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公开(公告)号:US20230170201A1
公开(公告)日:2023-06-01
申请号:US17921189
申请日:2021-04-15
申请人: HAMAMATSU PHOTONICS K.K. , TAIYO NIPPON SANSO CORPORATION , NATIONAL UNIVERSITY CORPORATION FUKUSHIMA UNIVERSITY
发明人: Masahiro KOTANI , Takayuki OHMURA , Akari WAKIMURA , Tsutomu TERAUCHI , Shu TAIRA , Yasuhide NAITO
CPC分类号: H01J49/0409 , H01J49/0031 , H01J49/164
摘要: A sample support is a sample support used for ionizing components of a sample, and includes: a substrate including a first surface, a second surface on a side opposite to the first surface, and a plurality of through holes opening to the first surface and the second surface; a conductive layer provided at least on the first surface; and a derivatizing agent provided to the plurality of through holes to derivatize the components.
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公开(公告)号:US20230168491A1
公开(公告)日:2023-06-01
申请号:US18103835
申请日:2023-01-31
发明人: Daiki SUZUKI , Tomoyuki Ide , Yuki Morinaga
CPC分类号: G02B26/105 , G02B5/08
摘要: In a mirror unit, a first wall portion is higher than a second wall portion. A window member is disposed on a top surface of the first wall portion and a top surface of the second wall portion and is inclined with respect to a mirror surface. When any one of first to fourth wall portions is set as a first reference wall portion, in a cross-section perpendicular to the first reference wall portion, a first line passing through a first end at a side of the first reference wall portion in the mirror surface and a first corner portion formed at the side of the first reference wall portion by an outer surface and a first side surface in the window member intersects the first wall portion. A wiring portion includes a portion extending inside a base and leads outside a frame member.
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公开(公告)号:US20230168350A1
公开(公告)日:2023-06-01
申请号:US18090746
申请日:2022-12-29
发明人: Yuki MORINAGA , Daiki SUZUKI
CPC分类号: G01S7/4817 , G02B26/085 , G02B26/101 , G01S17/931
摘要: An optical module includes a support, a movable part supported by the support so as to be swingable about an axis, a mirror provided to the movable part, a drive coil provided to the movable part, a temperature monitoring element provided to the support, and a magnet that generates a magnetic field acting on the drive coil. The support is thermally connected to the magnet.
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公开(公告)号:US20230160104A1
公开(公告)日:2023-05-25
申请号:US17988379
申请日:2022-11-16
申请人: DENSO CORPORATION , TOYOTA JIDOSHA KABUSHIKI KAISHA , MIRISE Technologies Corporation , HAMAMATSU PHOTONICS K.K. , National University Corporation Tokai National Higher Education and Research System
发明人: Junji OHARA , Takashi ISHIDA , Yoshitaka NAGASATO , Daisuke KAWAGUCHI , Chiaki SASAOKA , Shoichi ONDA , Jun KOJIMA
IPC分类号: C30B33/04 , H01L21/268 , H01L21/78 , B23K26/382 , C30B29/40 , C30B25/20
CPC分类号: C30B33/04 , H01L21/268 , H01L21/7806 , B23K26/382 , C30B29/406 , C30B25/20
摘要: A method for manufacturing a semiconductor device includes: preparing a processed wafer having a gallium nitride (GaN) wafer and an epitaxial layer on the GaN wafer; forming a device constituent part in a portion of the processes wafer adjacent to a front surface provided by the epitaxial layer; forming a modified layer inside of the processed wafer by applying a laser beam from a back surface side opposite to the front surface side: and dividing the processed wafer at the modified layer. The processed wafer prepared includes a reflective layer for reflecting the laser beam at a position separated from a planned formation position, where the modified layer is to be formed, by a predetermined distance toward the front surface side. The reflective layer contains a layer having a refractive index different from that of a GaN single crystal of an epitaxial layer.
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公开(公告)号:US20230154774A1
公开(公告)日:2023-05-18
申请号:US17916837
申请日:2021-03-31
发明人: Takeshi SAKAMOTO , Takafumi OGIWARA , Iku SANO
CPC分类号: H01L21/67253 , H01L22/12 , H01L22/24 , B23K26/53
摘要: An inspection device includes: a laser irradiation unit; an imaging unit; and a control unit. The control unit is configured to execute a processing process of controlling the laser irradiation unit according to a recipe set such that a plurality of modified regions are formed inside a wafer by irradiating the wafer with a laser beam and a full-cut state where cracks extending from the modified regions have reached a back surface and a surface is attained; an identification process of identifying a state of the crack on the back surface extending from the modified region, and a state of at least one of the modified regions and the cracks inside the wafer, based on a signal; and a determination process of determining whether or not a dicing force applied to the wafer according to the recipe is proper, based on information identified in the identification process.
