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    INERTIAL SENSOR
    94.
    发明申请
    INERTIAL SENSOR 有权
    惯性传感器

    公开(公告)号：US20130167634A1

    公开(公告)日：2013-07-04

    申请号：US13409039

    申请日：2012-02-29

    Applicant: Seung Mo Lim ,  Sung Wook Kim ,  Sung Jun Lee ,  Kyo Yeol Lee ,  Yun Sung Kang

    Inventor： Seung Mo Lim ,  Sung Wook Kim ,  Sung Jun Lee ,  Kyo Yeol Lee ,  Yun Sung Kang

    IPC: G01C19/56

    CPC classification number: G01C19/56 ,  G01P15/09 ,  G01P15/14 ,  G01P2015/084

    Abstract: Disclosed herein is an inertial sensor. The inertial sensor 100 according to preferred embodiments of the present invention includes: a membrane 110; a mass body 120 disposed under the membrane 110; a piezoelectric body 130 formed on the membrane 110 to drive the mass body 120; and trenches 140 formed by being collapsed in a thickness direction of the piezoelectric body 130 so as to vertically meet a direction in which the mass body 120 is driven. By this configuration, the trenches are formed by being collapsed in a thickness direction of the piezoelectric body 130 to provide directivity while retaining the rigidity of the piezoelectric body 130 to prevent a wave from being propagated in an unnecessary direction, thereby driving the inertial sensor 100 in a desired specific direction.

    Abstract translation: 这里公开了惯性传感器。 根据本发明的优选实施例的惯性传感器100包括：膜110; 设置在膜110下方的质量体120; 形成在膜110上以驱动质量体120的压电体130; 以及通过在压电体130的厚度方向上折叠而形成的沟槽140，以便垂直地与质量体120的驱动方向相遇。 通过这种构造，通过在压电体130的厚度方向上收缩形成沟槽，以提供方向性，同时保持压电体130的刚性，以防止波在不必要的方向上传播，从而驱动惯性传感器100 在所需的特定方向。

    METHOD OF MANUFACTURING INERTIAL SENSOR
    96.
    发明申请
    METHOD OF MANUFACTURING INERTIAL SENSOR 审中-公开
    制造传感器的方法

    公开(公告)号：US20120267825A1

    公开(公告)日：2012-10-25

    申请号：US13184564

    申请日：2011-07-17

    Applicant: Sung Jun LEE ,  Won Kyu JEUNG

    Inventor： Sung Jun LEE ,  Won Kyu JEUNG

    IPC: B29C70/00

    CPC classification number: G01C19/56 ,  B81B2201/025 ,  B81C1/00182 ,  B81C2201/0108 ,  B81C2201/0187 ,  G01P15/0802 ,  G01P15/09

    Abstract: The method of manufacturing an inertial sensor includes: (A) disposing a first mold 120 and a second mold 125 on both surfaces of a predetermined region R in a plate-shaped membrane 110, (B) forming a mass body 130, a post 140, and an upper cap 150 through a plating process or a filling process, (C) disposing a third mold 160 on an exposed surface of the first mold 120 and the mass body 130, and (D) forming a lower cap 170 through the plating process or the filling process. Since the mass body 130 is made of metal by a plating process or a filling process, the density of the mass body 130 may be increased and the mass body 130 may be formed to have a structure of a high aspect ratio, thereby improving the sensitivity of the inertial sensor 100.

