Abstract:
A conductive structure includes a laminated structure of an upper layer and a lower layer. The lower layer is formed of an aluminum alloy containing at least one kind of Group 8 elements in periodic table. The upper layer is laminated on the lower layer and formed of an aluminum alloy containing at least one kind of Group 8 elements in periodic table and nitrogen.
Abstract:
A surface acoustic wave device includes a piezoelectric substrate, a surface acoustic wave element composed of electrodes provided on the piezoelectric substrate and the piezoelectric substrate, a first seal resin portion provided on the piezoelectric substrate and having a cavity on the surface acoustic wave element, and an inorganic insulation film provided in contact with a surface of the piezoelectric substrate to surround the surface acoustic wave element.
Abstract:
According to an aspect of the present invention, there is provided a display apparatus including a TFT array substrate on which TFTs are formed in an array, a counter substrate disposed so as to face the TFT array substrate, and a sealing pattern for adhering the TFT array substrate and the counter substrate to each other, wherein the counter substrate comprises a counter electrode, and the TFT array substrate comprises a first conductive layer, a first insulating film formed on the first conductive layer, a second conductive layer disposed so as to intersect the first conductive layer via the first insulating film, a second insulating film formed on the second conductive layer and having at least two layers, and common electrode wiring provided below the sealing pattern and electrically connected to the counter electrode by the sealing pattern, and the sealing pattern overlaps the second conductive layer via the second insulating film.
Abstract:
An organic electroluminescence type display apparatus of top emission type, in which a thin film transistor (TFT), a flattening film made of organic resin and an organic EL element, in which at least an anode, an electroluminescence layer and a cathode are laminated on the flattening film in this order, are formed in each picture element in a display region on a substrate. The anode is composed of at least two layer film including an aluminum (Al) alloy film containing as a impurity at least one of transition metals of the eighth group of 3d into Al and including a light transmitting conductive oxide film laminated on the Al alloy film.
Abstract:
The present invention provides a highly reliable technology for manufacturing a substrate with protrusions. After filling an UV-curable transfer material into the grooves of an intaglio plate for transfer, the UV-curable transfer material is cured by irradiating UV rays under the conditions where it is exposed to an atmosphere that contains at least one of oxygen and ozone while a curing-inhibited portion is formed in an area of the UV-curable transfer material exposed to this atmosphere, and the UV-curable transfer material is transferred to the substrate to form the protrusions, while the curing-inhibited portion is made to adhere to the substrate.
Abstract:
A manufacturing method of TFT array substrate of an LCD includes step A of forming gate wiring and a gate electrode by subjecting a first metal thin film to a photolithography process; step B of forming semiconductor active film by subjecting a gate insulating film to photolithograhy; step C of forming a source wiring, and source and drain electrodes by subjecting a second metal thin film to a photolithography; step D of forming an interlayer insulating film, thereafter forming a contact hole by subjecting the interlayer insulating film to photolithography; and step E of forming a pixel electrode by subjecting a transparent conductive film to photolithography where the second metal thin film is composed of an alloy containing Mo as a main component. The step B and C are replaced by a step of forming a gate insulating film and a second metal thin film, thereafter forming a TFT by a photolithography.
Abstract:
By using a metal thin film comprising a layer of metal and a layer obtained by adding nitrogen atoms to metal for a metal thin film which becomes a gate electrode and the like, and for a metal thin film which becomes a source electrode and a drain electrode, there is prepared electro-optic elements free from display defects caused by high contact resistance at connected portion of the pixel electrode with the above electrodes even when a low resistance line material is used.
Abstract:
A thin film transistor includes a substrate, a gate electrode, an insulating film, a semiconductor film, a source electrode, a drain electrode, wherein in at least one electrode of the gate electrode, the source electrode and the drain electrode, end portion of the at least one electrode is tapered in such a manner that a thickness decreases in a direction toward end face of the at least one electrode, the at least one electrode being composed of one electrode material, and prescribed physical property of the at least one electrode being changed in a direction perpendicular to a surface of the at least one electrode, so that an etching rate of the at least one electrode is changed in the direction.
Abstract:
An Al wiring film having a tapered shape is obtained easily and in a stable manner. An Al wiring film has a double-layer structure including a first Al alloy layer made of Al or an Al alloy, and a second Al alloy layer laid on the first Al alloy layer and having a composition different from a composition of the first Al alloy layer by containing at least one element of Ni, Pd, and Pt. The second Al alloy layer is etched by an alkaline chemical solution used in a developing process of a photoresist, and an end portion of the second Al alloy layer recedes from an end portion of the photoresist. Thereafter, by performing wet etching using the photoresist as a mask, a cross section of the Al wiring film becomes a tapered shape.
Abstract:
A production method of an electronic component includes: forming a sheet having a resin layer and a metal layer formed under the resin layer; bonding the sheet to a substrate so that the metal layer is arranged on a functional portion of an acoustic wave element formed on the substrate, a frame portion surrounding the functional portion is formed between the metal layer and the substrate, a cavity is formed on the functional portion by the metal layer and the frame portion, and the resin layer covers the metal layer and the frame portion.