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    Method of manufacturing inkjet printhead
    91.
    发明授权
    Method of manufacturing inkjet printhead 有权
    制造喷墨打印头的方法

    公开(公告)号：US08216482B2

    公开(公告)日：2012-07-10

    申请号：US12428808

    申请日：2009-04-23

    Applicant: Jong-Seok Kim ,  Yong-Seop Yoon ,  Moon-Chul Lee ,  Yong-Won Jeong ,  Dong-Sik Shim ,  Hyung Choi

    Inventor： Jong-Seok Kim ,  Yong-Seop Yoon ,  Moon-Chul Lee ,  Yong-Won Jeong ,  Dong-Sik Shim ,  Hyung Choi

    IPC: G01D15/00 ,  G11B5/127 ,  C23F1/00 ,  H01L21/00 ,  H01L21/311

    CPC classification number: B41J2/1603 ,  B41J2/1628 ,  B41J2/1631 ,  B41J2/1639

    Abstract: A method of manufacturing an inkjet printhead includes forming a chamber layer having multiple ink chambers on a substrate. A sacrificial layer is formed and is configured to fill a space associated with the ink chambers on the chamber layer. A nozzle layer is formed on the top surfaces of the chamber layer and the sacrificial layer and having multiple nozzles. An etching mask is prepared on the bottom surface of the substrate. The etching mask has at least one linear etching pattern configured to define a portion of the substrate in which an ink feed hole is to be formed. The substrate is etched through the linear etching pattern until the sacrificial layer is exposed and a through hole is formed. The through hole defines the portion of the substrate in which the ink feed hole is to be formed. The sacrificial layer and the portion of the substrate surrounded by the through hole are removed to form the ink feed hole.

    Abstract translation: 制造喷墨打印头的方法包括在基板上形成具有多个墨室的腔层。 牺牲层被形成并被配置成填充与腔室层上的墨水室相关联的空间。 喷嘴层形成在腔室层和牺牲层的顶表面上并且具有多个喷嘴。 在基板的底表面上制备蚀刻掩模。 蚀刻掩模具有至少一个线性蚀刻图案，其被配置为限定要在其中形成供墨孔的基板的一部分。 通过线性蚀刻图案蚀刻衬底，直到牺牲层被暴露并形成通孔。 通孔限定要在其中形成供墨孔的基板部分。 牺牲层和由通孔包围的基板的部分被去除以形成供墨孔。

    Ink ejecting device and method of manufacturing the same
    92.
    发明授权
    Ink ejecting device and method of manufacturing the same 有权
    喷墨装置及其制造方法

    公开(公告)号：US08109609B2

    公开(公告)日：2012-02-07

    申请号：US12416954

    申请日：2009-04-02

    Applicant: Dong-Sik Shim ,  Yong-Seop Yoon ,  Bang-Weon Lee ,  Moon-Chul Lee ,  Yong-Won Jeong ,  Jong-Seok Kim

    Inventor： Dong-Sik Shim ,  Yong-Seop Yoon ,  Bang-Weon Lee ,  Moon-Chul Lee ,  Yong-Won Jeong ,  Jong-Seok Kim

    IPC: B41J2/14

    CPC classification number: B41J2/14145

    Abstract: Disclosed are an ink ejecting device and a method of manufacturing the same. The disclosed ink ejecting device includes an inkjet head including a substrate, which includes an ink feed hole, a plurality of via holes, which are formed in the rear surface of the substrate, and which expose the ink feed holes therethtough, a chamber layer stacked on the substrate, and a nozzle layer stacked on the chamber layer, and includes a base header, which is attached to the inkjet head and includes a plurality of ink supply slots having a corresponding arrangement with respect to the via holes.

    Abstract translation: 公开了一种喷墨装置及其制造方法。 所公开的喷墨装置包括喷墨头，其包括基板，该基板包括形成在基板的后表面中并且使墨供给孔暴露的多个通孔，堆叠的腔层 在基板上，以及层叠在室层上的喷嘴层，并且包括附接到喷墨头并包括相对于通孔具有相应布置的多个供墨槽的基座。

    Thermal inkjet print head
    93.
    发明授权
    Thermal inkjet print head 失效
    热喷墨打印头

    公开(公告)号：US08066356B2

    公开(公告)日：2011-11-29

    申请号：US12209775

    申请日：2008-09-12

    Applicant: Moon-chul Lee ,  Yong-seop Yoon ,  Yong-won Jeong ,  Dong-sik Shim ,  Sung-joon Park ,  Jong-seok Kim

