projecting and is provided in each of the plurality of concave sections to contact the switch button sheet. The cover sheet is provided between the switch button sheet and the outer surface of the housing body in a portion of the outer surface of the housing body other than the plurality of concave sections and to cover a lower surface of the conductor in each of the plurality of concave sections.
摘要翻译： 开关一体型壳体包括壳体，开关按钮片，导体和盖片。 壳体在壳体的外表面上设置有多个凹部。 开关按钮片设置在外表面上以覆盖多个凹部。 导体具有向下突出的圆顶形状，并且设置在多个凹部中的每一个中以接触开关按钮片。 覆盖片设置在开关按钮片和外壳主体的外表面之间的除了多个凹部之外的壳体的外表面的一部分中，并且在多个凹部中的每一个中覆盖导体的下表面 的凹部。
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公开(公告)号：US20110242780A1
公开(公告)日：2011-10-06
申请号：US13158037
申请日：2011-06-10
申请人： Shinji WATANABE , Nobuhiro MIKAMI , Junya SATO , Kenichiro FUJII , Katsumi ABE , Atsumasa SAWADA
发明人： Shinji WATANABE , Nobuhiro MIKAMI , Junya SATO , Kenichiro FUJII , Katsumi ABE , Atsumasa SAWADA
CPC分类号： H05K1/18 , H01L24/18 , H01L24/24 , H01L24/82 , H01L2224/16225 , H01L2224/16227 , H01L2224/18 , H01L2224/24051 , H01L2224/24226 , H01L2224/24998 , H01L2224/32225 , H01L2224/73267 , H01L2224/76155 , H01L2224/82102 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/1515 , H01L2924/15151 , H01L2924/19041 , H01L2924/19043 , H01L2924/19103 , H01L2924/19104 , H01L2924/19105 , H01L2924/3011 , H01L2924/3511 , H05K1/023 , H05K1/0271 , H05K1/0284 , H05K1/185 , H05K1/189 , H05K3/0014 , H05K3/32 , H05K3/4644 , H05K2201/0187 , H05K2201/0191 , H05K2201/0195 , H05K2201/09018 , H05K2201/09036 , H05K2201/09045 , H05K2201/09118 , H05K2201/09436 , H05K2201/10477 , H05K2201/10515 , H05K2201/1053 , H05K2201/10636 , H05K2201/10734 , H05K2203/1469 , H05K2203/302 , Y02P70/611 , H01L2924/00
摘要： An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board 1, a semiconductor package 20 is mounted on a curved board 10 including a curved surface on at least a portion thereof. The curved board 10 includes a pedestal portion 13a disposed on a region of the curved surface portion where the semiconductor package 20 is mounted and having an upper surface thereof formed flat, and a plurality of pad portions 15a disposed on the flat surface of the pedestal portion 13a. The pedestal portion 13a is formed of an insulating material. The semiconductor package 20 is mounted on the pad portions 15a.
摘要翻译： 本发明的目的在于，当将半导体封装安装在弯曲的基板上时，可以抑制对半导体封装件施加的应力。 在安装基板1中，将半导体封装20安装在其至少一部分上包括弯曲表面的弯曲板10上。 弯曲板10包括设置在半导体封装20安装的弯曲表面部分的区域上并具有平坦的上表面的基座部分13a和设置在基座部分的平坦表面上的多个焊盘部分15a 13a。 基座部分13a由绝缘材料形成。 半导体封装20安装在焊盘部分15a上。
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公开(公告)号：US20140003015A1
公开(公告)日：2014-01-02
申请号：US14016707
申请日：2013-09-03
申请人： Shinji WATANABE , Nobuhiro MIKAMI , Junya SATO , Kenichiro FUJII , Katsumi ABE , Atsumasa SAWADA
发明人： Shinji WATANABE , Nobuhiro MIKAMI , Junya SATO , Kenichiro FUJII , Katsumi ABE , Atsumasa SAWADA
IPC分类号： H05K1/18
CPC分类号： H05K1/18 , H01L24/18 , H01L24/24 , H01L24/82 , H01L2224/16225 , H01L2224/16227 , H01L2224/18 , H01L2224/24051 , H01L2224/24226 , H01L2224/24998 , H01L2224/32225 , H01L2224/73267 , H01L2224/76155 , H01L2224/82102 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/1515 , H01L2924/15151 , H01L2924/19041 , H01L2924/19043 , H01L2924/19103 , H01L2924/19104 , H01L2924/19105 , H01L2924/3011 , H01L2924/3511 , H05K1/023 , H05K1/0271 , H05K1/0284 , H05K1/185 , H05K1/189 , H05K3/0014 , H05K3/32 , H05K3/4644 , H05K2201/0187 , H05K2201/0191 , H05K2201/0195 , H05K2201/09018 , H05K2201/09036 , H05K2201/09045 , H05K2201/09118 , H05K2201/09436 , H05K2201/10477 , H05K2201/10515 , H05K2201/1053 , H05K2201/10636 , H05K2201/10734 , H05K2203/1469 , H05K2203/302 , Y02P70/611 , H01L2924/00
摘要： An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board 1, a semiconductor package 20 is mounted on a curved board 10 including a curved surface on at least a portion thereof. The curved board 10 includes a pedestal portion 13a disposed on a region of the curved surface portion where the semiconductor package 20 is mounted and having an upper surface thereof formed flat, and a plurality of pad portions 15a disposed on the flat surface of the pedestal portion 13a. The pedestal portion 13a is formed of an insulating material. The semiconductor package 20 is mounted on the pad portions 15a.
摘要翻译： 本发明的目的在于，当将半导体封装安装在弯曲的基板上时，可以抑制对半导体封装件施加的应力。 在安装基板1中，将半导体封装20安装在其至少一部分上包括弯曲表面的弯曲板10上。 弯曲板10包括设置在半导体封装20安装的弯曲表面部分的区域上并具有平坦的上表面的基座部分13a和设置在基座部分的平坦表面上的多个焊盘部分15a 13a。 基座部分13a由绝缘材料形成。 半导体封装20安装在焊盘部分15a上。
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