摘要:
A method of forming a charge-coupled device including the steps of forming well or substrate of a first conductivity type; a buried channel of a second conductivity type; a plurality of first gate electrodes; partially coating the first gate electrodes with a mask substantially aligned to an edge of the first gate electrodes; implanting ions of the first conductivity type of sufficient energy to penetrate the first gates and into the buried channel; and a plurality of second gate electrodes covering regions each over the buried channel between the first gate electrodes.
摘要:
A solid-state imaging device includes a plurality of vertical charge transferring portions, and a horizontal charge transferring portion connected to at least one end of each of the vertical charge transferring portions. A vertical transfer channel region of a first conductivity, an element isolating region of a second conductivity and a vertical well region of the second conductivity that constitute the vertical charge transferring portion are extended up to the connection portion between the vertical charge transferring portions and the horizontal charge transferring portion, and the end portions of the extended regions of the vertical transfer channel region of the first conductivity and the vertical well region of the second conductivity on the side of the horizontal charge transferring portion are positioned more on the side of the horizontal charge transferring portion than the end portion of the final vertical transfer electrode on the side of the horizontal charge transferring portion, and are positioned within 1.5 μm from the end portion of the element isolating region of the second conductivity on the side of the horizontal charge transferring portion.
摘要:
A method of fabricating a solid-state image pickup device comprising forming mask patterns corresponding to patterns of first and third transfer electrodes, which are to be alternately arranged in each vertical transfer register formation region and which are to extend in parallel to each other between light receiving portions adjacent to each other in the vertical direction, on a first electrode material layer. The method also includes forming side walls on each of the mask patterns. The method further includes patterning the first electrode material layer via the mask patterns having the side walls, to form first and third transfer electrodes formed by the first layer. The method yet further includes forming second transfer electrodes by a second electrode material layer via an insulating film in such a manner that each of said second transfer electrodes is disposed between the first and third transfer electrodes of the first layer in said vertical transfer register formation region and between the light receiving portions. The method still further includes forming fourth transfer electrodes by a third electrode material layer via an insulating film in such a manner that each of the fourth transfer electrodes is between the third and first transfer electrodes of the first layer in the vertical transfer register formation region and between the light receiving portions.
摘要:
A method of producing a three-dimensional feature on a substrate and adjacent electrically insulating films comprising producing a resist on a portion of a surface of a substrate; etching the substrate to remove portions of the substrate not covered by the resist, leaving an etched surface on part of the substrate, and producing a three-dimensional feature having side walls intersecting the etched surface of the substrate underlying and undercutting the resist so that the resist includes overhanging portions spaced from the etched surface of the substrate, the three-dimensional feature having a height between the resist and the etched surface of the substrate; depositing, in a chemical vapor deposition process at a relatively low temperature, a discontinuous electrically insulating film to a thickness no greater than the height of the three-dimensional feature in a first segment on the resist and in a second segment, discontinuous from the first segment, on the etched surface of the substrate adjacent the three-dimensional feature, including on the etched surface of the substrate between the etched surface of the substrate and the overhanging portions of the resist; and lifting off the resist and the first segment of the insulating film disposed on the resist to produce a flattened surface including the second segment of the insulating film and the three-dimensional feature.
摘要:
A solid-state image pickup device includes: a plurality of light receiving portions arranged in a matrix, and a vertical transfer register which is four-phase driven by first, second, third and fourth transfer electrodes of a three-layer structure. The vertical transfer register is provided for each of columns of the light receiving portions. The first and third transfer electrodes of the first layer are alternately arranged in a charge transfer direction, and the adjacent two of the first and third transfer electrodes extend in parallel to each other between the light receiving portions. With this solid-state image pickup device, the accumulated charge capacity of each transfer region composed of the adjacent transfer electrodes for two-phases is equalized and the area of the light receiving portion is increased irrespective of variations in processed dimension between the transfer electrodes.
摘要:
A silicon-based radiation-hard cryo-CMOS CCD process suitable for fabrication of devices (100) with sub-micron feature sizes. A re-oxidized nitride/oxide (RONO) layer (49″) is preserved in the CCD area (32) while plasma etching is used to define polysilicon 1 gates (50′) in the active FET area of the device. Thereafter, a wet chemical etching process, which does not destroy the integrity of the RONO layer (49″) in the CCD area, is carried out. A channel stop (48) is formed after the field oxidation step in the active FET area to reduce the space required for minimum diode breakdown voltage between the n+ source/drain region and the p+ channel stop.
摘要:
Methods of fabricating electrical contacts on both sides of a thin membrane to form a millimeter wave, self-aligned, opposed gate-source transistor are disclosed. The transistor structure has a subhalf-micron gate, dual-drains placed symmetrically around both sides of the gate, and a source approximately half the length of the gate. The source is directly opposite, and centered under, the gate on the opposite surface of a semiconductor thin film. The gate electrode is fabricated on the first surface of the thin film using conventional single surface lithography, and is used as a conformed mask for the source lithography, thereby self-aligning the source to the gate. The source is formed by resonant dielectric lithography, wherein the gate side of the thin film is irradiated by collimated ultraviolet light to expose a negative resist on the source side with a resolution of less than a wavelength. Lateral diffraction effects affect the relative dimension of the source with respect to the gate. The electron-beam lithographic process utilizes electron scattering in the thin film for the same purpose. This new untraviolet lithography process avoids the need to handle the thin film until after source metallization has been completed.
摘要:
A MESFET device is provided wherein the top Schottky gate is electrically isolated from the bottom gate. Methods as described for forming channels self aligned to Schottky top gates and complementary junction field effect transistors. A method is also described for adjusting or trimming the voltage to current characteristics of a MESFET by applying current pulses to the gate and through the channel to create conductive regions between the top and bottom gate. Dual segment gates or sources or drains may be provided to reduce the trimming current and appropriate steering circuity also provided. This technique may be used to adjust individual MESFETs, as well as current followers, differential amplifiers and other circuits which would be designed to include MESFETs.
摘要:
A method for manufacturing a solid-state image capturing apparatus including a pixel array constituted of a plurality of pixels, is provided, where each of the plurality of pixels includes a photoelectric conversion section, the method comprising the steps of: forming an impurity diffusion area in a surface area of a semiconductor substrate; and forming a plurality of different impurity diffusion areas in the surface area of the semiconductor substrate, other than the impurity diffusion area constituting the photoelectric conversion section.
摘要:
A method of fabricating a solid-state image pickup device comprising forming mask patterns corresponding to patterns of first and third transfer electrodes, which are to be alternately arranged in each vertical transfer register formation region and which are to extend in parallel to each other between light receiving portions adjacent to each other in the vertical direction, on a first electrode material layer. The method also includes forming side walls on each of the mask patterns. The method further includes patterning the first electrode material layer via the mask patterns having the side walls, to form first and third transfer electrodes formed by the first layer. The method yet further includes forming second transfer electrodes by a second electrode material layer via an insulating film in such a manner that each of said second transfer electrodes is disposed between the first and third transfer electrodes of the first layer in said vertical transfer register formation region and between the light receiving portions. The method still further includes forming fourth transfer electrodes by a third electrode material layer via an insulating film in such a manner that each of the fourth transfer electrodes is between the third and first transfer electrodes of the first layer in the vertical transfer register formation region and between the light receiving portions.