公开(公告)号：US11821912B2

公开(公告)日：2023-11-21

申请号：US17313789

申请日：2021-05-06

Applicant: FormFactor, Inc.

Inventor： Anthony James Lord ,  Gavin Neil Fisher ,  David Randle Hess

IPC: G01R31/311 ,  G01R31/319

CPC classification number: G01R31/311 ,  G01R31/31917

Abstract: Methods of producing augmented probe system images and associated probe systems. A method of producing an augmented probe system image includes recording a base probe system image, generating the augmented probe system image at least partially based on the base probe system image, and presenting the augmented probe system image. The augmented probe system image includes a representation of at least a portion of the probe system that is obscured in the base probe system image. In some examples, a probe system includes a chuck, a probe assembly, an imaging device, and a controller programmed to perform methods disclosed herein.

公开(公告)号：US20230117566A1

公开(公告)日：2023-04-20

申请号：US17954093

申请日：2022-09-27

Applicant: FormFactor, Inc.

Inventor： Quan Yuan ,  Joseph George Frankel

IPC: G01R1/067

Abstract: Probes that define retroreflectors, probe systems that include the probes, and methods of utilizing the probes. The probes include the retroreflector, which is defined by a retroreflector body. The retroreflector body includes a first side, an opposed second side, a tapered region that extends from the first side, and a light-receiving region that is defined on the second side. The probes also include a probe tip, which is configured to provide a test signal to a device under test (DUT) and/or to receive a resultant signal from the DUT. The retroreflector is configured to receive light, via the light-receiving region, at a light angle of incidence. The retroreflector also is configured to emit at least an emitted fraction of the light, from the retroreflector body and via the light-receiving region, at a light angle of emission that is at least substantially equal to the light angle of incidence.

公开(公告)号：US11454799B2

公开(公告)日：2022-09-27

申请号：US16752324

申请日：2020-01-24

Applicant: FormFactor, Inc.

Inventor： Gerald Lee Gisler ,  Sia Choon Beng ,  Anthony James Lord ,  Gavin Neil Fisher

IPC: G02B21/36 ,  G02B21/02 ,  G02B21/26

Abstract: Microscopes with objective assembly crash detection and methods of utilizing the same are disclosed herein. For example, a microscope comprises a microscope body, an objective assembly comprising an objective lens, an objective assembly mount configured to separably attach the objective assembly to the microscope body, and an orientation detection circuit configured to indicate when a relative orientation between the microscope body and the objective assembly differs from a predetermined relative orientation.

公开(公告)号：US20220276281A1

公开(公告)日：2022-09-01

申请号：US17682825

申请日：2022-02-28

Applicant: FormFactor, Inc.

Inventor： Kalyanjit Ghosh ,  Doug Ondricek ,  Paul Hsiao

IPC: G01R1/073 ,  G01R31/28

Abstract: A modular probe array for making temporary electrical contact to devices under test is provided. The probe array includes multiple probe heads each having a substrate disposed within a mounting block. Improved thermal cycling performance is obtained by using an O-ring between the substrate and the mounting block. Optionally, set screws can be used in combination with the O-ring to set the position of the substrate in its mounting block.

公开(公告)号：US20220236303A1

公开(公告)日：2022-07-28

申请号：US17506081

申请日：2021-10-20

Applicant: FormFactor, Inc.

Inventor： Martin Schindler ,  Stefan Kreissig ,  Torsten Kiel

IPC: G01R1/067 ,  G01R1/073 ,  G01R31/00

Abstract: Probe systems configured to test a device under test and methods of operating the probe systems are disclosed herein. The probe systems include an electromagnetically shielded enclosure, which defines an enclosed volume, and a temperature-controlled chuck, which defines a support surface configured to support a substrate that includes the DUT. The probe systems also include a probe assembly and an optical microscope. The probe systems further include an electromagnet and an electronically controlled positioning assembly. The electronically controlled positioning assembly includes a two-dimensional positioning stage, which is configured to selectively position a positioned assembly along a first two-dimensional positioning axis and also along a second two-dimensional positioning axis. The electronically controlled positioning assembly also includes a first one-dimensional positioning stage that operatively attaches the optical microscope to the positioned assembly and a second one-dimensional positioning stage that operatively attaches the electromagnet to the positioning assembly.

