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    OBLIQUE ANGLE MICROMACHINING OF FLUIDIC STRUCTURES
    93.
    发明申请
    OBLIQUE ANGLE MICROMACHINING OF FLUIDIC STRUCTURES 有权
    流体结构的偏心角度微观结构

    公开(公告)号：US20120193023A1

    公开(公告)日：2012-08-02

    申请号：US13019246

    申请日：2011-02-01

    申请人： David K. Fork ,  Scott E. Solberg

    发明人： David K. Fork ,  Scott E. Solberg

    IPC分类号： B32B38/10 ,  B29C47/12

    CPC分类号： B32B38/10 ,  B29C47/0002 ,  B29C47/0021 ,  B29C47/06 ,  B29C47/0883 ,  B29C47/128 ,  B29C47/705 ,  B29C47/707 ,  Y10T156/1082

    摘要： An extrusion device has a stack of at least two layers, the stack including an outlet, an inlet for a first material, and a feed channel for the first material arranged to fluidically connect to the inlet for the first material, the feed channel having a sloped end. A method of manufacturing an extrusion device includes forming an outlet, an inlet for a first material and a feed channel for the first material having a sloped end in a stack of layers, aligning the stack of layers to fluidically connect the feed channel for the first material with the inlet for the first material and to fluidically connect the inlet for the first material with the outlet, and bonding the layers together.

    摘要翻译： 挤出装置具有至少两层的堆叠，所述堆叠包括出口，用于第一材料的入口和用于第一材料的进料通道，其布置成流体连接到用于第一材料的入口，所述进料通道具有 倾斜的一端 制造挤出装置的方法包括形成出口，用于第一材料的入口和用于第一材料的进料通道，所述第一材料在层叠中具有倾斜的端部，使层叠体对准以流体连接用于第一材料的进料通道 材料，其具有用于第一材料的入口并且将第一材料的入口与出口流体连接，并将层粘合在一起。

    INTERDIGITATED ELECTRODE DEVICE
    95.
    发明申请
    INTERDIGITATED ELECTRODE DEVICE 有权
    间断电极器件

    公开(公告)号：US20120153211A1

    公开(公告)日：2012-06-21

    申请号：US12972384

    申请日：2010-12-17

    申请人： David K. Fork ,  Karl Littau

    发明人： David K. Fork ,  Karl Littau

    IPC分类号： H01B1/00 ,  H01M4/04

    CPC分类号： H01B1/00 ,  B29C47/0019 ,  B29C47/065 ,  B29C47/705 ,  B29C47/707 ,  H01G11/26 ,  H01G11/86 ,  H01M4/02 ,  H01M4/0411 ,  H01M4/8626 ,  H01M4/8864 ,  H01M12/06 ,  Y02E60/13 ,  Y02E60/50

    摘要： An electrode structure has a layer of at least two interdigitated materials, a first material being an electrically conductive material and a second material being an ionically conductive material, the materials residing co-planarly on a membrane in fluid form, at least one of the interdigitated materials forming a feature having an aspect ratio greater than one. A method of forming an electrode structure includes merging flows of an electrically conductive material and a second material in a first direction into a first combined flow, dividing the first combined flow in a second direction to produce at least two separate flows, each separate flow including flows of the electrically conductive material and the second material, merging the two separate flows into a second combined flow, repeating the merging and dividing flow as desired to produce a final combined flow, and depositing the final combined flow as an interdigitated structure in fluid form onto a substrate such that at least one of the materials forms a feature in the structure having an aspect ratio greater than one.

    摘要翻译： 电极结构具有至少两个交叉指向的材料层，第一材料是导电材料，第二材料是离子导电材料，该材料共同平面地位于流体形式的膜上，至少一个交叉指向 形成纵横比大于1的特征的材料。 形成电极结构的方法包括将第一方向上的导电材料和第二材料的流动合并成第一组合流，将第一组合流沿第二方向分开以产生至少两个单独的流，每个分离的流包括 导电材料和第二材料的流动，将两个分离的流合并成第二组合流，根据需要重复合并和分流以产生最终的组合流，并将最终的组合流作为交错结构沉积成流体形式 使得至少一种材料形成具有大于1的纵横比的结构中的特征。

    METHOD FOR FABRICATING A SEMICONDUCTOR SUBSTRATE WITH A CO-PLANAR BACKSIDE METALLIZATION STRUCTURE
    97.
    发明申请
    METHOD FOR FABRICATING A SEMICONDUCTOR SUBSTRATE WITH A CO-PLANAR BACKSIDE METALLIZATION STRUCTURE 审中-公开
    用于制备具有CO平面背面金属化结构的半导体衬底的方法

    公开(公告)号：US20120129342A1

    公开(公告)日：2012-05-24

    申请号：US13365278

    申请日：2012-02-03

    申请人： Kenta Nakayashiki ,  David K. Fork ,  Scott E. Solberg

    发明人： Kenta Nakayashiki ,  David K. Fork ,  Scott E. Solberg

    IPC分类号： H01L21/28

    CPC分类号： H01L31/022425 ,  H01L31/068 ,  H01L31/0682 ,  H01L31/18 ,  Y02E10/547

    摘要： A method for fabricating a backside metallization structure on a semiconductor substrate including moving a printhead having at least one nozzle orifice relative to the semiconductor substrate, and feeding an Al passivation layer ink and an AgAl soldering pad ink through said printhead such that both said Al passivation layer ink and said AgAl soldering pad ink are simultaneously extruded from said at least one nozzle orifice and deposited onto the semiconductor substrate.

