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    Communication transmission system
    95.
    发明授权
    Communication transmission system 有权
    通讯传输系统

    公开(公告)号：US09036652B2

    公开(公告)日：2015-05-19

    申请号：US13422914

    申请日：2012-03-16

    Applicant: Golnaz Farhadi ,  Wei-Peng Chen

    Inventor： Golnaz Farhadi ,  Wei-Peng Chen

    IPC: H04W72/00 ,  H04W52/02 ,  H04W72/12 ,  H04W4/00 ,  H04W68/00

    CPC classification number: H04W52/0219 ,  H04W4/70 ,  H04W68/00 ,  H04W72/121 ,  Y02D70/1242 ,  Y02D70/1262 ,  Y02D70/1264 ,  Y02D70/21 ,  Y02D70/24 ,  Y02D70/25

    Abstract: In an example embodiment, a system may include a base station configured to broadcast a group scheduling message configured to be received at a terminal group that includes a plurality of terminals. The base station may further be configured to receive group transmissions transmitted at the plurality of terminals in a scheduled sequence in response to the group scheduling message. The base station may further be configured to broadcast a group reply in response to receiving the group transmission.

    Abstract translation: 在示例性实施例中，系统可以包括被配置为广播组态调度消息的基站，所述组调度消息被配置为在包括多个终端的终端组处接收。 基站还可以被配置为响应于组调度消息以调度的顺序接收在多个终端处发送的组传输。 基站还可以被配置为响应于接收到组传输来广播组回复。

    Method and apparatus for locally managed allocation of bandwidth in a wireless network
    96.
    发明授权
    Method and apparatus for locally managed allocation of bandwidth in a wireless network 有权
    用于在无线网络中本地管理的带宽分配的方法和装置

    公开(公告)号：US08989034B2

    公开(公告)日：2015-03-24

    申请号：US13511422

    申请日：2011-01-12

    Applicant: Chenxi Zhu ,  Wei-Peng Chen

    Inventor： Chenxi Zhu ,  Wei-Peng Chen

    IPC: H04J3/14 ,  H04W24/02 ,  H04W24/08 ,  H04W24/10 ,  H04W28/16 ,  H04W72/04 ,  H04W72/08 ,  H04W84/04

    CPC classification number: H04W24/02 ,  H04W24/08 ,  H04W24/10 ,  H04W28/16 ,  H04W72/042 ,  H04W72/0453 ,  H04W72/08 ,  H04W84/045

    Abstract: A method for allocating bandwidth in a wireless network includes communicating wirelessly with at least one end-point using a first frequency bandwidth. The method may also include receiving a measurement of a signal quality from the at least one endpoint. The method may further include determining a second frequency bandwidth based on the signal quality and a cost per unit of frequency bandwidth, wherein the second frequency bandwidth indicates an amount of frequency bandwidth to use in communicating wirelessly with the at least one endpoint. The method may additionally include communicating wirelessly with the at least one endpoint using the second frequency bandwidth.

    Abstract translation: 用于在无线网络中分配带宽的方法包括使用第一频率带宽与至少一个端点进行无线通信。 该方法还可以包括从至少一个端点接收信号质量的测量。 该方法还可以包括基于信号质量和每单位频率带宽的成本确定第二频率带宽，其中第二频带指示用于与至少一个端点进行无线通信的频带宽度。 该方法可以另外包括使用第二频率带宽与至少一个端点进行无线通信。

    Solar cell
    97.
    发明授权
    Solar cell 有权
    太阳能电池

    公开(公告)号：US08952244B2

    公开(公告)日：2015-02-10

    申请号：US13089321

    申请日：2011-04-19

    Applicant: Yen-Cheng Hu ,  Peng Chen ,  Shuo-Wei Liang ,  Zhen-Cheng Wu

    Inventor： Yen-Cheng Hu ,  Peng Chen ,  Shuo-Wei Liang ,  Zhen-Cheng Wu

    IPC: H01L31/00 ,  H01L31/0216 ,  H01L31/0224 ,  H01L31/0352 ,  H01L31/068

    CPC classification number: H01L31/02168 ,  H01L31/022441 ,  H01L31/035209 ,  H01L31/035227 ,  H01L31/0682 ,  Y02E10/547