公开(公告)号：US11293947B2

公开(公告)日：2022-04-05

申请号：US16858976

申请日：2020-04-27

Applicant: FormFactor, Inc.

Inventor： Mukesh Selvaraj ,  January Kister

IPC: G01R1/073 ,  G01R1/067

Abstract: A probe-on-carrier architecture is provided, where several vertical probes are disposed on each probe carrier and the probe carriers are affixed to the space transformer. Each vertical probe has two flexible members. The first flexible member makes electrical contact to the space transformer. The second flexible member makes temporary electrical contact to the device under test. A mechanical stiffener can be used to deal with the possible lack of flatness and thermal expansion of the space transformer. The mechanical stiffener can be affixed to the space transformer to bring the flatness and thermal expansion of the space transformer to within specifications. Alternatively, the mechanical stiffener can be affixed to the space transformer without trying to bring the flatness and thermal expansion of the space transformer to within specifications.

公开(公告)号：US11156637B2

公开(公告)日：2021-10-26

申请号：US16440468

申请日：2019-06-13

Applicant: FormFactor, Inc.

Inventor： January Kister ,  Roy Swart ,  Edin Sijercic

IPC: G01R1/067

Abstract: Probes for testing electrical circuits having decoupled electrical and mechanical design are provided. For example, a mechanically resilient core can be surrounded by an electrically conductive shell. In this way, electrical parameters of the probes are determined by the shells and mechanical parameters of the probes are determined by the cores. An important application of this approach is to provide impedance matched transmission line probes.

公开(公告)号：US11131709B2

公开(公告)日：2021-09-28

申请号：US17021288

申请日：2020-09-15

Applicant: FormFactor, Inc.

Inventor： Joseph George Frankel ,  Kazuki Negishi ,  Michael E. Simmons ,  Eric Robert Christenson ,  Daniel Rishavy

IPC: G01R31/28 ,  G01R1/067

Abstract: Probe systems for optically probing a device under test (DUT) and methods of operating the probe systems. The probe systems include a probing assembly that includes an optical probe that defines a probe tip and a distance sensor. The probe systems also include a support surface configured to support a substrate, which defines a substrate surface and includes an optical device positioned below the substrate surface. The probe systems further include a positioning assembly configured to selectively regulate a relative orientation between the probing assembly and the DUT. The probe systems also include a controller programmed to control the operation of the probe systems. The methods include methods of operating the probe systems.

公开(公告)号：US11054443B2

公开(公告)日：2021-07-06

申请号：US16362239

申请日：2019-03-22

Applicant: FormFactor, Inc.

Inventor： January Kister ,  Chun-Chih Wang

IPC: G01R1/067 ,  G01R3/00

Abstract: A skate on a tip of a probe for testing electrical devices is a reduced thickness probe tip contact. Such a skate can advantageously increase contact pressure, but it can also undesirably reduce probe lifetime due to rapid mechanical wear of the skate. Here multilayer skate probes are provided where the overall shape of the probe tip is a smooth curved surface, as opposed to the conventional fin-like skate configuration. The skate layer is the most mechanically wear-resistant layer in the structure, so abrasive processing of the probe tip leads to a probe skate defined by the skate layer. The resulting probes provide the advantage of increased contact pressure without the disadvantage of reduced lifetime.

公开(公告)号：US10578649B2

公开(公告)日：2020-03-03

申请号：US16116317

申请日：2018-08-29

Applicant: FormFactor, Inc.

Inventor： Benjamin N. Eldridge ,  Masanori Watanabe ,  Scott Kuhnert ,  Jeffrey Coussens

IPC: G01R1/073

Abstract: Vertical probe heads having a space transformer laterally tiled into several sections are provided. This change relative to conventional approaches improves manufacturing yield. These probe heads can include metal ground planes, and in embodiments where the ground planes are provided as separate metal plates parallel to the guide plates, the metal plates can also be laterally tiled into several sections. Such tiling of metal plates improves manufacturing yield and alleviates thermal mismatch issues. Probes are not mechanically connected to the space transformer, which facilitates replacement of individual probes of an array.