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106.
公开(公告)号:US20230148363A1
公开(公告)日:2023-05-11
申请号:US17917977
申请日:2021-01-28
发明人: Dai HARAGUCHI , Yoshito HASEGAWA
IPC分类号: H01J35/06
CPC分类号: H01J35/064 , H01J2235/064
摘要: Disclosed is an electron beam generation source including: an electron discharge part extending on a desired axis and configured to discharge electrons; a movable part connected to one end of the electron discharge part; a support part configured to support the movable part to be movable along the axis; and a tension holding part configured to hold tension of the electron discharge part by applying a pressing force or a tensile force to the movable part. The movable part and the tension holding part are disposed on the axis.
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公开(公告)号:US20230143711A1
公开(公告)日:2023-05-11
申请号:US17914836
申请日:2021-03-25
发明人: Atsushi SUGIYAMA , Yuji KANEKO , Yasufumi TAKAGI
IPC分类号: H01S5/34 , H01S5/227 , H01S5/0234
CPC分类号: H01S5/3401 , H01S5/2275 , H01S5/0234
摘要: A method for manufacturing a quantum cascade laser element includes: a step of forming a semiconductor layer on a first major surface of a semiconductor wafer; a step of removing a part of the semiconductor layer by etching such that each of portions of the semiconductor layer includes a ridge portion; a step of forming an insulating layer such that at least a part of a surface of the ridge portion is exposed; a step of embedding the ridge portion in each of metal plating layers; a step of flattening a surface of the metal plating layers by polishing in a state where a protective member is disposed; a step of forming an electrode layer on a second major surface of the semiconductor wafer; and a step of cleaving the semiconductor wafer and the semiconductor layer in a state where the protective member is removed.
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公开(公告)号:US20230143460A1
公开(公告)日:2023-05-11
申请号:US17917060
申请日:2021-02-17
发明人: Takashi KURITA , Yuu TAKIGUCHI
IPC分类号: G02B5/32 , B23K26/06 , B23K26/03 , B23K26/067
CPC分类号: G02B5/32 , B23K26/0626 , B23K26/032 , B23K26/0673 , B23K26/0665
摘要: A laser processing apparatus includes a spatial light modulator for inputting laser light output from a laser light source and outputting laser light after phase modulation by a hologram, and a control unit for presenting, on the spatial light modulator, the hologram for focusing the laser light after the phase modulation output from the spatial light modulator on a plurality of irradiation points in a processing object by a focusing optical system. The control unit controls light intensities of at least two irradiation points included in the plurality of irradiation points independently of each other.
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公开(公告)号:US11640902B2
公开(公告)日:2023-05-02
申请号:US17241224
申请日:2021-04-27
发明人: Hiroshi Kobayashi , Junichi Kondo
摘要: An ion detector includes a first dynode, a second dynode, a scintillator, a conductive layer, and a photomultiplier tube. The first dynode is configured to emit a charged particle in response to the incidence of the ion. The second dynode is configured to be given a negative potential and emit a secondary electron in response to incidence of the charged particle from the first dynode. The scintillator includes an electron incident surface arranged to receive the secondary electron from the second dynode, and is configured to convert the secondary electron into light. The conductive layer is disposed on the electron incident surface. The photomultiplier tube is configured to detect the light from the scintillator.
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公开(公告)号:US20230124033A1
公开(公告)日:2023-04-20
申请号:US17914445
申请日:2021-01-21
IPC分类号: G01N21/64
摘要: An optical measurement device includes an irradiation optical system, a detection optical system, and a cancel circuit. In a fluorescence detection process, a sample is designated as an irradiation target, the sample is irradiated with irradiation light, measurement target light including fluorescence generated from the sample irradiated with the irradiation light and light scattered from the sample irradiated with the irradiation light is detected as detection light, a signal component corresponding to the scattered light is removed from a measurement signal corresponding to the measurement target light in consideration of a result of performing a calibration process during a preliminary process. In the preliminary process, the calibration process for removing a signal component corresponding to the scattered light from the measurement signal is performed on the basis of a calibration signal having a higher signal intensity than a signal corresponding to the scattered light in the measurement signal.
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