Abstract:
A multilayer electrode structure has a conductive layer including aluminum, an oxide layer formed on the conductive layer, and an oxygen diffusion barrier layer. The oxide layer includes zirconium oxide and/or titanium oxide. The oxygen diffusion barrier layer is formed at an interface between the conductive layer and the oxide layer by re-oxidizing the oxide layer. The oxygen diffusion barrier layer includes aluminum oxide.
Abstract:
In a method of manufacturing a dielectric structure, after a tunnel oxide layer pattern is formed on a substrate, a floating gate is formed on the tunnel oxide layer. After a first dielectric layer pattern including a metal silicon oxide and a second dielectric layer pattern including a metal silicon oxynitride are formed, a control gate is formed on the dielectric structure. Since the dielectric structure includes at least one metal silicon oxide layer and at least one metal silicon oxynitride layer, the dielectric structure may have a high dielectric constant and a good thermal resistance. A non-volatile semiconductor memory device including the dielectric structure may have good electrical characteristics such as a large capacitance and a low leakage current.
Abstract:
Provided are methods of manufacturing dielectric films including forming a first dielectric film on a wafer using atomic layer deposition (ALD) in a first batch type apparatus, forming a second dielectric film on the first dielectric film using atomic layer deposition in a second batch type apparatus, wherein the second dielectric film has a higher crystallization temperature than the first dielectric film and forming a third dielectric film on the second dielectric film using atomic layer deposition in a third batch type apparatus. Methods of manufacturing metal-insulator-metal (MIM) capacitors using the methods of forming the dielectric films and batch type atomic layer deposition apparatus for forming the dielectric films are also provided.
Abstract:
In a method of forming a layer using an atomic layer deposition process, after a substrate is loaded into a chamber, a reactant is provided onto the substrate to form a preliminary layer. Atoms in the preliminary layer are partially removed from the preliminary layer using plasma formed from an inert gas such as an argon gas, a xenon gas or a krypton gas, or an inactive gas such as an oxygen gas, a nitrogen gas or a nitrous oxide gas to form a desired layer. Processes for forming the desired layer may be simplified. A highly integrated semiconductor device having improved reliability may be economically manufactured so that time and costs required for the manufacturing of the semiconductor device may be reduced.
Abstract:
A method of supplying a power to elements in a power supply apparatus including a primary side and a second side. Particularly, a method of supplying a driving power to an element at the primary side of the power supply apparatus from a primary coil of a transformer. A power factor improvement section improves a power factor of a received alternating current (AC) power. A transformer then receives the AC power having the improved power factor from a primary coil and generates an induced power at a secondary coil. The transformer then provides the AC power to drive a predetermined element located at the primary side of the power supply apparatus from the primary coil.
Abstract:
A semiconductor device test apparatus includes a main body and a stacker for stacking devices before and after a test. The stacker includes at least one user tray feeder predesignated with a function for stacking un-tested devices and at least one user tray sender predesignated with a function for stacking tested devices, the user tray functions being interchangeable during stacker operation.
Abstract:
A generic wafer includes memory units separated by scribe lanes. Memory chips of different storage capacities can be produced from different numbers of memory units on the generic wafer by forming one or more interconnect layer specialized according to a desired storage capacity and cutting the wafer using a sawing pattern according to the desired storage capacity. The specialized layer can be formed using different masks sets that form a different conductive pattern for each storage capacity or forming a generic interconnect structure with fuses that are cut to select the storage capacity of the memory chips
Abstract:
An input receiver capable of sensing and amplifying an external signal having a very small swing input signal. The input receiver comprises a clock sampled amplifier for receiving a clock signal and a reference signal, respectively, in response to a first state of a clock signal and a delayed sampling clock signal, and for amplifying and sampling the voltage difference between the external signal and the reference signal, respectively, in response to a transition of the clock and delayed sampling clock signals to a second state; and a pulse generator for pre-charging a power source voltage and selectively pulling down the pre-charged signals to produce a pulse signal, in response to the second state of the delayed sampling clock signal and outputs of the clock sampled amplifier.
Abstract:
A phenylacetamide derivative of formula (I) have potent analgesic and anti-inflammatory activities and exhibit less irritability and toxicity: ##STR1## wherein, X, Y, W, n, m and Ar are as defined in the specification.