    Abstract translation: 惯性传感器的制造方法包括：（A）在板状膜110中的规定区域R的两面上设置第一模具120和第二模具125，（B）形成质量体130，柱140 ，以及通过电镀处理或填充处理的上盖150，（C）在第一模具120和质量体130的暴露表面上设置第三模具160，以及（D）通过电镀形成下盖170 过程或填充过程。 由于质量体130通过电镀处理或填充处理由金属制成，因此可以增加质量体130的密度，并且可以将质量体130形成为具有高纵横比的结构，从而提高灵敏度 的惯性传感器100。

    ELECTRIC CURLING IRON
    97.
    发明申请
    ELECTRIC CURLING IRON 审中-公开
    电动修整铁

    公开(公告)号：US20120138081A1

    公开(公告)日：2012-06-07

    申请号：US13368800

    申请日：2012-02-08

    Applicant: Sung Jun LEE

    Inventor： Sung Jun LEE

    IPC: A45D1/04

    CPC classification number: A45D1/04 ,  A45D1/06

    Abstract: Disclosed therein is an electric curling iron. The electric curling iron includes: a body part; a heating rod arranged at a side of the body part and having a heat ray heater disposed therein; an upper handle and a lower handle hinge-coupled on a hinge shaft formed at the other side of the body part, the upper and lower handles being movable in a tong shape; and an upper pressing member and a lower pressing member whose end portions are respectively overlapped and hinge-coupled to front ends of the inner faces of the upper and lower handles, the upper and lower pressing members respectively having a shape corresponding to the outer circumferential surface of the heating rod, wherein the upper and lower pressing members are opened wider than the upper and lower handles, so that a user can rapidly and convenient do hair styling.

    Abstract translation: 其中公开了电动卷发器。 电动卷发器包括：身体部位; 设置在身体部分的一侧并具有放置在其中的热射线加热器的加热棒; 上手柄和下手柄，铰链联接在形成在主体部分另一侧的铰链轴上，上手柄和下手柄可以钳形运动; 以及上部按压构件和下部按压构件，其端部分别重叠并铰接于上部和下部手柄的内表面的前端，上部和下部按压构件分别具有与外周表面相对应的形状 的上部和下部按压构件比上部和下部手柄开口更宽，从而用户可以快速方便地进行头发造型。

    CALIBRATION METHOD FOR Tx/Rx PATH CHARACTERISTIC OF CHANNEL SOUNDER
    98.
    发明申请
    CALIBRATION METHOD FOR Tx/Rx PATH CHARACTERISTIC OF CHANNEL SOUNDER 有权
    用于Tx / Rx路径特征的通道声音校准方法

    公开(公告)号：US20110150139A1

    公开(公告)日：2011-06-23

    申请号：US12973231

    申请日：2010-12-20

    Applicant: Sung-Jun LEE ,  Kwang-Chun LEE ,  Hyun-Kyu CHUNG

    Inventor： Sung-Jun LEE ,  Kwang-Chun LEE ,  Hyun-Kyu CHUNG

    IPC: H04L27/00

    CPC classification number: H04B1/7113 ,  H04B17/14

    Abstract: The method includes performing a wired back-to-back test by forming M wired paths connecting one of the N transmission antennas with the M reception antennas through M cables, separating ith digital data corresponding to an ith receiver wired path from the plurality of digital data stored in the receiver wherein i is a natural number greater than 1 and smaller than M, extracting a time delay by decimating the separated ith digital data and performing sliding correlation on the decimated data, and extracting attenuation and phase characteristics of the ith receiver wired path by extracting samples after the time delay among the decimated samples.

    Abstract translation: 该方法包括：通过M个电缆形成连接N个发送天线中的一个与M个接收天线的M个有线路径进行有线背靠背测试，该多个数字数据与第i个接收机有线路径相对应的数字数据 存储在接收机中，其中i是大于1且小于M的自然数，通过抽取分离的第i个数字数据并对抽取的数据执行滑动相关提取时间延迟，并且提取第i个接收机有线路径的衰减和相位特性 通过在抽取的样本之间的时间延迟之后提取样本。

    GAIN CONTROL APPARATUS AND METHOD IN RECEIVER OF MULTIBAND OFDM SYSTEM
    99.
    发明申请
    GAIN CONTROL APPARATUS AND METHOD IN RECEIVER OF MULTIBAND OFDM SYSTEM 失效
    多频OFDM系统接收机的增益控制装置及方法

