公开(公告)号：US11886013B2

公开(公告)日：2024-01-30

申请号：US17619451

申请日：2020-06-12

Applicant: Aayuna Inc.

Inventor： Kalpendu Shastri ,  Anujit Shastri ,  Soham Pathak ,  Bipin D. Dama ,  Alan Leonhartsberger ,  Rutvij Dave ,  Rao Yelamarty

IPC: G02B6/30 ,  G02B6/36 ,  G02B6/42 ,  G02B6/136 ,  G02B6/12

CPC classification number: G02B6/30 ,  G02B6/3636 ,  G02B6/3692 ,  G02B6/4228 ,  G02B6/136 ,  G02B2006/12097

Abstract: Passive alignment and connection between a fiber array and a plurality of optical waveguides terminating along an edge of a photonic IC is provided by a controlled mating between V-grooves formed in a fiber support substrate and alignment ridges formed to surround waveguide terminations along an edge of a photonic IC. The V-grooves of the fiber support substrate are spaced to define the same pitch as the waveguides on the photonic IC, with the height and width of the alignment ridges formed to engage with the V-grooves upon mating of the fiber support substrate with the photonic IC. The individual fibers are positioned within associated V-grooves such that their endfaces are retracted from a proximal end portion of the support structure. It is this proximal end portion that mates with the alignment ridges on the photonic IC.

公开(公告)号：US20190214270A1

公开(公告)日：2019-07-11

申请号：US16240044

申请日：2019-01-04

Applicant: STMicroelectronics (Crolles 2) SAS

Inventor： Pierre BAR ,  Francois LEVERD ,  Delia RISTOIU

IPC: H01L21/311 ,  H01L21/308 ,  H01L21/3065 ,  H01L21/02

CPC classification number: H01L21/31144 ,  G02B6/3636 ,  G02B6/3652 ,  G02B6/3692 ,  G02B6/42 ,  H01L21/02507 ,  H01L21/3065 ,  H01L21/3086 ,  H01L21/31116

Abstract: A cavity is etched in a stack of layers which includes a first layer made of a first material and a second layer made of a second material. To etch the cavity, a first etch mask having a first opening is formed over the stack of layer. The stack of layers is then etched through the first opening to a depth located in the second layer. A second mask having a second opening, the dimensions of which are smaller, in top view, than the first opening, is formed over the stack of layer. The second opening is located, in top view, opposite the area etched through the first opening. The second layer is then etched through the second opening to reach the first layer. The etch method used is configured to etch the second material selectively over the first material.

公开(公告)号：US20180074266A1

公开(公告)日：2018-03-15

申请号：US15813432

申请日：2017-11-15

Applicant: II-VI Incorporated

Inventor： Mark Filipowicz ,  Mark H. Garrett

IPC: G02B6/36

CPC classification number: G02B6/3644 ,  G02B6/3518 ,  G02B6/3556 ,  G02B6/3668 ,  G02B6/3672 ,  G02B6/3692

Abstract: A two-dimensional (2D) optical fiber array component takes the form of a (relatively inexpensive) fiber guide block that is mated with a precision output element. The guide block and output element are both formed to include a 2D array of through-holes that exhibit a predetermined pitch. The holes formed in the guide block are relatively larger than those in precision output element. A loading tool is used to hold a 1×N array of fibers in a fixed position that exhibits the desired pitch. The loaded tool (holding the pre-aligned 1×N array of fibers) is then inserted through the aligned combination of the guide block and output element, and the fiber array is bonded to the guide block. The tool is then removed, re-loaded, and the process continued until all of the 1×N fiber arrays are in place. By virtue of using a precision tool to load the fibers, the guide block does not have to be formed to exhibit precise through-hole dimensions, allowing for a relatively inexpensive guide block to be used.

