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公开(公告)号：US20160339486A1
公开(公告)日：2016-11-24
申请号：US15153349
申请日：2016-05-12
发明人： Paul M. Blair , Elizabeth B. Bailey
CPC分类号： B08B7/0014 , B08B9/027 , B23K1/008 , B23K3/04 , B23K3/08 , F27B9/24 , F27B9/3077 , F27D1/0003 , F27D1/1684 , F27D7/04 , F27D9/00 , F27D2009/0072 , H01L21/67109 , H01L21/67173 , H01L21/6776
摘要： A liner for contamination control in a reflow oven, which reflow oven has surfaces, includes a substrate having a length and a width defining an area. The substrate has a thickness defined by first and second sides. An adhesive is positioned on the first side of the substrate. The substrate is removably adhered to the surfaces of the reflow oven, and the liner is configured to accumulate solder reflow contaminants thereon or to repel solder flux vapors and/or fumes, and is configured for removal from the surfaces with any accumulated contaminants. A method of treating the surfaces of a reflow oven is also disclosed.
摘要翻译： 在回流炉中的回流炉中的用于污染控制的衬管具有表面，包括具有限定区域的长度和宽度的衬底。 衬底具有由第一和第二侧限定的厚度。 粘合剂位于基材的第一侧上。 衬底可移除地粘附到回流炉的表面，并且衬套被配置为在其上积聚焊料回流污染物或排斥焊剂蒸汽和/或烟雾，并且被配置为用任何累积的污染物从表面去除。 还公开了一种处理回流炉表面的方法。
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公开(公告)号：US20140209662A1
公开(公告)日：2014-07-31
申请号：US14041316
申请日：2013-09-30
IPC分类号： H05K13/04
CPC分类号： B23K3/04 , B23K1/0016 , B23K1/008 , B23K1/203 , B23K3/082 , C09D133/00 , F27B9/3077 , F27B9/32 , F27B9/34 , F27D1/1678 , F27D7/04 , F27D17/008 , H01L21/67173 , H01L21/6776 , H05K3/3494 , H05K13/0465
摘要： A reflow oven includes a chamber housing including surfaces that are in contact with heated air mixed with contaminants, including flux, and a water-soluble layer selectively applied to the surfaces of the chamber housing. Embodiments of the reflow oven include an acrylic-based layer, such as an acrylic paint. In one embodiment, the acrylic paint includes a water-soluble polymer, a polymer emulsion, and water. The water-soluble polymer includes butyl benzyl phthalate. In some embodiments, the acrylic paint includes 1-10% by weight butyl benzyl phthalate, 30-55% by weight acrylic polymer emulsion, and balance water. In a certain embodiment, the acrylic paint includes 1-5% by weight butyl benzyl phthalate, 35-50% by weight acrylic poly emulsion, and balance water. Methods of treating surfaces of the reflow oven are further disclosed.
摘要翻译： 回流炉包括：腔室，其包括与被混合有污染物的热空气接触的表面，包括助熔剂，以及选择性地施加到腔室壳体表面的水溶性层。 回流炉的实施例包括丙烯酸类层，例如丙烯酸漆。 在一个实施方案中，丙烯酸涂料包括水溶性聚合物，聚合物乳液和水。 水溶性聚合物包括邻苯二甲酸苄基苄酯。 在一些实施方案中，丙烯酸涂料包括1-10重量％的邻苯二甲酸丁基苄酯，30-55重量％的丙烯酸聚合物乳液和余量的水。 在某个实施方案中，丙烯酸涂料包括1-5重量％的邻苯二甲酸丁基苄酯，35-50重量％的丙烯酸聚乳液和余量的水。 还公开了处理回流炉表面的方法。
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3.发明授权
公开(公告)号：US4973244A
公开(公告)日：1990-11-27
申请号：US204015
申请日：1988-06-08
CPC分类号： H05K3/3494 , B23K1/008 , F27B9/3077 , H05K2203/1581
摘要： Printed circuit boards, assemblies and the like are heated uniformly from edge to edge or to a desired lateral temperature profile while being conveyed through a heating area. The conveying systems reliably conveys circuit boards and the like through the heating area without dropping them. A rail heater is provided to heat rails supporting conveyors having pins to hold circuit boards and the like. A control for the rail heaters controls the temperature of the rails so the circuit boards are positively supported on the conveyors and have a uniform temperature profile or desired temperature profile from edge to edge.