    摘要翻译： 一种用于在半导体衬底上制造背面金属化结构的方法，包括移动具有相对于半导体衬底的至少一个喷嘴孔的打印头，以及通过所述打印头供给Al钝化层油墨和AgAl焊盘油墨，使得所述Al钝化 同时从所述至少一个喷嘴孔挤出所述AgAl焊盘油墨并将其沉积到半导体衬底上。

    Solar Cell With Structured Gridline Endpoints And Vertices
    98.
    发明申请
    Solar Cell With Structured Gridline Endpoints And Vertices 失效
    具有结构化网格线端点和顶点的太阳能电池

    公开(公告)号：US20120052191A1

    公开(公告)日：2012-03-01

    申请号：US12873473

    申请日：2010-09-01

    申请人： David K. Fork ,  Scott E. Solberg

    发明人： David K. Fork ,  Scott E. Solberg

    IPC分类号： B05D5/12 ,  B05C9/00

    CPC分类号： H01L31/022425 ,  B05C5/0212 ,  B05C5/0254 ,  B05C5/027 ,  B05C5/0291 ,  H01L31/18 ,  Y02E10/50

    摘要： A micro-extrusion printhead assembly utilized in a micro-extrusion system to form parallel extruded lines of material on a substrate includes a material feed mechanism for pushing/drawing materials out of dispensing orifices defined in the printhead assembly, a Z-axis positioning mechanism, and a base. A production method utilizes the micro-extrusion system to directly print endpoint structures at the end of each gridline, and by extruding these gridlines immediately after forming the busbars. In accordance with an embodiment of the invention, the micro-extrusion system is controlled to manipulate the printhead speed and/or gridline material extrusion pressure at the beginning, middle and end of each gridline printing process such that teardrop-shaped endpoint structures are formed at the ends of each gridline, whereby each endpoint structure has a substantially greater width than that of the main “central” gridline structure extending between the endpoint structures.

    摘要翻译： 用于微挤出系统中的微挤出打印头组件在基板上形成平行的挤出生产线材料包括用于将材料推出/拉出定出在打印头组件中的分配孔的材料进给机构，Z轴定位机构， 和一个基地。 一种生产方法利用微挤压系统在每个网格线的末端直接打印端点结构，并在形成母线之后立即挤压这些网格线。 根据本发明的实施例，控制微挤压系统以在每个网格线印刷过程的开始，中间和结束处操纵打印头速度和/或网格线材料挤出压力，使得泪珠形端点结构形成在 每个网格线的端部，由此每个端点结构具有比在端点结构之间延伸的主“中心”网格线结构的宽度大得多的宽度。

    Solar Cell Fabrication Using Extruded Dopant-Bearing Materials
    100.
    发明申请
    Solar Cell Fabrication Using Extruded Dopant-Bearing Materials 有权
    使用挤压掺杂材料的太阳能电池制造

    公开(公告)号：US20110111076A1

    公开(公告)日：2011-05-12

    申请号：US13010759

    申请日：2011-01-20

    申请人： David K. Fork ,  Eric J. Shrader

    发明人： David K. Fork ,  Eric J. Shrader

    IPC分类号： B29C47/02

    CPC分类号： H01L31/18 ,  H01L21/2254 ,  H01L21/228 ,  H01L31/022425 ,  H01L31/0682 ,  H01L31/188 ,  Y02E10/547

    摘要： Wafer-based solar cells are efficiently produced by extruding a dopant bearing material (dopant ink) onto one or more predetermined surface areas of a semiconductor wafer, and then thermally treating the wafer to cause diffusion of dopant from the dopant ink into the wafer to form corresponding doped regions. A multi-plenum extrusion head is used to simultaneously extrude interdigitated dopant ink structures having two different dopant types (e.g., n-type dopant ink and p-type dopant ink) in a self-registered arrangement on the wafer surface. The extrusion head is fabricated by laminating multiple sheets of micro-machined silicon that define one or more ink flow passages. A non-doping or lightly doped ink is co-extruded with heavy doped ink to serve as a spacer or barrier, and optionally forms a cap that entirely covers the heavy doped ink. A hybrid thermal treatment utilizes a gaseous dopant to simultaneously dope exposed portions of the wafer.

    摘要翻译： 通过将掺杂剂轴承材料（掺杂剂油墨）挤出到半导体晶片的一个或多个预定表面区域上，然后对晶片进行热处理以使掺杂剂从掺杂剂油墨扩散到晶片中而形成，从而有效地生产晶片型太阳能电池 相应的掺杂区域。 多冲压挤出头用于在晶片表面上自我登记的布置中同时挤出具有两种不同掺杂剂类型（例如，n型掺杂剂油墨和p型掺杂剂油墨）的交错掺杂油墨结构。 挤压头通过层压多个限定一个或多个墨水流动通道的微加工硅片而制成。 非掺杂或轻掺杂的油墨与重掺杂油墨共挤出以用作间隔物或阻挡层，并且任选地形成完全覆盖重掺杂油墨的盖。 混合热处理利用气态掺杂剂来同时掺杂晶片的暴露部分。