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    GLASS SHEET STRUCTURE BODY AND GLASS SHEET STRUCTURE BODY MANUFACTURING METHOD
    1.
    发明公开
    GLASS SHEET STRUCTURE BODY AND GLASS SHEET STRUCTURE BODY MANUFACTURING METHOD 审中-公开

    公开(公告)号：US20240083145A1

    公开(公告)日：2024-03-14

    申请号：US18514360

    申请日：2023-11-20

    申请人： AGC Inc.

    发明人： Daisuke UCHIDA

    IPC分类号： B32B17/10 ,  B32B1/00

    CPC分类号： B32B17/10036 ,  B32B1/00 ,  B32B17/10321 ,  B32B17/10568 ,  B32B17/10798 ,  B32B2038/0076 ,  B32B2250/02 ,  B32B2250/40

    摘要： A glass sheet composite includes: a first sheet member and a second sheet member; and an intermediate layer between the first sheet member and the second sheet member, in which at least one member selected from the group consisting of the first sheet member and the second sheet member is a glass sheet, each of the first sheet member and the second sheet member is a sheet including a curved surface portion including a convex side main surface protruding in the sheet thickness direction and a concave side main surface opposite to the convex side main surface, the concave side main surface of the first sheet member and the convex side main surface of the second sheet member are overlapped opposite to each other, and the concave side main surface has a radius of curvature smaller than that of the convex side main surface.

    ELECTROCHROMIC DEVICE
    3.
    发明申请
    ELECTROCHROMIC DEVICE 有权
    电致发光器件

    公开(公告)号：US20080151350A1

    公开(公告)日：2008-06-26

    申请号：US12014447

    申请日：2008-01-15

    申请人： William L. Tonar ,  David J. Cammenga ,  David L. Poll ,  Kevin B. Kar ,  Bradley L. Busscher

    发明人： William L. Tonar ,  David J. Cammenga ,  David L. Poll ,  Kevin B. Kar ,  Bradley L. Busscher

    IPC分类号： G02F1/153

    CPC分类号： B32B17/10321 ,  B32B17/06 ,  B32B17/10036 ,  B32B17/10174 ,  B32B17/10513 ,  B60R1/088 ,  G02F1/1533 ,  G02F1/161 ,  G02F1/163

    摘要： An electrochromic device that may have an elastomeric seal is disclosed as is an electrochromic device having a seal provided on the peripheral edges of both the front and rear elements and wherein the seal may comprises a first material having an oxygen permeability of less than about 2.0 cm3·mm/m2·day·atm. In addition, an electrochromic device may include a seal comprising a thin member bonded to the peripheral edge of at least one of the front and rear elements, wherein the thin member comprises one of a film, thin glass, and a strip of foil.

    摘要翻译： 公开了可以具有弹性体密封件的电致变色装置，其中具有设置在前部和后部元件的周边边缘上的密封件的电致变色装置，并且其中密封件可以包括具有小于约2.0cm的氧气渗透性的第一材料 3 / .0mm / m 2。 此外，电致变色装置可以包括密封件，其包括结合到前元件和后元件中的至少一个的周边边缘的薄构件，其中薄构件包括膜，薄玻璃和箔条之一。

    Roll-to-roll fabricated encapsulated semiconductor circuit devices
    6.
    发明申请
    Roll-to-roll fabricated encapsulated semiconductor circuit devices 有权
    卷对卷制造的封装半导体电路器件

    公开(公告)号：US20070026571A1

    公开(公告)日：2007-02-01

    申请号：US11543705

    申请日：2006-10-03

    申请人： John Daniels ,  Gregory Nelson

    发明人： John Daniels ,  Gregory Nelson

    IPC分类号： H01L21/00

    CPC分类号： B32B17/10036 ,  B32B17/10174 ,  B32B17/10321 ,  F21K9/00 ,  F21V5/04 ,  H01L21/67132 ,  H01L25/0753 ,  H01L27/14625 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01033

    摘要： An encapsulated semiconductor device, comprising a first substrate having an electrically conductive surface; a second substrate having an electrically conductive pattern disposed thereon; and a pattern of semiconductor elements, each of the semiconductor elements having a first conductor and a second conductor. The encapsulated semiconductor device includes an adhesive having the pattern of semiconductor elements fixed thereto and disposed between the electrically conductive surface and the electrically conductive pattern to form a lamination, the adhesive being activatable to bind the second substrate to the first substrate so that one of the first conductor and the second conductor is automatically brought into and maintained in electrical communication with the electrically conductive pattern of the second substrate and so that the other of the first conductor and the second conductor of each semiconductor element is automatically brought into and maintained in electrical communication with the electrically conductive surface.

    摘要翻译： 一种封装的半导体器件，包括具有导电表面的第一衬底; 具有设置在其上的导电图案的第二基板; 和半导体元件的图案，每个半导体元件具有第一导体和第二导体。 封装的半导体器件包括具有固定到其上的半导体元件图案的粘合剂，并且设置在导电表面和导电图案之间以形成层压，该粘合剂可激活以将第二基底粘合到第一基底上，使得 第一导体和第二导体被自动地引入并保持与第二基板的导电图案电连通，并且使得每个半导体元件的第一导体和第二导体中的另一个自动进入并保持电连通 具有导电表面。