    Abstract: A solar cell includes a semiconductor substrate, a doping layer, a quantum well layer, a first passivation layer, a second passivation layer, a first electrode and a second electrode. The semiconductor substrate has a front surface and a back surface, and the front surface of the semiconductor substrate includes nano-rods. The doping layer covers the surface of the nano-rods. The electrode layers cover the doping layer. The quantum well layer having at least one first doping region and at least one second doping region is disposed on the semiconductor substrate. The quantum well layer includes polycrystalline silicon germanium (Si1-xGex). The first passivation layer and the second passivation layer cover the first and the second doping regions of the quantum well layer, respectively. The first electrode and the second electrode are electrically connected to the first doping region and the second doping region of the quantum well layer, respectively.

    Abstract translation: 太阳能电池包括半导体衬底，掺杂层，量子阱层，第一钝化层，第二钝化层，第一电极和第二电极。 半导体衬底具有前表面和后表面，并且半导体衬底的前表面包括纳米棒。 掺杂层覆盖纳米棒的表面。 电极层覆盖掺杂层。 具有至少一个第一掺杂区域和至少一个第二掺杂区域的量子阱层设置在半导体衬底上。 量子阱层包括多晶硅锗（Si1-xGex）。 第一钝化层和第二钝化层分别覆盖量子阱层的第一和第二掺杂区域。 第一电极和第二电极分别电连接到量子阱层的第一掺杂区域和第二掺杂区域。

    Paddle for electroplating for selectively depositing greater thickness
    98.
    发明授权
    Paddle for electroplating for selectively depositing greater thickness 有权
    用于选择性地沉积更大厚度的电镀用桨

    公开(公告)号：US08920616B2

    公开(公告)日：2014-12-30

    申请号：US13525510

    申请日：2012-06-18

    Applicant: Chao-Peng Chen ,  Jaswant Chudasama ,  Pradeep Mishra ,  Chen-Li Lin ,  David Wagner

    Inventor： Chao-Peng Chen ,  Jaswant Chudasama ,  Pradeep Mishra ,  Chen-Li Lin ,  David Wagner

    IPC: C25D17/00 ,  C25D21/10 ,  C25D7/12 ,  C25D5/16

    CPC classification number: C25D17/00 ,  C25D5/02 ,  C25D5/16 ,  C25D5/50 ,  C25D7/123 ,  C25D17/001 ,  C25D17/008 ,  C25D21/10

    Abstract: An electroplating method is disclosed that selectively deposits a greater thickness of a metal or alloy layer on a region of wafer that has a higher thickness loss during a subsequent chemical mechanical polish process. A paddle assembly has three rectangular sides joined at their edges to form a triangle shape from an end view, and a notch in a bottom side that faces a wafer during the plating process. The notch extends along second and third paddle sides to a height up to about 50% of the paddle thickness. The thickness in a K-block region that has two sides formed parallel to the wafer flat is selectively increased by aligning a first side of the paddle notch side directly over one K-block side and aligning a second notch side directly over a second K-block side during a paddle movement cycle. The notch may be rectangular shaped or tapered.

