公开(公告)号：US20100059313A1

公开(公告)日：2010-03-11

申请号：US12553903

申请日：2009-09-03

Applicant: Chi-Ming Lee ,  Yu-Ming Su

Inventor： Chi-Ming Lee ,  Yu-Ming Su

IPC: G10K11/16 ,  H05K1/00

CPC classification number: H05K1/189 ,  H05K1/0271 ,  H05K2201/09418 ,  H05K2201/10015 ,  H05K2201/10083 ,  H05K2201/10636 ,  H05K2201/2045 ,  Y02P70/611

Abstract: A layout structure and a method for reducing audible noise generated by a flexible printed circuit are provided. The layout structure includes a flexible printed circuit and a piezoelectric element. The flexible printed circuit is disposed with respect to an axis. When an alternating voltage/current is applied across the piezoelectric element, the piezoelectric element expands and contracts alternately. The piezoelectric element is located on the flexible printed circuit, and an angle between the axis and a side of the piezoelectric element is less than 90 degrees.

Abstract translation: 提供了一种用于降低由柔性印刷电路产生的可听噪声的布局结构和方法。 布局结构包括柔性印刷电路和压电元件。 柔性印刷电路相对于轴设置。 当在压电元件两端施加交流电压/电流时，压电元件交替地膨胀和收缩。 压电元件位于柔性印刷电路上，轴与压电元件侧之间的角度小于90度。

公开(公告)号：US20100047838A1

公开(公告)日：2010-02-25

申请号：US12563799

申请日：2009-09-21

Applicant: Paul G. Ahlquist ,  Masayuki Ishikawa ,  Juana Diez ,  Duane B. Price ,  Wai-Ming Lee

Inventor： Paul G. Ahlquist ,  Masayuki Ishikawa ,  Juana Diez ,  Duane B. Price ,  Wai-Ming Lee

IPC: C12Q1/26

CPC classification number: C07K14/395 ,  A01K2217/05 ,  A01K2217/075 ,  A61K35/12 ,  A61K38/00 ,  A61K48/00 ,  C12N9/0083 ,  C12Q1/25

Abstract: An antiviral agent comprising an altered MAB1, MAB2, MAB3, or OLE1 gene, gene homologs or related genes is disclosed. In another embodiment, the present invention is a method of creating a virus resistant organism comprising creating a transgenic organism comprising an antiviral agent selected from the group of altered MAB1 genes, MAB2 genes, MAB3 genes or OLE1 genes, homologs of these genes, related genes and combinations of these genes and homologs.

Abstract translation: 公开了包含改变的MAB1，MAB2，MAB3或OLE1基因，基因同系物或相关基因的抗病毒剂。 在另一个实施方案中，本发明是产生病毒抗性生物的方法，其包括产生转基因生物，其包含选自改变的MAB1基因，MAB2基因，MAB3基因或OLE1基因的抗病毒剂，这些基因的同系物，相关基因 以及这些基因和同系物的组合。

公开(公告)号：US07662449B2

公开(公告)日：2010-02-16

申请号：US11394105

申请日：2006-03-31

Applicant: Horng-Long Tyan ,  Chyi-Ming Leu ,  Hang-Chang Chang ,  Tzong-Ming Lee

Inventor： Horng-Long Tyan ,  Chyi-Ming Leu ,  Hang-Chang Chang ,  Tzong-Ming Lee

IPC: B32B27/28

CPC classification number: C08G73/10 ,  C08G73/1039 ,  C08G73/1064 ,  G02F1/133305 ,  G02F1/133514 ,  Y10T428/1036 ,  Y10T428/1086

Abstract: A liquid crystal display. The liquid crystal display includes a color filter substrate and an array substrate, wherein at least one of the color filter substrate and the array substrate comprises polyimide having formula (I): wherein A and A′ are the same or different and comprise cycloaliphatic compounds or aromatic compounds, B and B′ are the same or different and comprise cycloaliphatic compounds or aromatic compounds, and x and y are 10˜10000, wherein at least one of A and A′ is a cycloaliphatic compound.

Abstract translation: 液晶显示屏。 液晶显示器包括滤色器基板和阵列基板，其中至少一个滤色器基板和阵列基板包括具有式（I）的聚酰亚胺：其中A和A'相同或不同，并且包含脂环族化合物或 芳香族化合物，B和B'相同或不同，并且包含脂环族化合物或芳族化合物，x和y为10〜10000，其中A和A'中的至少一个为脂环族化合物。