    Inventor： Moon-chul Lee ,  Yong-seop Yoon ,  Yong-won Jeong ,  Dong-sik Shim ,  Sung-joon Park ,  Jong-seok Kim

    IPC: B41J2/05 ,  B41J2/04

    CPC classification number: B41J2/1404 ,  B41J2/14129 ,  B41J2/17563 ,  B41J2002/14403

    Abstract: A thermal inkjet printhead is provided including a substrate, and a chamber layer, which is stacked on the substrate. The chamber layer includes an ink chamber that is filled with ink supplied from an ink feed hole. The printhead includes a heater inside the ink chamber that heats the ink, an island, which is formed on the substrate at an ink inlet port of the ink chamber, and a nozzle layer, which is stacked on the chamber layer, including a nozzle for ejecting the ink. The walls of the ink chamber and the island that face each other are symmetrical with respect to the center of the nozzle.

    Abstract translation: 提供一种热喷墨打印头，包括基板和层叠在基板上的室层。 室层包括填充有从供墨孔供应的油墨的油墨室。 打印头包括在油墨室内加热油墨的加热器，在油墨室的墨水入口处形成在基板上的岛和层叠在室层上的喷嘴层，其包括用于 喷墨。 相对于喷嘴的中心，墨水室和彼此面对的岛的壁是对称的。

    COOLER AND DISPLAY DEVICE HAVING THE SAME
    94.
    发明申请
    COOLER AND DISPLAY DEVICE HAVING THE SAME 有权
    具有它的冷却器和显示装置

    公开(公告)号：US20110167845A1

    公开(公告)日：2011-07-14

    申请号：US12868061

    申请日：2010-08-25

    Applicant: Moon-chul LEE ,  Min-soo Kim ,  Yong-soo Lee ,  Sru Kim

    Inventor： Moon-chul LEE ,  Min-soo Kim ,  Yong-soo Lee ,  Sru Kim

    IPC: F25D17/06 ,  F28F13/12 ,  H05K7/20

    CPC classification number: H05K7/20972 ,  F04D25/166 ,  F04D29/441 ,  F04D29/444 ,  F05D2250/52 ,  H05K7/20172

    Abstract: A cooler and a display device including the cooler. The cooler includes: a housing; an air blowing unit disposed inside the housing and sucking external air and blowing the external air in the housing, wherein the air blowing unit includes a plurality of groups each including two air blowers; a guide vane disposed above the air blowing unit and to guide air flowed out from the air blowing unit to flow in different directions; and a plurality of auxiliary guide vanes disposed between the air blowing unit and the guide vane, and each disposed in each of the groups each including two air blowers, so as to guide air flowing below the air blowing unit to flow toward the guide vane.

    Abstract translation: 一种冷却器和包括该冷却器的显示装置。 冷却器包括：一个外壳; 吹风单元，其设置在所述壳体内部并吸入外部空气并吹送所述壳体中的外部空气，其中所述吹风单元包括多个组，每个组包括两个鼓风机; 引导叶片，其设置在所述吹风单元的上方，并且引导从所述送风单元流出的空气沿不同方向流动; 以及设置在送风单元和导向叶片之间的多个辅助导向叶片，并且每个辅助导向叶片各自设置在每个组中，每个组包括两个鼓风机，以便引导在吹风单元下方流动的空气流向导向叶片。

    Micro antenna and method of manufacturing the same
    95.
    发明授权
    Micro antenna and method of manufacturing the same 失效
    微天线及其制造方法

    公开(公告)号：US07926165B2

    公开(公告)日：2011-04-19

    申请号：US11712526

    申请日：2007-03-01

    Applicant: Young-tack Hong ,  Moon-chul Lee ,  In-sang Song ,  Sang-wook Kwon ,  Chang-won Jung ,  Eun-seok Park

    Inventor： Young-tack Hong ,  Moon-chul Lee ,  In-sang Song ,  Sang-wook Kwon ,  Chang-won Jung ,  Eun-seok Park

    IPC: H01P11/00 ,  H01Q13/00 ,  H01Q17/00 ,  H01Q1/36 ,  H05K3/36 ,  H01K3/10

    CPC classification number: H01Q1/2283 ,  H01F17/0033 ,  H01F41/041 ,  H01Q1/362 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/49126 ,  Y10T29/49165