    Abstract translation: 公开了一种电镀方法，其在随后的化学机械抛光工艺期间选择性地在晶片的区域上沉积更大厚度的金属或合金层，该区域具有较高的厚度损失。 桨组件在其边缘处连接有三个矩形侧面以从端视图形成三角形形状，并且在电镀过程期间在底侧的面向晶片的凹口。 切口沿着第二和第三桨叶侧延伸到高达桨叶厚度的约50％的高度。 通过将桨式切口侧的第一侧直接对准一个K块侧并且将第二切口侧直接对准第二K形截面侧，从而选择性地增加具有平行于晶片平面的两侧的K块区域中的厚度。 在桨运动循环期间的侧面。 切口可以是矩形或锥形。

    ELECTRONIC MODULE, LIGHTING DEVICE AND MANUFACTURING METHOD OF THE ELECTRONIC MODULE
    99.
    发明申请
    ELECTRONIC MODULE, LIGHTING DEVICE AND MANUFACTURING METHOD OF THE ELECTRONIC MODULE 审中-公开
    电子模块，照明设备和电子模块的制造方法

    公开(公告)号：US20140362590A1

    公开(公告)日：2014-12-11

    申请号：US14238204

    申请日：2012-08-10

    Applicant: Peng Chen ,  Xiaomian Chen ,  Yaojun Feng ,  Hao Li

    Inventor： Peng Chen ,  Xiaomian Chen ,  Yaojun Feng ,  Hao Li

    IPC: H05K1/02 ,  F21V29/00 ,  H05K3/28

    CPC classification number: H05K1/0206 ,  H05K3/0061 ,  H05K3/284 ,  H05K2201/10106 ,  H05K2203/10 ,  H05K2203/1147 ,  H05K2203/1316 ,  H05K2203/1327 ,  Y10T29/49146

    Abstract: An electronic module to be mounted on a mounting surface may include: a circuit board provided with a heat source, wherein a thermal via is formed through the circuit board and is in thermal contact with the heat source; and a potting material packaging the circuit board at least at the other side opposite to one side of heat source, wherein the potting material has a recess formed in at least part of an area corresponding to the thermal via at the other side of the circuit board and a thermal conductive material, which is thermal-conductively connected to the mounting surface, is filled in the recess.

    Abstract translation: 安装在安装表面上的电子模块可以包括：设置有热源的电路板，其中热通孔通过电路板形成并与热源热接触; 以及灌封材料至少在与热源一侧相对的另一侧封装所述电路板，其中所述灌封材料具有形成在与所述电路板的另一侧上的热通孔对应的区域的至少一部分中的凹部 并且导热连接到安装表面的导热材料填充在凹部中。

    Electrical parameter detection device for peripheral component interconnect devices
    100.
    发明授权
    Electrical parameter detection device for peripheral component interconnect devices 有权
    用于外围组件互连设备的电气参数检测装置

    公开(公告)号：US08872521B2

    公开(公告)日：2014-10-28

    申请号：US13424394

    申请日：2012-03-20

    Applicant: Ya-Jun Pan ,  Qi-Yan Luo ,  Peng Chen ,  Song-Lin Tong

    Inventor： Ya-Jun Pan ,  Qi-Yan Luo ,  Peng Chen ,  Song-Lin Tong

    IPC: G06F11/22

    CPC classification number: G06F11/221

    Abstract: An electrical parameter detection device is configured for detecting electrical parameters of a peripheral component interconnect (PCI) connector including a plurality of power pins. The electrical parameter detection device includes a processor module, a first detection module, and a second detection module. The processor module continuously detects voltage values of electric potentials provided by each of the power pins of the PCI connector using the first detection module, and determines time sequences of the electric potentials according to the voltage values of the electric potentials. Furthermore, the processor module detects the amount of power provided by each of the power pins of the PCI connector using the second detection module.

    Abstract translation: 电参数检测装置被配置为检测包括多个电源引脚的外围组件互连（PCI）连接器的电参数。 电参数检测装置包括处理器模块，第一检测模块和第二检测模块。 处理器模块使用第一检测模块连续地检测由PCI连接器的每个电源引脚提供的电位的电压值，并且根据电位的电压值确定电位的时间序列。 此外，处理器模块使用第二检测模块检测由PCI连接器的每个电源引脚提供的电力量。

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