公开(公告)号：US20240222418A1

公开(公告)日：2024-07-04

申请号：US18537830

申请日：2023-12-13

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Tae Hwan SONG

IPC: H01L27/15 ,  H01L33/44 ,  H01L33/62

CPC classification number: H01L27/15 ,  H01L33/44 ,  H01L33/62 ,  H01L2933/0025 ,  H01L2933/0066

Abstract: Proposed is a vertically stacked electronic device that enables the implementation of high-resolution displays by stacking individual LEDs vertically, and a method for manufacturing the vertically stacked electronic device.

公开(公告)号：US20240192253A1

公开(公告)日：2024-06-13

申请号：US18284524

申请日：2022-03-22

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Tae Hwan SONG

IPC: G01R1/067 ,  G01R1/073

CPC classification number: G01R1/06761 ,  G01R1/07342

Abstract: Proposed are an electrically conductive contact pin formed by stacking a plurality of metal layers and a manufacturing method therefor, in which the electrically conductive contact pin has improved physical or electrical characteristics.

公开(公告)号：US20230290740A1

公开(公告)日：2023-09-14

申请号：US18015711

申请日：2021-07-27

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: H01L23/00 ,  H01L23/14 ,  H01L23/32 ,  H01L23/498 ,  H01L23/525 ,  H01L23/528 ,  H01L25/065

CPC classification number: H01L23/562 ,  H01L23/14 ,  H01L23/32 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/525 ,  H01L23/528 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0652 ,  H01L2224/16145 ,  H01L2224/32225 ,  H01L2224/73204

Abstract: The present invention relates to an anodized film substrate base made of an anodized oxide film, an anodized film substrate part including a vertical conductive part provided inside the anodized film substrate base, an anodized film-based interposer having same, and a semiconductor package having same.

公开(公告)号：US11691387B2

公开(公告)日：2023-07-04

申请号：US17232029

申请日：2021-04-15

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: B32B15/04 ,  B32B15/20 ,  B32B3/26 ,  G01R1/073 ,  C25D11/04

CPC classification number: B32B15/043 ,  B32B3/266 ,  B32B15/20 ,  C25D11/04 ,  G01R1/07342 ,  B32B2255/06 ,  B32B2255/20

Abstract: Proposed are a laminated anodic aluminum oxide structure in which a plurality of anodic aluminum oxide films are stacked, a guide plate of a probe card using the same, and a probe card having the same. More particularly, proposed are a laminated anodic aluminum oxide structure with a high degree of surface strength, a guide plate of a probe card using the same, and a probe card having the same.

公开(公告)号：US20230152350A1

公开(公告)日：2023-05-18

申请号：US17912518

申请日：2021-03-23

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Sung Hyun BYUN ,  Dong Hyeok SEO

IPC: G01R1/073

CPC classification number: G01R1/07378 ,  G01R1/07342 ,  G01R31/2886

Abstract: Proposed are a probe head for testing, through a probe, a pattern formed on a wafer, and a probe card having the same. More particularly, proposed are a probe head in which formation of a guide hole into which a probe is inserted and insertion of the probe therein are facilitated, and a probe card having the same.

公开(公告)号：US11545596B2

公开(公告)日：2023-01-03

申请号：US17351019

申请日：2021-06-17

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Moon Hyun Kim

IPC: H01L33/48 ,  H01L33/58 ,  H01L33/62 ,  H01L33/64

Abstract: An optical component package includes a main substrate including a plurality of metal bodies, and a vertical insulation part provided between the metal bodies; a cavity provided in an upper surface of the main substrate; a sub-substrate provided in the cavity of the main substrate, the sub-substrate including an insulating body, a plurality of via holes vertically passing through the insulating body and filled with a metal material being electrically connected to each of the metal bodies, and a plurality of metal pads mounted on the insulating body and electrically connected to the plurality of via holes; a plurality of optical components mounted on the plurality of metal pads and electrically connected to the plurality of metal pads; and a light transmitting member provided above the main substrate.

公开(公告)号：US20220411340A1

公开(公告)日：2022-12-29

申请号：US17851061

申请日：2022-06-28

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Young Heum EOM ,  Tae Hwan SONG

IPC: C04B41/45 ,  H01L21/67 ,  C04B41/00 ,  C04B41/50 ,  C04B41/87 ,  C23C16/04 ,  C23C16/455 ,  C23C16/56

Abstract: Proposed are a part having a corrosion-resistant layer that minimizes peeling off and particle generation of a porous ceramic layer, a manufacturing process apparatus having the same, and a method of manufacturing the part.

公开(公告)号：US11217464B2

公开(公告)日：2022-01-04

申请号：US16370810

申请日：2019-03-29

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: H01L21/67 ,  B65G47/91 ,  H01L33/62 ,  H01L27/12 ,  H01L25/075

Abstract: The present invention relates to a system for transferring a micro LED, the system not only releasing a grip force of a transfer head when transferring a micro LED to a substrate but also applying an additional force to the micro LED from below the substrate to attract the micro LED onto the substrate.

公开(公告)号：US11152534B2

公开(公告)日：2021-10-19

申请号：US16534699

申请日：2019-08-07

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Tae Hwan Song

IPC: H01L33/00 ,  H01L27/15 ,  H01L33/48 ,  H01L25/075

Abstract: The present invention relates to a transfer head and a method of manufacturing a micro LED display using the same. In particular, the present invention relates to a transfer head and a method of manufacturing a micro LED display using the same, the transfer head mounting normal micro LEDs on a display substrate without performing a complicated process of sorting out defective micro LEDs from the micro LEDs mounted on the display substrate and replacing the defective micro LEDs with normal micro LEDs.

公开(公告)号：US11133209B2

公开(公告)日：2021-09-28

申请号：US16216376

申请日：2018-12-11

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: H01L21/677 ,  H01L25/075 ,  H01L33/06 ,  H01L33/44 ,  H01L33/40 ,  H01L33/42 ,  H01L21/683 ,  H01L27/15 ,  H01L33/00 ,  H01L21/67

Abstract: Disclosed is a transfer head for transferring micro-LEDs from a first substrate to a second substrate, particularly, using a vacuum adsorption method. The transfer head includes a porous member having a plurality of pores, in which the micro-LEDs are transferred by creating or releasing a vacuum pressure in the pore of the porous member.