公开(公告)号：US08981560B2

公开(公告)日：2015-03-17

申请号：US13923011

申请日：2013-06-20

Applicant: mCube, Inc.

Inventor： Dave Paul Jensen ,  Hong Wan ,  Jon Ewanich

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/00 ,  B81B3/00

CPC classification number: H01L24/05 ,  B81B3/00 ,  H01L24/13 ,  H01L24/16 ,  H01L24/24 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05548 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/10175 ,  H01L2224/1145 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16105 ,  H01L2224/16238 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/8123 ,  H01L2224/81815 ,  H01L2224/94 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2924/01047

Abstract: A method and structure for fabricating sensor(s) or electronic device(s) using vertical mounting with interconnections. The method includes providing a resulting device including at least one sensor or electronic device, formed on a die member, having contact region(s) with one or more conductive materials formed thereon. The resulting device can then be singulated within a vicinity of the contact region(s) to form one or more singulated dies, each having a singulated surface region. The singulated die(s) can be coupled to a substrate member, having a first surface region, such that the singulated surface region(s) of the singulated die(s) are coupled to a portion of the first surface region. Interconnections can be formed between the die(s) and the substrate member with conductive adhesives, solder processes, or other conductive bonding processes.

Abstract translation: 用于使用具有互连的垂直安装来制造传感器或电子设备的方法和结构。 该方法包括提供所形成的装置，其包括形成在模具构件上的至少一个传感器或电子装置，其具有在其上形成有一个或多个导电材料的接触区域。 所得到的器件然后可以在接触区域的附近被单个化，以形成一个或多个单个模具，每一个具有单个的表面区域。 单个模具可以耦合到具有第一表面区域的衬底构件，使得单个模具的单个表面区域耦合到第一表面区域的一部分。 可以使用导电粘合剂，焊接工艺或其它导电接合工艺在管芯和衬底构件之间形成互连。

公开(公告)号：US08749004B2

公开(公告)日：2014-06-10

申请号：US13922983

申请日：2013-06-20

Applicant: MCube Inc. (028143)

Inventor： Xiao (Charles) Yang ,  Hong Wan

IPC: H01L29/82

CPC classification number: H01L25/16 ,  B81B7/007 ,  B81B7/0074 ,  H01L21/561 ,  H01L23/3114 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/04042 ,  H01L2224/05552 ,  H01L2224/05556 ,  H01L2224/05571 ,  H01L2224/06135 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/4847 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/10156 ,  H01L2924/10161 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2224/03 ,  H01L2224/32225 ,  H01L2924/00012 ,  H01L2224/32145

Abstract: A method and structure for fabricating sensor(s) or electronic device(s) using vertical mounting is presented. The method includes providing a substrate having a surface region and forming sensor(s) or electronic device(s) on a first region overlying the surface region. At least one bond pad structure can be formed from at least one trench structure. The resulting device can then be singulated within a vicinity of the bond pad structure(s) to form at least one integrated sensor or electronic devices having at least one vertical bond pad. At least one singulated device(s) can be coupled to a package, having a package surface region, such that the vertical bond pad(s) are configured horizontally, and at least one interconnection can be formed between the vertical bond pad(s) and at least one portion of the package surface region.

Abstract translation: 提出了一种使用垂直安装制造传感器或电子设备的方法和结构。 该方法包括在覆盖表面区域的第一区域上提供具有表面区域和形成传感器或电子设备的基板。 至少一个接合焊盘结构可以由至少一个沟槽结构形成。 所得到的器件然后可以在接合焊盘结构的附近被分割，以形成至少一个集成的传感器或具有至少一个垂直接合焊盘的电子器件。 至少一个单独的装置可以耦合到具有封装表面区域的封装，使得垂直焊接焊盘水平配置，并且可以在垂直焊盘之间形成至少一个互连， 以及包装表面区域的至少一部分。

公开(公告)号：US08742520B2

公开(公告)日：2014-06-03

申请号：US13924457

申请日：2013-06-21

Applicant: MCube Inc.

