MIRROR UNIT
    102.
    发明公开
    MIRROR UNIT 审中-公开

    公开(公告)号:US20230168491A1

    公开(公告)日:2023-06-01

    申请号:US18103835

    申请日:2023-01-31

    IPC分类号: G02B26/10 G02B5/08

    CPC分类号: G02B26/105 G02B5/08

    摘要: In a mirror unit, a first wall portion is higher than a second wall portion. A window member is disposed on a top surface of the first wall portion and a top surface of the second wall portion and is inclined with respect to a mirror surface. When any one of first to fourth wall portions is set as a first reference wall portion, in a cross-section perpendicular to the first reference wall portion, a first line passing through a first end at a side of the first reference wall portion in the mirror surface and a first corner portion formed at the side of the first reference wall portion by an outer surface and a first side surface in the window member intersects the first wall portion. A wiring portion includes a portion extending inside a base and leads outside a frame member.

    INSPECTION DEVICE AND INSPECTION METHOD
    105.
    发明公开

    公开(公告)号:US20230154774A1

    公开(公告)日:2023-05-18

    申请号:US17916837

    申请日:2021-03-31

    IPC分类号: H01L21/67 H01L21/66 B23K26/53

    摘要: An inspection device includes: a laser irradiation unit; an imaging unit; and a control unit. The control unit is configured to execute a processing process of controlling the laser irradiation unit according to a recipe set such that a plurality of modified regions are formed inside a wafer by irradiating the wafer with a laser beam and a full-cut state where cracks extending from the modified regions have reached a back surface and a surface is attained; an identification process of identifying a state of the crack on the back surface extending from the modified region, and a state of at least one of the modified regions and the cracks inside the wafer, based on a signal; and a determination process of determining whether or not a dicing force applied to the wafer according to the recipe is proper, based on information identified in the identification process.

    METHOD FOR PRODUCING QUANTUM CASCADE LASER ELEMENT

    公开(公告)号:US20230143711A1

    公开(公告)日:2023-05-11

    申请号:US17914836

    申请日:2021-03-25

    IPC分类号: H01S5/34 H01S5/227 H01S5/0234

    摘要: A method for manufacturing a quantum cascade laser element includes: a step of forming a semiconductor layer on a first major surface of a semiconductor wafer; a step of removing a part of the semiconductor layer by etching such that each of portions of the semiconductor layer includes a ridge portion; a step of forming an insulating layer such that at least a part of a surface of the ridge portion is exposed; a step of embedding the ridge portion in each of metal plating layers; a step of flattening a surface of the metal plating layers by polishing in a state where a protective member is disposed; a step of forming an electrode layer on a second major surface of the semiconductor wafer; and a step of cleaving the semiconductor wafer and the semiconductor layer in a state where the protective member is removed.

    Ion detector and mass spectrometer each including multiple dynodes

    公开(公告)号:US11640902B2

    公开(公告)日:2023-05-02

    申请号:US17241224

    申请日:2021-04-27

    IPC分类号: H01J49/02 H01J43/10 H01J43/22

    摘要: An ion detector includes a first dynode, a second dynode, a scintillator, a conductive layer, and a photomultiplier tube. The first dynode is configured to emit a charged particle in response to the incidence of the ion. The second dynode is configured to be given a negative potential and emit a secondary electron in response to incidence of the charged particle from the first dynode. The scintillator includes an electron incident surface arranged to receive the secondary electron from the second dynode, and is configured to convert the secondary electron into light. The conductive layer is disposed on the electron incident surface. The photomultiplier tube is configured to detect the light from the scintillator.

    OPTICAL MEASUREMENT DEVICE AND OPTICAL MEASUREMENT METHOD

    公开(公告)号:US20230124033A1

    公开(公告)日:2023-04-20

    申请号:US17914445

    申请日:2021-01-21

    IPC分类号: G01N21/64

    摘要: An optical measurement device includes an irradiation optical system, a detection optical system, and a cancel circuit. In a fluorescence detection process, a sample is designated as an irradiation target, the sample is irradiated with irradiation light, measurement target light including fluorescence generated from the sample irradiated with the irradiation light and light scattered from the sample irradiated with the irradiation light is detected as detection light, a signal component corresponding to the scattered light is removed from a measurement signal corresponding to the measurement target light in consideration of a result of performing a calibration process during a preliminary process. In the preliminary process, the calibration process for removing a signal component corresponding to the scattered light from the measurement signal is performed on the basis of a calibration signal having a higher signal intensity than a signal corresponding to the scattered light in the measurement signal.