摘要:
This management computer for managing a plurality of storage apparatuses having a volume storing data sent from a host computer has a schedule information acquisition unit for acquiring schedule information as a schedule of a time frame in which the host computer accesses the volume of the plurality of storage apparatuses, and a power supply control command unit for sending to a corresponding storage apparatus a power supply control command for turning off a main power supply of the storage apparatus of a time frame in which the volume is not accessed based on a referral result of the schedule information acquired with the schedule acquisition unit.
摘要:
A system is described in which a plurality of host computers are coupled to a storage system for storing and retrieving data in the storage system. The storage system includes individually addressable units of storage such as volumes or logical unit numbers. A security management system controls access to each of the individually addressable units of storage based upon the identification of the host permitted to access that unit of storage.
摘要:
There is provided a logical volume management method for storage system. When a logical volume is created on a flash memory drive, a management computer allocates logical volume while flash memory chip border of flash memory drive is taken into account. Specifically, a table for managing a correlation between each parity group and the flash memory chip of the flash memory drive is obtained and the logical volume is allocated in such a manner that a flash memory chip is not shared by a plurality of logical volumes. When complete erasing of logical volume data is performed, the management computer specifies a flash memory chip on which complete data erasing is to be performed, and the storage system completely erases data exclusively on the chip of interest with a use of a function of completely erasing data at a time by chip unit of the flash memory chip (chip erasing).
摘要:
A semiconductor apparatus comprising a silicon substrate; an device housing space including a concave portion formed in the silicon substrate and a hole perforating through the bottom surface of the concave portion; a plurality of laminated semiconductor devices provided in the device housing space; a first lid which lids the concave portion and a second lid which lids the hole, for sealing the semiconductor devices; and via plugs which are connected to the semiconductor devices, penetrating the bottom surface of the concave portion.
摘要:
A method for manufacturing a package which includes: an etching step of etching a silicon substrate, and forming a via hole penetrating through the silicon substrate; and a step of embedding an electrically conductive material in the via hole, and forming a via plug, characterized in that the etching step includes a first etching step of forming the via hole in a straight shape, and a second etching step of forming the via hole in a taper shape.
摘要:
Conventionally, no consideration was given to the control of the main power supply circuit in a storage apparatus. Thus, unnecessary electric power will be consumed because it is not possible to inhibit the power consumption of the main power supply circuit of the storage apparatus. With this storage system having a plurality of storage apparatuses, a storage apparatus internally has a power supply control program for controlling the respective components and the main power supply circuit, and the power supply control command program provided to the management computer migrates a storage extent to be used for business to another storage apparatus based on the operation schedule of business to use the storage extent of the storage apparatus, and commands the power supply control of the main power supply circuit in the storage apparatuses and the respective components.
摘要:
A semiconductor device 10 has such a structure that a plurality of through electrodes 30 is formed on a substrate 20 and each of terminals of light emitting devices (LEDs) 40 is electrically connected to each of the through electrodes 30 via a bump 50 on a lower surface side. In the semiconductor device 10, moreover, a partition wall 80 for surrounding a mounting region of each of the light emitting devices 40 is formed on the substrate 20. The partition wall 80 is formed by laminating a metal film (Cu) using a thin film forming method such as a plating method. Furthermore, the partition wall 80 is formed to be opposed close to each of side surfaces of the light emitting devices 40 and is provided to surround each of the light emitting devices 40.
摘要:
A disclosed method for manufacturing a semiconductor device having a structure where a semiconductor element is mounted on a first substrate includes the steps of: bonding the first substrate on which the semiconductor element is mounted and a second substrate made of a material different from a material of the first substrate so as to encapsulate the semiconductor element; forming a first groove in the first substrate and a second groove in the second substrate; and cleaving a portion between the first groove and the second groove so as to individualize the semiconductor device.
摘要:
An interposer includes a substrate made of an inorganic material; a through wiring including conductors embedded in through holes; and an upper wiring and (or)a lower wiring. The through wiring, the upper wiring and the lower wiring are respectively formed on preliminary wiring patterns that are additionally simultaneously or sequentially formed on layers made of an insulating material applied to at least wiring forming parts of the substrate, and are formed with a metal mold itself used for forming the preliminary wiring patterns or layers made of a wiring material applied by a printing operation, a plating operation or a deposition on the preliminary wiring patterns formed on the layers of the insulating material by transferring a fine structure pattern of the metal mold.
摘要:
A management apparatus, a management method, and a storage management system that more specifically manage power consumption, making it easy to analyze problems relating to power consumption or properly relocate data are provided. A power consumption for each of a plurality of memory apparatus groups each consisting of a plurality of memory apparatuses in a storage system is computed based on a performance for each of a plurality of logical storage extents defined in a plurality of storage extents provided by each of the memory apparatus groups, and a value of the power consumption for each of one or more of the memory apparatus groups obtained by the computation is output together with information on an access status of each of the corresponding logical storage extents.