    Abstract: A method of manufacturing a micro antenna is provided. The method includes forming a plurality of holes penetrating a first substrate, filling each of the plurality of holes with a conductive material to form a plurality of vertical conducting parts, forming a plurality of horizontal conducting parts on each of two different surfaces of the first substrate, wherein the each of the horizontal conducting parts is electrically connected to the corresponding vertical conducting parts, bonding the first substrate, on which the vertical conducting parts and the horizontal conducting parts have been formed, to a second substrate, and removing the first substrate to expose a whole structure of a 3D micro antenna which is formed on the second substrate and includes the vertical conducting parts and the horizontal conducting parts connected to each other.

    Abstract translation: 提供一种制造微型天线的方法。 该方法包括：形成穿过第一基板的多个孔，用导电材料填充多个孔中的每个孔，以形成多个垂直导电部分，在第一基板的两个不同表面的每一个上形成多个水平导电部件 其中，每个水平导电部分电连接到相应的垂直导电部分，将其上形成有垂直导电部分和水平导电部分的第一基板接合到第二基板，并且将第一基板去除 露出形成在第二基板上的3D微型天线的整体结构，并且包括彼此连接的垂直导电部分和水平导电部件。

    MICRO PUMP
    96.
    发明申请
    MICRO PUMP 有权
    微型泵

    公开(公告)号：US20110020140A1

    公开(公告)日：2011-01-27

    申请号：US11266903

    申请日：2005-11-04

    Applicant: Tae-sik Park ,  Young-il Kim ,  Jung-ho Kang ,  Moon-chul Lee

    Inventor： Tae-sik Park ,  Young-il Kim ,  Jung-ho Kang ,  Moon-chul Lee

    IPC: F04B37/02

    CPC classification number: F04B19/006 ,  F04B43/043

    Abstract: Provided is a micro pump having a simple structure. The micro pump includes a pump chamber including inflow and outflow passages through which a drive fluid flows, a first valve configured to open or close the inflow passage, a second valve configured to open or close the outflow passage, and a pump chamber heating and cooling unit configured to heat or cool the pump chamber.

    Abstract translation: 提供一种结构简单的微型泵。 微型泵包括泵室，其包括驱动流体流过的流入和流出通道，构造成打开或关闭流入通道的第一阀，构造成打开或关闭流出通道的第二阀，以及泵室加热和冷却 单元被配置为加热或冷却泵室。

    Wafer level package for surface acoustic wave device and fabrication method thereof
    98.
    发明授权
    Wafer level package for surface acoustic wave device and fabrication method thereof 有权
    用于表面声波器件的晶片级封装及其制造方法

    公开(公告)号：US07545017B2

    公开(公告)日：2009-06-09

    申请号：US11447969

    申请日：2006-06-07

    Applicant: Moon-chul Lee ,  Jun-sik Hwang ,  Ji-hyuk Lim ,  Woon-bae Kim

    Inventor： Moon-chul Lee ,  Jun-sik Hwang ,  Ji-hyuk Lim ,  Woon-bae Kim

    IPC: H01L29/84

    CPC classification number: H03H9/1092 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/16195 ,  H01L2924/00014

    Abstract: A wafer level package for a surface acoustic wave (SAW) device and a fabrication method thereof. The SAW device wafer level package includes a SAW device in which a SAW element is formed on a top surface of a device wafer, a cap wafer which is bonded with a top surface of the SAW device and has a viahole penetrating the cap wafer, and a conductive member to fill a part of the viahole. The viahole has a first via portion and a second via portion, the first via portion has a gradually smaller diameter from a bottom surface of the cap wafer until a certain depth, and the second via portion has a gradually greater diameter from the first via portion until a top surface of the cap wafer.

    Abstract translation: 一种用于表面声波（SAW）器件的晶片级封装及其制造方法。 SAW器件晶片级封装包括SAW器件，其中SAW元件形成在器件晶片的顶表面上，盖晶片与SAW器件的顶表面结合并具有穿透盖晶片的通孔，以及 用于填充通孔的一部分的导电构件。 通孔具有第一通孔部分和第二通孔部分，第一通孔部分具有从盖子晶片的底表面到一定深度的逐渐变小的直径，并且第二通孔部分具有从第一通孔部分 直到盖晶片的顶表面。

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