公开(公告)号：US20100014359A1

公开(公告)日：2010-01-21

申请号：US12565778

申请日：2009-09-24

Applicant: Hsin-Ming Chen ,  Hai-Ming Lee ,  Shih-Jye Shen ,  Ching-Hsiang Hsu

Inventor： Hsin-Ming Chen ,  Hai-Ming Lee ,  Shih-Jye Shen ,  Ching-Hsiang Hsu

IPC: G11C16/04 ,  G11C11/34

CPC classification number: H01L27/115

Abstract: An operating method of a non-volatile memory adapted for a non-volatile memory disposed on an SOI substrate including a first conductive type silicon body layer is provided. The non-volatile memory includes a gate, a charge storage structure, a second conductive type drain region, and a second conductive type source region. In operating such a non-volatile memory, voltages are applied to the gate, the second conductive type drain region, the second conductive type source region and the first conductive type silicon body layer beneath the gate, to inject electrons or holes in to the charge storage structure or evacuate the electrons from the charge storage structure by a method selected from a group consisting of channel hot carrier injection, source side injection, band-to-band tunnelling hot carrier injection and Fowler-Nordheim (F-N) tunnelling.

Abstract translation: 提供了适用于设置在包括第一导电型硅体层的SOI衬底上的非易失性存储器的非易失性存储器的操作方法。 非易失性存储器包括栅极，电荷存储结构，第二导电类型漏极区域和第二导电型源极区域。 在操作这种非易失性存储器时，电压施加到门下方的栅极，第二导电型漏极区域，第二导电型源极区域和第一导电型硅体层，以将电荷或空穴注入电荷 通过选自由通道热载流子注入，源侧注入，带对带隧穿热载流子注入和Fowler-Nordheim（FN）隧道的组中选择的方法，从电荷存储结构排出电子。

公开(公告)号：US07640578B2

公开(公告)日：2009-12-29

申请号：US10191984

申请日：2002-07-08

Applicant: Vinod Vasnani ,  Nikhil Jhingan ,  Soo Ying Ng ,  HanSeah Sim ,  Chee Siang Lim ,  Kelvin Wee Ming Lee ,  Mathieu Legrand

Inventor： Vinod Vasnani ,  Nikhil Jhingan ,  Soo Ying Ng ,  HanSeah Sim ,  Chee Siang Lim ,  Kelvin Wee Ming Lee ,  Mathieu Legrand

IPC: G06F7/04

CPC classification number: H04L63/12 ,  H04L63/0807 ,  H04L63/0876 ,  H04L63/10

Abstract: A secure method for requesting resources in a distributed computer network is described. The method comprises of a means of securely integrating a request for a resource along with its validation and authentication from a first server with restrictions for the request such as expiry date and IP address as well as other request parameters. The resulting request is placed on a second server which is capable of decoding and responding to the request or redirects the request securely to a third computer to respond.

Abstract translation: 描述了在分布式计算机网络中请求资源的安全方法。 该方法包括一种安全地集成资源请求以及来自第一服务器的验证和认证的方法，该请求具有诸如到期日期和IP地址以及其他请求参数的请求的限制。 所产生的请求被放置在第二服务器上，该第二服务器能够对请求进行解码和响应，或将请求安全地重定向到第三计算机以进行响应。

公开(公告)号：US20090310660A1

公开(公告)日：2009-12-17

申请号：US12257370

申请日：2008-10-23

Applicant: CHE-MING LEE ,  YEW-MIN LO

Inventor： CHE-MING LEE ,  YEW-MIN LO

IPC: H04L27/10

CPC classification number: H04M11/066 ,  H04L12/10

Abstract: A system includes a plurality of modules which are configured for determining a suitable impedance for a modem. The plurality of modules send signals with a plurality of signal frequencies to a telephone and receive feedback signals from the telephone under each of a plurality of impedances of the modem, compute a total decibel value of the feedbacks under each impedance, and determine a suitable impedance according to a minimum total decibel value from the plurality of total decibel values.

Abstract translation: 一种系统包括被配置用于确定调制解调器的合适阻抗的多个模块。 多个模块将多个信号频率的信号发送到电话机，并且在调制解调器的多个阻抗中的每一个下接收来自电话的反馈信号，计算每个阻抗下的反馈的总分贝值，并且确定合适的阻抗 根据多个总分贝值中的最小总分贝值。

公开(公告)号：US20090300253A1

公开(公告)日：2009-12-03

申请号：US12232355

申请日：2008-09-16

Applicant: Jung-Lung Lien ,  Tun-Ming Lee ,  Yueh-Yun Chen

Inventor： Jung-Lung Lien ,  Tun-Ming Lee ,  Yueh-Yun Chen

IPC: G06F13/00

CPC classification number: G06F13/387 ,  Y10S439/945

Abstract: The invention relates to a changeable central processing unit (CPU) module apparatus for a computer, comprising a system control module board, a CPU module board and a heat-dissipating device. A second bus connector of the CPU module board is a golden finger plug extending from the CPU module board and is installed on a socket plug of a first bus connector of the system control module board. With the invention, a user can reduce the cost of updating the CPU and increase the period of using a peripheral equipment of the computer.

