摘要:
A semiconductor field effect transistor is provided which permits controlling of the phase of carriers between a source region and a drain region formed in a first semiconductor layer. Such control can be used to modulate characteristics such as the electric conductivity and drain current of the transistor. To accomplish this control, a gate electrode is formed over a portion of said first semiconductor layer between the source and drain regions. The gate electrode splits to form first and second branches at a first location adjacent to the source region. These first and second branches subsequently rejoin one another at a second location adjacent to said drain region. When a potential is applied to the gate electrode, it will produce first and second two-dimensional carriers conduction paths at a surface of the portion of the first semiconductor layer under the first and second branches. An arrangement is provided for modifying the phase of carriers passing through the first conduction path relative to the phase of carriers passing through the second conduction path to produce a phase difference for carriers received at the drain region through said first and second conduction paths.
摘要:
A manufacturing process for a semiconductor integrated circuit device prevents occurrence of reaction between metal wiring and a boron-doped silicon plug over it in heat treatment for a MOS transistor to be formed over them and reduces the possibility of rise in contact resistance. Metal boride is formed on an exposed metal surface in the bottom of an opening made in an interlayer insulating film over the metal wiring. In order to facilitate formation of such metal boride, metal oxide remaining on the metal surface is removed with an aqueous ammonia solution. The metal surface is irradiated with high energy ultraviolet light in order to remove organic matter remaining in the opening and facilitate removal of the metal oxide with the aqueous ammonia solution.
摘要:
A semiconductor memory cell and forming method thereof utilizes a vertical select transistor to eliminate the problem of a large cell surface area in memory cells of the related art utilizing phase changes. A memory cell with a smaller surface area than the DRAM device of the related art is achieved by the present invention. Besides low power consumption during read operation, the invention also provides phase change memory having low power consumption even during write operation. Phase change memory also has stable read-out operation.
摘要:
Disclosed are a fast, highly-integrated and highly-reliable magnetoresistive random access memory (MRAM) and a semiconductor device which uses the MRAM. The semiconductor device performs the read-out operation of the MRAM using memory cells for storing information by using a change in magnetoresistance of a magnetic tunnel junction (MTJ) element with a high S/N ratio. Each memory cell includes an MTJ element and a bipolar transistor. The read-out operation is carried out by selecting a word line, amplifying a current flowing in the MTJ element of a target memory cell by the bipolar transistor and outputting the amplified current to an associated read data line.
摘要:
A magnetic nonvolatile memory cell includes a C-MOSFET, a spin torque magnetization inversion layer and a tunneling magnetoresistive layer arranged in this order. The memory cell has the function of spin torque magnetization inversion and consumes very low power. A random access memory includes a plurality of the memory cells.
摘要:
A manufacturing process for a semiconductor integrated circuit device which prevents occurrence of reaction between metal wiring and a boron-doped silicon plug over it in heat treatment for a MOS transistor to be formed over them and reduces the possibility of rise in contact resistance. Metal boride is formed on an exposed metal surface in the bottom of an opening made in an interlayer insulating film over the metal wiring. In order to facilitate formation of such metal boride, metal oxide remaining on the metal surface is removed with an aqueous ammonia solution. The meal surface is irradiated with high energy ultraviolet light in order to remove organic matter remaining in the opening and facilitate removal of the metal oxide with the aqueous ammonia solution.