摘要:
An ESD protection circuit design incorporating a single, or a plurality of, parallel inductor and capacitor, also known as LC tank(s), to avoid power loss by parasitic capacitance in ESD circuits. The first design described incorporates a LC tank structure. The second includes two LC tank structures. These structures can be expanded to form ESD protection circuit structures stacked with n-stages LC tanks. The last design described is ESD protection circuits formed by stacking the first design. These designs can avoid power gain loss from parasitic capacitance of ESD, because the parameters of LC tank can be designed to resonant at a desired operating frequency. Each of these designs can be altered slightly to create variant designs with equal identical ESD protection capabilities.
摘要:
Diode strings and electrostatic discharge circuits characterized by low current leakage. Each diode region provides a diode and has first and second regions. The first region is of a first conductive type and formed on a substrate, acting as a first electrode of a diode. The second region is of a second conductive type opposite to the first conductive type, formed in the first region and acting as a second electrode of a corresponding diode. The diodes are forward connected in series to form major anode and cathode of the diode string. An isolation region is of the second conductive type to isolate those diode regions. A bias resistor is connected between the isolation region and a first power line. During normal operation, the voltage of the first power line is not within the range between the voltages of the major anode and cathode.
摘要:
A method of manufacturing a semiconductor device having a first and second transistor of an ESD protection and internal circuit respectively. The method includes the steps of providing a substrate, forming gates of the first and second transistor on the substrate, depositing a mask layer and patterning the mask layer using one single mask to remove the mask layer on the gates, a portion of a drain region of the first transistor, and a source and drain region of the second transistor, implementing ESD implantation under the regions without the patterned mask layer, removing the mask layer and forming sidewall spacers of the gates, and implementing drain diffusion.
摘要:
The present invention relates to an SCR (Silicon Controlled Rectifier) for the ESD (electrostatic discharge) protection comprising two terminal electrodes of a first electrode and a second electrode, a PMOS, an NMOS and an SCR structure. By utilizing an embedded SCR, a whole-chip ESD protection circuit design can be obtained. The present invention is suitable for IC products, and for applications by IC design industries and IC foundry industries.
摘要:
An integrated circuit device for converting an incident optical signal into an electrical signal comprises a semiconductor substrate, a well region formed inside the semiconductor substrate, a dielectric layer formed over the well region, and a layer of polysilicon for receiving the incident optical signal, formed over the dielectric layer, including a p-type portion, an n-type portion and an undoped portion disposed between the p-type and n-type portions, wherein the well region is biased to control the layer of polysilicon for providing the electrical signal.
摘要:
The present invention relates to a Schmitt trigger circuit. The proposed Schmitt trigger circuit can receive the high-voltage input signal but it is consisted by only using the low-voltage devices with thin gate oxide. For example, it is implemented in a 0.13 μm 1V/2.5V Complementary Metal-Oxide Semiconductor (CMOS) process. However, it can be operated in the 3.3 V interface environment without causing the high-voltage-induced gate-oxide reliability problem. It is suitable for the I/O interface circuit to receive the high-voltage input signal and to reject the noise.
摘要:
A high voltage device. A high voltage MOS transistor is applied in the ESD protection device to the structure of which a doped region is added, generating a parasitic semiconductor controlled rectifier (SCR) having a shorter discharge path such that the SCR has faster response enhancing ESD protection.
摘要:
The present invention relates to a device for protecting high frequency RF integrated circuits from ESD damage. The device comprises at least one varactor-LC circuit tank stacked to avoid the power gain loss by the parasitic capacitance of ESD circuit. The varactor-LC tank could be designed to resonate at the RF operating frequency to avoid the power gain loss from the parasitic capacitance of ESD circuit. Multiple LC-tanks could be stacked for further reduction in the power gain loss. A reverse-biased diode is used as the varactor for both purposes of impedance matching and effective ESD current discharging. Because the inductor is made of metal, both the inductor and the varactor can discharge ESD current when ESD condition happens. It has a high enough ESD level to prevent ESD discharge.
摘要:
Transistors with very thin gate oxides are protected against oxide failure by cascading two or more transistors in series between an output pad and ground. The intermediate source/drain node between the two cascaded transistors is usually floating during an ESD test, delaying snapback turn-on of a parasitic lateral NPN transistor. This intermediate node is used to drive the gate of an upper trigger transistor. A lower trigger transistor has a gate node that is charged by the ESD pulse on the pad through a coupling capacitor. When the coupled ESD pulse turns on the trigger transistors, the trigger transistors turn on a silicon-controlled rectifier (SCR) that is integrated with the trigger transistors.
摘要:
A semiconductor device suitable for applications in an electrostatic discharge (ESD) protection circuit, including a semiconductor substrate, a first well formed in the substrate, a second well formed in the substrate, and a first doped region formed in the second well, wherein the first well, the second well, and the first doped region collectively form a parasitic bipolar junction transistor (BJT), and wherein the first well is the collector of the BJT, the second well is the base of the BJT, and the first doped region is the emitter of the BJT.