Abstract:
A semiconductor chip package including a semiconductor chip including a first surface having bonding pads, a second surface facing the first surface, and sidewalls; a molding extension part surrounding the second surface and the sidewalls of the semiconductor chip; redistribution patterns extending from the bonding pads over the molding extension part, and electrically connected to the bonding pads; bump solder balls on the redistribution patterns; and a molding layer configured to cover the first surface of the semiconductor chip and the molding extension part, while exposing portions of each of the bump solder balls. The molding layer has concave meniscus surfaces between the bump solder balls adjacent to each other.
Abstract:
The present invention relates to a flash memory cell string. The flash memory cell string includes a plurality of cell devices and switching devices connected to ends of the cell devices. Each of the cell devices includes a semiconductor substrate, and a transmissive insulating layer, a charge storage node, a control insulating layer and a control electrode sequentially formed on the semiconductor substrate. In the flash memory cell string, a buried insulating layer is provided on the semiconductor substrate between the cell device and an adjacent cell device, thus enabling an inversion layer, which performs the functions of source/drain, to be easily formed.According to the present invention, the reduction characteristics and performance of the cell devices of NAND flash memory are improved, and the inversion layer of a channel is induced through fringing electric fields from the control electrode and the charge storage node if necessary.
Abstract:
Disclosed is a thermal fuse structured in such a manner that a resistance heating element which generates heat according to an electric current is mounted within a case charged with a solid fusible material so that the fusible material is liquefied by heat of the resistance heating element caused by the external temperature and also by the current applied to a circuit, accordingly disconnecting the circuit. Since the resistance heating element is integrally formed in the case, the thermal fuse is capable of functioning as both a thermal fuse and a current fuse, disconnecting the circuit by both the external heat and the overcurrent. Especially, when the resistance heating element comprises a positive thermal coefficient (PTC) element capable of temperature measurement, the current flowing through the circuit can be measured.
Abstract:
In a method of manufacturing a semiconductor device, a gate insulation layer is formed on a substrate including a first channel of a first conductive type and a second channel of a second conductive type different from the first conductive type. A first conductive layer including a first metal is formed on the gate insulation layer, and a second conductive layer including a second metal different from the first metal is formed on the first conductive layer formed over the second channel. The second conductive layer is partially removed by a wet etching process to form a second conductive layer pattern over the second channel.
Abstract:
A PIP capacitor and methods thereof. A method of fabricating a PIP capacitor may include forming a field oxide film over a silicon substrate to define a device isolating region and/or an active region. A method of fabricating a PIP capacitor may include forming a lower polysilicon electrode having doped impurities on and/or over an field oxide film. A method of fabricating a PIP capacitor may include performing an oxidizing step to form a first oxide film over a polysilicon and/or a second oxide film on and/or over an active region. A method of fabricating a PIP capacitor may include forming an upper polysilicon electrode on and/or over a region of a first oxide film and forming a gate electrode on and/or over a second oxide film at substantially the same time. A method of fabricating a PIP capacitor may include forming a polysilicon resistor. A PIP capacitor is disclosed.
Abstract:
Provided are a high-performance one-transistor floating-body DRAM cell device and a manufacturing method thereof. The one-transistor floating-body DRAM cell device includes: a semiconductor substrate; a gate stack which is formed on the semiconductor substrate; a control electrode which is formed on the semiconductor substrate and surrounded by the gate stack; a floating body which is formed on the control electrode that is surrounded by the gate stack; source/drain which are formed at left and right sides of the floating body; an insulating layer which insulates the source/drain from the semiconductor substrate and the control electrode; a gate insulating layer which is formed on the floating body and the source/drain; and a gate electrode which is formed on the gate insulating layer. In the cell device having a double-gate structure, charges can be stored in a non-volatile manner by the control electrodes, so that it is possible to improve a degree of integration of devices, a uniformity of characteristic, and a sensing margin.
Abstract:
Provided is a handover method of a wireless communication system using a hierarchical cellular scheme. In the method, signal quality of a serving node is measured, so that whether to start scanning for a handover is determined. When the scanning for the handover starts, signal qualities of a serving cell including the serving node and one or more neighbor cells are measured through a first preamble including a first identifier for distinguishing a cell. An intra-cell handover or an inter-cell handover is selected using the signal qualities of the serving cell and the neighbor cells. Therefore, a terminal can easily distinguish between the inter-cell handover and the intra-cell handover, and an overhead during a handover can be reduced because an intra-cell handover procedure is simplified.
Abstract:
Disclosed is a system and method for transmitting feedback information in a communication system. A receiver calculates a minimum distance of each two symbol vectors among all symbol vectors which can be received through a kth subcarrier among a plurality of subcarriers, in which a channel state of the kth subcarrier and a jth precoder among precoders included in a codebook set are applied; calculates sums of minimum distances by adding minimum distances calculated for the plurality of subcarriers according to each precoder; determines a precoder corresponding to a value greatest among the sums of minimum distances calculated according to the precoders, as a precoder representing the plurality of subcarriers; and feeds the feedback information including a precoder index of the determined precoder back to a transmitter.
Abstract:
An apparatus and a method are provided for detecting N number of TX signals in a MIMO wireless communication system. The apparatus includes an RF processor, a channel estimator, and a signal detector. The RF processor converts signals, received through multiple antennas, into baseband signals. The channel estimator estimates channel information of the respective antennas by using the received signals. The signal detector arranges the baseband signals of the respective antennas on the basis of the channel information, calculates a threshold value of each stage, and selects symbols with a cumulative metric smaller than or equal to the threshold value as candidates at each stage, to detect a TX signal vector with N number of symbols.
Abstract:
A method of forming a field effect transistor includes forming a vertical channel protruding from a substrate including a source/drain region junction between the vertical channel and the substrate, and forming an insulating layer extending on a side wall of the vertical channel toward the substrate to beyond the source/drain region junction. The method may also include forming a nitride layer extending on the side wall away from the substrate to beyond the insulating layer, forming a second insulating layer extending on the side wall that is separated from the channel by the nitride layer, and forming a gate electrode extending on the side wall toward the substrate to beyond the source/drain region junction.