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公开(公告)号：US3940243A
公开(公告)日：1976-02-24
申请号：US504580
申请日：1974-09-09
申请人： Anthony L. Adams
发明人： Anthony L. Adams
CPC分类号： B65G51/03 , C30B35/002 , F27B9/3077 , H01L21/67
摘要： A semiconductor wafer baking and handling system includes a pair of wheel assemblies each comprising a pair of spaced apart plates having opposed, aligned slots formed therein for receiving and supporting semiconductor wafers. A wafer transporting air track includes portions extending between the plates of both of the wheel assemblies. The wheel assemblies are rotated about axes lying substantially in the plane of and extending perpendicularly to the path of wafer travel along the air track to sequentially position the slots to receive semiconductor wafers, to rotate the received semiconductor wafers through an arc of 180.degree., and to subsequently sequentially position the slots to effect removal of the semiconductor wafers. One of the wheel assemblies is mounted in a housing which also encloses a heater, a fan, and baffles for directing gas from the fan across the heater and across the wafers to effect baking of the wafers. The other wheel assembly is maintained at room temperature and functions as a temporary storage and inverting apparatus for the wafers.
摘要翻译： 半导体晶片烘烤和处理系统包括一对轮组件，每个轮组件包括一对间隔开的板，其具有形成在其中的相对的对准槽，用于接收和支撑半导体晶片。 晶片输送空气轨道包括在两个车轮组件的板之间延伸的部分。 轮组件围绕基本上位于沿着空气轨道的晶片行进的平面的平面中并且垂直于晶片行进的路径旋转，以顺序地定位槽以接收半导体晶片，以使接收的半导体晶片旋转180度的弧度，以及 随后顺序地定位槽以实现半导体晶片的去除。 其中一个车轮组件安装在壳体中，壳体还包围加热器，风扇和挡板，用于引导来自风扇的气体穿过加热器并跨过晶片以实现晶片的烘烤。 另一个车轮组件保持在室温，并且用作晶片的临时存储和翻转装置。
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5.发明申请公开(公告)号：US20160061524A1
公开(公告)日：2016-03-03
申请号：US14782113
申请日：2014-04-02
申请人： ITT ITALIA S.R.L.
发明人： Sandro De Dominicis
CPC分类号： F27B9/36 , C21D1/34 , C21D9/0056 , C21D9/0068 , F16D69/00 , F16D69/02 , F16D2069/0491 , F16D2200/0082 , F16D2250/0092 , F27B9/066 , F27B9/24 , F27B9/243 , F27B9/3005 , F27B9/3077 , F27D11/12
摘要： A method and plant for thermally treating braking elements after a forming step, including a convective heating step at 150-300° C. and a infrared irradiation heating step, immediately in succession one relative to the other. A tunnel convection furnace is crossed by at least a first conveyor belt which translates along a first direction and on an upper face of which the braking elements are placed, is arranged laterally adjacent, with respect to the first direction, to an infrared heating tunnel furnace crossed by a second conveyor belt which translates along a second direction, parallel and opposite to the first one, and on an upper face of which the braking elements are placed. The first conveyor belt is larger than the second conveyor belt, and the braking elements appear in multiple side-by-side rows in a transverse and oblique direction with respect to the first and second directions. Robots placed at the opposite ends of the furnaces transfer the braking elements from the first conveyor belt to the second one or vice versa to a first end of the furnaces and place them on the first conveyor belt or second one to a second end of the furnaces being opposite to the first one, so as to change at will the sequence in which the infrared and convective heating steps are performed.