公开(公告)号：US09846280B2

公开(公告)日：2017-12-19

申请号：US15011370

申请日：2016-01-29

Applicant: II-VI Incorporated

Inventor： Mark Filipowicz ,  Mark H. Garrett

IPC: G02B6/36

CPC classification number: G02B6/3644 ,  G02B6/3518 ,  G02B6/3556 ,  G02B6/3668 ,  G02B6/3672 ,  G02B6/3692

Abstract: A two-dimensional (2D) optical fiber array component takes the form of a (relatively inexpensive) fiber guide block that is mated with a precision output element. The guide block and output element are both formed to include a 2D array of through-holes that exhibit a predetermined pitch. The holes formed in the guide block are relatively larger than those in precision output element. A loading tool is used to hold a 1×N array of fibers in a fixed position that exhibits the desired pitch. The loaded tool (holding the pre-aligned 1×N array of fibers) is then inserted through the aligned combination of the guide block and output element, and the fiber array is bonded to the guide block. The tool is then removed, re-loaded, and the process continued until all of the 1×N fiber arrays are in place. By virtue of using a precision tool to load the fibers, the guide block does not have to be formed to exhibit precise through-hole dimensions, allowing for a relatively inexpensive guide block to be used.

公开(公告)号：US09658415B2

公开(公告)日：2017-05-23

申请号：US14981880

申请日：2015-12-28

Applicant: International Business Machines Corporation

Inventor： Russell A. Budd ,  Paul F. Fortier

IPC: G02B6/36 ,  G02B6/122 ,  G02B6/42 ,  G02B6/12 ,  G02B6/32 ,  G02B6/132 ,  H04B10/40 ,  H04B10/2575 ,  H04B10/25

CPC classification number: G02B6/4243 ,  G02B6/32 ,  G02B6/3636 ,  G02B6/3652 ,  G02B6/3692 ,  G02B6/4214 ,  G02B6/423 ,  G02B6/4238 ,  G02B6/425 ,  G02B6/4257 ,  G02B6/4274 ,  H04B10/2504 ,  H04B10/2575 ,  H04B10/40 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155

Abstract: A structured substrate for optical fiber alignment is produced at least in part by forming a substrate with a plurality of buried conductive features and a plurality of top level conductive features. At least one of the plurality of top level conductive features defines a bond pad. A groove is then patterned in the substrate utilizing a portion of the plurality of top level conductive features as an etch mask and one of the plurality of buried conductive features as an etch stop. At least a portion of an optical fiber is placed into the groove.

公开(公告)号：US20160341919A1

公开(公告)日：2016-11-24

申请号：US15136229

申请日：2016-04-22

Applicant: Skorpios Technologies, Inc.

Inventor： Daming Liu ,  John Zyskind

IPC: G02B6/42 ,  G02B6/36 ,  G02B6/30

CPC classification number: G02B6/4243 ,  G02B6/30 ,  G02B6/3636 ,  G02B6/3652 ,  G02B6/3692 ,  G02B6/4202 ,  G02B6/4214 ,  G02B6/4225 ,  G02B6/4226 ,  G02B6/4239

Abstract: A v-groove assembly is used to edge couple a lensed fiber (e.g., an optical fiber made of silica) with a waveguide in a photonic chip. The v-groove assembly is made from fused silica. Fused silica is used to so that an adhesive (e.g., epoxy resin) used in bonding the lensed fiber to the v-groove assembly and/or bonding the v-groove assembly to the photonic chip can be cured, at least partially, by light.

Abstract translation: V沟槽组件用于将透镜光纤（例如，由二氧化硅制成的光纤）与光子芯片中的波导连接。 V型槽组件由熔融二氧化硅制成。 使用熔融二氧化硅使得用于将透镜纤维粘合到V形槽组件和/或将V形槽组件粘合到光子芯片上的粘合剂（例如，环氧树脂）可以至少部分地被光固化 。

公开(公告)号：US20160116692A1

公开(公告)日：2016-04-28

申请号：US14981898

申请日：2015-12-28

Applicant: International Business Machines Corporation

Inventor： Russell A. Budd ,  Paul F. Fortier

IPC: G02B6/42 ,  G02B6/32 ,  H04B10/25

CPC classification number: G02B6/4243 ,  G02B6/32 ,  G02B6/3636 ,  G02B6/3652 ,  G02B6/3692 ,  G02B6/4214 ,  G02B6/423 ,  G02B6/4238 ,  G02B6/425 ,  G02B6/4257 ,  G02B6/4274 ,  H04B10/2504 ,  H04B10/2575 ,  H04B10/40 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155

Abstract: A structured substrate for optical fiber alignment is produced at least in part by forming a substrate with a plurality of buried conductive features and a plurality of top level conductive features. At least one of the plurality of top level conductive features defines a bond pad. A groove is then patterned in the substrate utilizing a portion of the plurality of top level conductive features as an etch mask and one of the plurality of buried conductive features as an etch stop. At least a portion of an optical fiber is placed into the groove.