    公开(公告)号：US20100136939A1

    公开(公告)日：2010-06-03

    申请号：US12507474

    申请日：2009-07-22

    Applicant: Seong-Min Kim ,  Byung-Su Kang ,  Gweon-Do Jo ,  Jae-Ho Jung ,  Joon-Hyung Kim ,  Heon-Kook Kwon ,  Sung-Jun Lee ,  Kwang-Chun Lee

    Inventor： Seong-Min Kim ,  Byung-Su Kang ,  Gweon-Do Jo ,  Jae-Ho Jung ,  Joon-Hyung Kim ,  Heon-Kook Kwon ,  Sung-Jun Lee ,  Kwang-Chun Lee

    IPC: H04B7/00

    CPC classification number: H04L27/2647 ,  H03G3/3068

    Abstract: A gain control apparatus in a receiver of multiband OFDM system includes: an amplifier amplifying a received signal based on a first auto gain control signal; an analog-to-digital converter for converting the amplified signal into a digital signal; band reception signal extractor for extracting a signal of a desired reception band from the converted digital signal for each reception band, and controlling gain of the extracted signal according to a second auto gain control signal; a reception power detector for detecting a reception power value of whole band from the converted digital signal; and a multiband integration baseband processor for generating the first auto gain control signal by using the detected reception power value of the whole band, and generating the second auto gain control signal to be provided to the band reception signal extraction units, resource allocation information for each band and a reception power for each reception band.

    Abstract translation: 多频带OFDM系统的接收机中的增益控制装置包括：基于第一自动增益控制信号放大接收信号的放大器; 用于将放大的信号转换成数字信号的模拟 - 数字转换器; 频带接收信号提取器，用于从每个接收频带的转换的数字信号中提取期望的接收频带的信号，并根据第二自动增益控制信号控制所提取的信号的增益; 接收功率检测器，用于从转换的数字信号中检测整个频带的接收功率值; 以及多频带集成基带处理器，用于通过使用检测到的整个频带的接收功率值来产生第一自动增益控制信号，并且生成要提供给频带接收信号提取单元的第二自动增益控制信号，每个 频带和每个接收频带的接收功率。

    LED package using Si substrate and fabricating method thereof
    100.
    发明授权
    LED package using Si substrate and fabricating method thereof 失效
    使用Si衬底的LED封装及其制造方法

    公开(公告)号：US07582496B2

    公开(公告)日：2009-09-01

    申请号：US11312412

    申请日：2005-12-21

    Applicant: Sung Jun Lee ,  Woong Lin Hwang ,  Sang Hyun Choi ,  Chang Hyun Lim ,  Ho Joon Park ,  Seog Moon Choi

    Inventor： Sung Jun Lee ,  Woong Lin Hwang ,  Sang Hyun Choi ,  Chang Hyun Lim ,  Ho Joon Park ,  Seog Moon Choi

    IPC: H01L21/00 ,  H01L33/00

    CPC classification number: H01L33/642 ,  H01L33/486 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

    Abstract: There are provided an LED package using a Si substrate and a fabricating method of the LED package. In the LED package, a supporting structure includes a Si substrate and an insulating layer formed on top and bottom surfaces of the Si substrate, and the supporting structure defines at least one groove in a bottom surface by partially removing the Si substrate and the insulating layer. A plurality of upper electrodes is formed on a top surface of the supporting structure. At least one LED is mounted on the top surface of the supporting structure, and the LED includes both terminals electrically connected to the upper electrodes. A metal filler is filled in the groove defined in the bottom surface of the supporting structure.

    Abstract translation: 提供了使用Si衬底的LED封装和LED封装的制造方法。 在LED封装中，支撑结构包括Si衬底和形成在Si衬底的顶表面和底表面上的绝缘层，并且支撑结构通过部分去除Si衬底和绝缘层而在底表面中限定至少一个凹槽 。 多个上电极形成在支撑结构的顶表面上。 至少一个LED安装在支撑结构的顶表面上，并且LED包括电连接到上电极的两个端子。 金属填料填充在支撑结构的底面中限定的槽中。

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