摘要翻译： 一种用于在成形步骤之后热处理制动元件的方法和设备，包括在150-300℃的对流加热步骤和红外线照射加热步骤，其相对于另一个立即连续地进行。 隧道对流炉至少沿着第一方向平移的第一传送带和其制动元件的上表面相对于第一方向横向相对于红外加热隧道炉 由第二输送带穿过，该第二输送带沿着与第一输送带平行和相对的第二方向平移并且在其上表面上布置有制动元件。 第一输送带大于第二输送带，并且制动元件相对于第一和第二方向在横向和倾斜方向上以多个并排排列出现。 放置在炉子的相对端的机器人将制动元件从第一输送带传送到第二输送带，反之亦然，将其放置在炉子的第一端，并将它们放置在第一输送带或第二输送带的第二端 与第一个相对，从而随意改变执行红外和对流加热步骤的顺序。
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公开(公告)号：US4881591A
公开(公告)日：1989-11-21
申请号：US53107
申请日：1987-05-21
申请人： Michael W. Rignall
发明人： Michael W. Rignall
CPC分类号： G01R31/2862 , F27B9/3077 , G05D23/1917 , G05D23/20
摘要： Over for the burn-in of integrated circuits (12), comprising: a chamber (B) for receiving such circuits (12); first means (4), for heating such integrated circuits (12) in the chamber (B) with the circuits (12) fed with supply voltages; and control means for controlling the first means (4), including a computer (15) for monitoring power consumed by the circuits (12), the computer (15) being capable of storing information concerning the number of said circuits (12) and being adapted to provide from said power, a signal dependent on the mean power dissipation of the circuits (12): and in which oven the control means controls the heating of the circuits (12) in dependence on said signal. Also disclosed is an oven for the burn-in of integrated circuits (12), the oven comprising: a plurality of separate chambers (B) for receiving such circuits (12) to be burned-in with the circuits (12) fed with supply voltages; first means (4) for heating separately each of the chambers; and second means (6) for cooling separately each of the chambers with its circuits (12) therein, after they have been burned-in and with the circuits (12) still being fed supply voltages.
摘要翻译： 用于集成电路（12）的老化，包括：用于接收这种电路（12）的腔室（B）; 第一装置（4），用于用馈送有电源电压的电路（12）加热腔室（B）中的这种集成电路（12）; 以及用于控制第一装置（4）的控制装置，包括用于监视由电路（12）消耗的功率的计算机（15），该计算机能够存储关于所述电路（12）的数量的信息，并且是 适于从所述功率提供取决于电路（12）的平均功率消耗的信号：并且其中控制装置根据所述信号控制电路（12）的加热。 还公开了一种用于老化集成电路（12）的烘箱，烤箱包括：用于接收这样的电路（12）的多个分开的室（12），其被供给供给的电路（12）燃烧 电压; 第一装置（4），用于单独加热每个室; 以及第二装置（6），用于在它们被燃烧并且电路（12）仍然被馈送电源电压之后，其中具有其中的电路（12）的每个室分开地冷却。
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公开(公告)号：US4439146A
公开(公告)日：1984-03-27
申请号：US426734
申请日：1982-09-29
申请人： Kazuhiro Sugita
发明人： Kazuhiro Sugita
IPC分类号： H01L21/677 , F27B9/30 , H01L21/22 , F27D5/00 , F27B9/00
CPC分类号： H01L21/22 , F27B9/3077 , Y10S414/137 , Y10S414/14
摘要： A heat treatment apparatus is disclosed, which includes a tube device having a tube axis in the horizontal direction for receiving therein an object to be treated so as to treat the same by heat, a holding member for holding thereon a plurality of objects to be treated, first and second supporting devices located at one end outside of the tube device, a first coupling member for coupling the first supporting device with the holding member, a first operating member for moving the holding member in the horizontal direction, a second coupling member attached to the second supporting device for holding a holding portion of the holding member by shaft-rotation, and a second operating member for moving the holding member in the horizontal and vertical directions.