Inventor： Hong Wan ,  Xiao (Charles) Yang

IPC: H01L29/82 ,  G11C11/02

CPC classification number: G01R33/093 ,  G01R33/0206 ,  G01R33/0286 ,  H01L27/22 ,  H01L43/08 ,  H01L43/12

Abstract: A method and structure for a three-axis magnetic field sensing device is provided. The device includes a substrate, an IC layer, and preferably three magnetic field sensors coupled to the IC layer. A nickel-iron magnetic field concentrator is also provided.

Abstract translation: 提供了一种三轴磁场感测装置的方法和结构。 该器件包括衬底，IC层，并且优选地耦合到IC层的三个磁场传感器。 还提供了镍铁磁场集中器。

公开(公告)号：US09423473B2

公开(公告)日：2016-08-23

申请号：US14606909

申请日：2015-01-27

Applicant: mCube Inc.

Inventor： Hong Wan ,  Anthony F. Flannery

IPC: G01R33/09 ,  G01R33/02

CPC classification number: G01R33/093 ,  G01R33/0206 ,  G01R33/096 ,  G01R33/098

Abstract: A method and structure for a three-axis magnetic field sensing device. An IC layer having first bond pads and second bond pads can be formed overlying a substrate/SOI member with a first, second, and third magnetic sensing element coupled the IC layer. One or more conductive cables can be formed to couple the first and second bond pads of the IC layer. A portion of the substrate member and IC layer can be removed to separate the first and second magnetic sensing elements on a first substrate member from the third sensing element on a second substrate member, and the third sensing element can be coupled to the side-wall of the first substrate member.

公开(公告)号：US20130285651A1

公开(公告)日：2013-10-31

申请号：US13924457

申请日：2013-06-21

Applicant: MCube Inc.

Inventor： Hong Wan ,  Xiao (Charles) Yang

IPC: G01R33/09 ,  G01R33/02

CPC classification number: G01R33/093 ,  G01R33/0206 ,  G01R33/0286 ,  H01L27/22 ,  H01L43/08 ,  H01L43/12

Abstract: A method and structure for a three-axis magnetic field sensing device is provided. The device includes a substrate, an IC layer, and preferably three magnetic field sensors coupled to the IC layer. A nickel-iron magnetic field concentrator is also provided.

Abstract translation: 提供了一种三轴磁场感测装置的方法和结构。 该器件包括衬底，IC层，并且优选地耦合到IC层的三个磁场传感器。 还提供了镍铁磁场集中器。

公开(公告)号：US20130277779A1

公开(公告)日：2013-10-24

申请号：US13922983

申请日：2013-06-20

Applicant: MCube Inc. (028143)

Inventor： Xiao(Charles) Yang ,  Hong Wan

IPC: H01L25/16

CPC classification number: H01L25/16 ,  B81B7/007 ,  B81B7/0074 ,  H01L21/561 ,  H01L23/3114 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/04042 ,  H01L2224/05552 ,  H01L2224/05556 ,  H01L2224/05571 ,  H01L2224/06135 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/4847 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/10156 ,  H01L2924/10161 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2224/03 ,  H01L2224/32225 ,  H01L2924/00012 ,  H01L2224/32145

Abstract: A method and structure for fabricating sensor(s) or electronic device(s) using vertical mounting is presented. The method includes providing a substrate having a surface region and forming sensor(s) or electronic device(s) on a first region overlying the surface region. At least one bond pad structure can be formed from at least one trench structure. The resulting device can then be singulated within a vicinity of the bond pad structure(s) to form at least one integrated sensor or electronic devices having at least one vertical bond pad. At least one singulated device(s) can be coupled to a package, having a package surface region, such that the vertical bond pad(s) are configured horizontally, and at least one interconnection can be formed between the vertical bond pad(s) and at least one portion of the package surface region.

Abstract translation: 提出了一种使用垂直安装制造传感器或电子设备的方法和结构。 该方法包括在覆盖表面区域的第一区域上提供具有表面区域和形成传感器或电子设备的基板。 至少一个接合焊盘结构可以由至少一个沟槽结构形成。 所得到的器件然后可以在接合焊盘结构的附近被分割，以形成至少一个集成的传感器或具有至少一个垂直接合焊盘的电子器件。 至少一个单独的装置可以耦合到具有封装表面区域的封装，使得垂直接合焊盘水平配置，并且可以在垂直焊盘之间形成至少一个互连， 以及包装表面区域的至少一部分。