公开(公告)号：US09151915B2

公开(公告)日：2015-10-06

申请号：US13172259

申请日：2011-06-29

Applicant: Lou Castagna ,  Richard Dean Miller ,  Robert Nelson Fair, Jr. ,  Timothy John Loftus ,  Terry Patrick Bowen

Inventor： Lou Castagna ,  Richard Dean Miller ,  Robert Nelson Fair, Jr. ,  Timothy John Loftus ,  Terry Patrick Bowen

IPC: G02B6/12 ,  G02B6/42 ,  G02B6/36

CPC classification number: G02B6/4214 ,  G02B6/3636 ,  G02B6/3652 ,  G02B6/3684 ,  G02B6/3692 ,  G02B6/4228 ,  G02B6/423 ,  G02B6/4249

Abstract: An interposer comprising a plurality of optical conduits, each having an optical axis, a substrate defining a plurality of grooves having a terminal end, each optical conduit being disposed in a single groove, and a common angled surface traversing two or more of the grooves at the terminal end, at least a portion of the angled surface proximate the optical axes of the optical conduits in the two or more grooves is reflective, and one or more optical components disposed above the angled surface, the optical components and the optical conduits being optically coupled by the angled surface.

Abstract translation: 一种插入器，其包括多个光导管，每个光导管具有光轴，限定多个具有终端的凹槽的基板，每个光导管设置在单个凹槽中，以及在两个或多个凹槽中横穿两个或更多凹槽的共同的有角度的表面 终端，在两个或更多个凹槽中靠近光导管的光轴的成角度表面的至少一部分是反射性的，并且一个或多个光学部件设置在成角度的表面之上，光学部件和光导管是光学的 通过成角度的表面耦合。

公开(公告)号：US20140029891A1

公开(公告)日：2014-01-30

申请号：US13924890

申请日：2013-06-24

Applicant: Eigenlight Corporation

Inventor： Craig Douglas Poole ,  Adam Christian Giroux ,  Cathy Shaw Trumble

IPC: G02B6/42 ,  H01L31/0232

CPC classification number: G02B6/4251 ,  G02B6/3636 ,  G02B6/3692 ,  G02B6/424 ,  G02B6/4248 ,  G02B6/4274 ,  G02B6/429 ,  H01L31/02325 ,  Y10T29/53174

Abstract: An inventive hermetically sealed leaded package for in-line fiber optic devices, such as an optical fiber tap, is described. The package advantageously employs electrical feedthroughs that are compatible with batch processing of micromachined silicon wafers.

Abstract translation: 描述了用于诸如光纤丝锥之类的直列光纤装置的创新的密封的引线封装。 封装有利地采用与微加工硅晶片的批量处理兼容的电馈通。

公开(公告)号：US20130330034A1

公开(公告)日：2013-12-12

申请号：US13494803

申请日：2012-06-12

Applicant: Ningning Feng ,  Xiaochen Sun ,  Dawei Zheng

Inventor： Ningning Feng ,  Xiaochen Sun ,  Dawei Zheng

IPC: G02B6/12 ,  H01L31/12 ,  H01L33/58

CPC classification number: G02B6/423 ,  G02B6/3652 ,  G02B6/3692 ,  G02B6/4232 ,  H01L31/105

Abstract: An optical system includes a silicon substrate, a 45-degree or 54.7-degree reflector formed in the silicon substrate, deeply etched double U-shape trenches formed in the silicon substrate, a thin film disposed on the reflector surface with total or partial optical refection, a top and bottom surface contacted p-i-n structure formed in the silicon substrate for optical power monitoring, a plurality of rectangular or wedge shaped spacers formed on top surface of the silicon substrate, and a surface emitting light source flip-chip bonded on the silicon substrate via the spacers.

Abstract translation: 光学系统包括硅衬底，形成在硅衬底中的45度或54.7度反射器，形成在硅衬底中的深刻蚀刻的双U形沟槽，设置在反射器表面上的薄膜，具有全部或部分光学反射 ，形成在用于光功率监测的硅衬底中的顶部和底部表面接触的针结构，形成在硅衬底的顶表面上的多个矩形或楔形间隔件和接合在硅衬底上的表面发射光源倒装芯片 通过间隔件。