摘要翻译： 公开了一种热处理装置，其包括管装置，该管装置具有在水平方向上的管轴，用于在其中容纳待处理物体以便通过加热处理该物体;保持构件，用于保持多个待处理物体 位于管装置外侧的第一和第二支撑装置，用于将第一支撑装置与保持构件联接的第一联接构件，用于沿水平方向移动保持构件的第一操作构件，附接到第二支撑装置的第二联接构件 通过轴旋转来保持保持构件的保持部的第二支撑装置，以及用于在水平和垂直方向上移动保持构件的第二操作构件。
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公开(公告)号：US3415503A
公开(公告)日：1968-12-10
申请号：US66165267
申请日：1967-08-18
申请人： BTU ENG CORP
发明人： HOWARD BECK JACOB
CPC分类号： F27B9/3077 , F27B9/082 , F27B9/3005
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公开(公告)号：US12117242B2
公开(公告)日：2024-10-15
申请号：US17415851
申请日：2019-12-19
申请人： POSCO HOLDINGS INC. , RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE & TECHNOLOGY , POSCO FUTURE M CO., LTD.
发明人： Keeyoung Jung , Choongmo Yang , Yoon Cheol Park , Soon Cheol Hwang , Yeong Woo Kim , Young Min Park
IPC分类号： F27B9/24 , F27B9/04 , F27B9/30 , F27D7/02 , F27D17/00 , H01M4/505 , H01M4/525 , H01M10/0525 , H01M4/02
CPC分类号： F27B9/3077 , F27B9/045 , F27D7/02 , F27D17/002 , H01M4/505 , H01M4/525 , H01M10/0525 , F27D2007/026 , H01M2004/028
摘要： A furnace for producing a secondary battery cathode material according to an exemplary embodiment of the present invention includes; a chamber of which the internal space is heated by a heater, a conveyer installed in the chamber and conveying a sagger containing raw material power of a cathode material of a secondary battery in one direction; and a gas supply nozzle and an exhaust port installed in the chamber.
The chamber is divided into a front chamber, an intermediate chamber, and a rear chamber. The intermediate chamber has an inlet shutter and an outlet shutter for sealing the internal space thereof, and an exhaust port of the intermediate chamber is connected to an exhaust device for discharging gas.-
公开(公告)号：US08940099B2
公开(公告)日：2015-01-27
申请号：US14041316
申请日：2013-09-30
IPC分类号： B08B7/00 , H05K13/04 , B23K1/008 , F27B9/30 , F27B9/32 , F27B9/34 , F27D1/16 , F27D17/00 , H05K3/34
CPC分类号： B23K3/04 , B23K1/0016 , B23K1/008 , B23K1/203 , B23K3/082 , C09D133/00 , F27B9/3077 , F27B9/32 , F27B9/34 , F27D1/1678 , F27D7/04 , F27D17/008 , H01L21/67173 , H01L21/6776 , H05K3/3494 , H05K13/0465
摘要： A reflow oven includes a chamber housing including surfaces that are in contact with heated air mixed with contaminants, including flux, and a water-soluble layer selectively applied to the surfaces of the chamber housing. Embodiments of the reflow oven include an acrylic-based layer, such as an acrylic paint. In one embodiment, the acrylic paint includes a water-soluble polymer, a polymer emulsion, and water. The water-soluble polymer includes butyl benzyl phthalate. In some embodiments, the acrylic paint includes 1-10% by weight butyl benzyl phthalate, 30-55% by weight acrylic polymer emulsion, and balance water. In a certain embodiment, the acrylic paint includes 1-5% by weight butyl benzyl phthalate, 35-50% by weight acrylic poly emulsion, and balance water. Methods of treating surfaces of the reflow oven are further disclosed.
摘要翻译： 回流炉包括：腔室，其包括与被混合有污染物的热空气接触的表面，包括助熔剂，以及选择性地施加到腔室壳体表面的水溶性层。 回流炉的实施例包括丙烯酸类层，例如丙烯酸漆。 在一个实施方案中，丙烯酸涂料包括水溶性聚合物，聚合物乳液和水。 水溶性聚合物包括邻苯二甲酸苄基苄酯。 在一些实施方案中，丙烯酸涂料包括1-10重量％的邻苯二甲酸丁基苄酯，30-55重量％的丙烯酸聚合物乳液和余量的水。 在某个实施方案中，丙烯酸涂料包括1-5重量％的邻苯二甲酸丁基苄酯，35-50重量％的丙烯酸聚乳液和余量的水。 还公开了处理回流炉表面的方法。
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