Abstract translation: 本发明涉及一种用于计算机的可变中央处理单元（CPU）模块装置，包括系统控制模块板，CPU模块板和散热装置。 CPU模块板的第二总线连接器是从CPU模块板延伸的金指插头，并安装在系统控制模块板的第一总线连接器的插座上。 通过本发明，用户可以降低更新CPU的成本并增加使用计算机的外围设备的周期。

公开(公告)号：US20090280316A1

公开(公告)日：2009-11-12

申请号：US12187393

申请日：2008-08-07

Applicant: HAN-MING LEE ,  CHIH-CHIEN HUNG ,  HSIANG-SHENG CHOU ,  CHING-HSIEN CHANG

Inventor： HAN-MING LEE ,  CHIH-CHIEN HUNG ,  HSIANG-SHENG CHOU ,  CHING-HSIEN CHANG

IPC: B32B7/00 ,  B05D5/10 ,  B32B15/00 ,  B32B15/08

CPC classification number: H05K5/0217 ,  G06F1/1616 ,  G06F1/1626 ,  G06F1/1656 ,  G06F1/1698 ,  G06F1/181 ,  G06F2200/1633 ,  G06F2200/1634 ,  Y10T428/26 ,  Y10T428/31678 ,  Y10T428/31681

Abstract: An exemplary joining structure, used for insert-molded covers, includes a metallic portion (131), a plastic portion (132) integrally formed with the metallic portion, and an adhesive film (133) formed between the metallic portion and the plastic portion. The metallic portion and the plastic portion are bonded together by the adhesive film. The present invention also relates an insert-molded cover (10) for electronic devices using the joining structure and a method for manufacturing the insert-molded cover for electronic devices.

Abstract translation: 用于嵌入成型的盖的示例性接合结构包括金属部分（131），与金属部分一体形成的塑料部分（132）和形成在金属部分和塑料部分之间的粘合膜（133）。 金属部分和塑料部分通过粘合剂膜粘合在一起。 本发明还涉及一种使用接合结构的电子设备的嵌入成型盖（10）以及用于制造电子设备的嵌入式盖的方法。

公开(公告)号：US20090278282A1

公开(公告)日：2009-11-12

申请号：US12187394

申请日：2008-08-07

Applicant: HAN-MING LEE ,  CHIH-CHIEN HUNG ,  HSIANG-SHENG CHOU ,  CHING-HSIEN CHANG

Inventor： HAN-MING LEE ,  CHIH-CHIEN HUNG ,  HSIANG-SHENG CHOU ,  CHING-HSIEN CHANG

IPC: B29C45/14 ,  H01Q13/00

CPC classification number: H04M1/0252 ,  H01Q1/084 ,  H01Q1/2266 ,  H01Q1/40 ,  Y10T29/49016

Abstract: The present invention relates to an insert-molded cover (10) for electronic devices. The insert-molded cover includes a metallic body (11) and a plastic antenna lid (12) integrally formed with the metallic body. The metallic body includes a joining area (13) on an edge of the metallic body, the plastic antenna lid includes at least two portions (12a, 12b) formed in the joining area correspondingly. The present invention also relates to a method for manufacturing an insert-molded cover for electronic devices.

Abstract translation: 本发明涉及一种用于电子设备的嵌入成型盖（10）。 插入成型的盖包括与金属体一体形成的金属体（11）和塑料天线盖（12）。 金属体包括在金属体的边缘上的接合区域（13），塑料天线盖子包括相应地形成在接合区域中的至少两个部分（12a，12b）。 本发明还涉及一种用于制造用于电子设备的嵌入成型盖的方法。

公开(公告)号：US20090267266A1

公开(公告)日：2009-10-29

申请号：US12187396

申请日：2008-08-07

Applicant: HAN-MING LEE ,  CHIH-CHIEN HUNG ,  HSIANG-SHENG CHOU ,  CHING-HSIEN CHANG

Inventor： HAN-MING LEE ,  CHIH-CHIEN HUNG ,  HSIANG-SHENG CHOU ,  CHING-HSIEN CHANG

IPC: B29C45/14 ,  H01Q13/00

CPC classification number: G06F1/1656 ,  G06F1/1616 ,  G06F1/1698 ,  G06F1/181 ,  Y10T29/49016

Abstract: The present invention relates to an insert-molded cover (10) for a electronic device. The insert-molded cover includes a metallic body (11) and a plastic antenna lid (12) integrally formed on an edge of the metallic body. An outer surface (101) of a junction of the metallic body and the plastic antenna lid is smooth and painted by a coating (13). The present invention also relates a method for manufacturing an insert-molded cover for electronic devices.

Abstract translation: 本发明涉及一种用于电子设备的嵌入成型盖（10）。 插入成型的盖包括金属体（11）和一体地形成在金属体的边缘上的塑料天线盖（12）。 金属体和塑料天线盖的接合部的外表面（101）光滑并被涂层（13）涂覆。 本发明还涉及一种用于制造用于电子设备的嵌入成型盖的方法。