摘要:
A semiconductor device includes a lateral end surface and a connection electrode for external electrical connection. The connection electrode is exposed at the side surface. A manufacturing method of the semiconductor device includes steps of forming a linear recess in a silicon substrate between adjacent semiconductor devices, forming, on an inner surface of the recess, the electrode for external electrical connection of one of the semiconductor devices, and a step of separating the one semiconductor device from another on the silicon substrate by cutting the silicon substrate along the linear recess. Forming the electrode includes steps of forming a metal thin film astride a cutting line at which the silicon substrate is to be cut, forming a resist layer and patterning the resist layer on the metal thin film, growing metal at a portion not having the patterned resist layer, and removing the patterned resist layer and the metal thin film below the patterned resist layer. The connection electrode is provided by the metal grown in the growing step.
摘要:
An ink jet recording head includes a substrate provided with an energy generating element to generate energy used for discharging ink, a discharge port through which the ink is discharged, a supply port for supplying the ink, and an ink path formed on the substrate for making the discharge port and the supply port communicate with each other, wherein wall members forming the ink path are made of an inorganic material, and a space between adjacent ink paths is filled up by a metal layer.
摘要:
An ink jet head circuit board is provided which has heaters to generate thermal energy for ejecting ink as they are energized. This circuit board is so constructed as to reduce wire resistances for the heaters while at the same time preventing an increase in the size of the board and realizing a high-density integration of the heaters required for high resolution printing. This construction is made possible by forming electrode wires of first and second electrode wire layers to reduce an area that the wire patterns for the heater occupy on the circuit board. In reducing the effective thickness of protective insulation layer formed on the heater to prevent a possible degradation of thermal efficiency, one of the protective insulation layers over the electrode wires is removed from the heater, depending on the thickness of the electrode wires.
摘要:
A process for producing a cold cathode field emission device. A cathode electrode is formed on a front surface of a support member that transmits exposure light. An insulating layer is formed on an entire surface. A gate electrode is formed on the insulating layer. The support member is irradiated with exposure light from a back surface side of the support member through the hole as a mask for exposure. An electron-emitting-portion-forming-layer composed of a photosensitive material is formed at least inside the opening portion. The support member is irradiated with exposure light from a back surface side of the support member through the hole as a mask for exposure.
摘要:
A process for producing a cold cathode field emission device. A cathode electrode is formed on a front surface of a support member that transmits exposure light. An insulating layer is formed on an entire surface. A gate electrode is formed on the insulating layer. The support member is irradiated with exposure light from a back surface side of the support member through the hole as a mask for exposure. An electron-emitting-portion-forming-layer composed of a photosensitive material is formed at least inside the opening portion. The support member is irradiated with exposure light form a back surface side of the support member through the hole at a mask for exposure.
摘要:
To form a sharp edge portions of an electron emission part of a field emission type cathode to face an electron application surface. At least an electron emission part 40 of a field emission type cathode K is constituted by stacking thin plate-like conductive fine grains 30 and the field emission type cathode K is formed so that the plane direction of the thin plate-like fine grains of the electron emission part 40 crosses an electron application surface.
摘要:
An optical recording medium made up of a substrate and an electromagnetic radiation sensitive layer consisting essentially of a sulfur compound as a matrix and a substance (such as, for example, Te, Pb, Au, Sn, As, Bi, In, C) which is subjected to heat action from absorption of electromagnetic radiation and brings about optical changes by such heat action.
摘要:
An optical recording medium, having a substrate and a thin film containing a fluoride compound and a substance capable of undergoing an optical change through absorption of electromagnetic radiation (a film sensitive to electromagnetic radiation).