公开(公告)号：US07009716B2

公开(公告)日：2006-03-07

申请号：US10802095

申请日：2004-03-15

Applicant: Jong-Deog Kim ,  Byung-Seok Choi ,  Jong-Hyun Lee ,  Hogyeong Yun ,  Kwang-Seong Choi ,  Jong-Tae Moon

Inventor： Jong-Deog Kim ,  Byung-Seok Choi ,  Jong-Hyun Lee ,  Hogyeong Yun ,  Kwang-Seong Choi ,  Jong-Tae Moon

IPC: G01B9/02 ,  H01S3/04

CPC classification number: H01S5/0612 ,  H01S5/0683 ,  H01S5/0687

Abstract: A system for monitoring an optical output/wavelength is employed to be used for a WDM system having a narrow channel space by structuring an etalon and photodiode as an integrated structure. The system includes: a laser source control unit for controlling the laser source; an optical/wavelength monitoring unit for monitoring an optical output/wavelength of the controlled laser source; a TEC control unit for controlling a TEC in order to constantly maintain the laser source of the optical output/wavelength monitoring unit to have a predetermined temperature; a temperature control unit for controlling a heater and a thermistor to set an etalon to a predetermined temperature, wherein the heater is attached on the optical output/wavelength monitoring unit and the thermistor is attached on the heater; a comparison unit for comparing the optical output signal and the wavelength signal, each of which is monitored by the optical output/wavelength monitoring unit; and a processing unit for comparing values of the compared signals with a preset value to control an input current or a temperature of the laser source.

Abstract translation: 用于监测光输出/波长的系统被用于通过构造标准具和光电二极管作为一体结构而具有窄通道空间的WDM系统。 该系统包括：用于控制激光源的激光源控制单元; 用于监测受控激光源的光输出/波长的光/波长监测单元; 用于控制TEC的TEC控制单元，以便将光输出/波长监视单元的激光源恒定地保持为预定温度; 温度控制单元，用于控制加热器和热敏电阻以将标准具设定到预定温度，其中加热器安装在光输出/波长监测单元上，热敏电阻附着在加热器上; 比较单元，用于比较光输出信号和波长信号，每个波长信号由光输出/波长监测单元监视; 以及处理单元，用于将比较的信号的值与预设值进行比较，以控制激光源的输入电流或温度。

公开(公告)号：US20050255812A1

公开(公告)日：2005-11-17

申请号：US11130486

申请日：2005-05-17

Applicant: Kweon Na ,  Hyun-Su Yoon ,  Cheol-Woo Ahn ,  Jong-Hyun Lee

Inventor： Kweon Na ,  Hyun-Su Yoon ,  Cheol-Woo Ahn ,  Jong-Hyun Lee

IPC: H04B1/44 ,  H04B1/48

CPC classification number: H04B1/48

Abstract: A transmitting apparatus in a TDD wireless communication system is provided. In the transmitting apparatus, a circulator transmits a signal received from a power amplifier to an antenna feed line and transmits a signal received from the antenna feed line to a quarter-wave transmission line. The quarter-wave transmission line is installed in a reception path, for reception isolation in a transmission mode. An RF switch shorts the load of the quarter-wave transmission line to the ground or connects the load of the quarter-wave transmission line to an LNA according to a control signal. The LNA low-noise-amplifies a signal received from the RF switch.

Abstract translation: 提供了TDD无线通信系统中的发送装置。 在发送装置中，循环器将从功率放大器接收的信号发送到天线馈送线，并将从天线馈线接收的信号发送到四分之一波长的传输线。 四分之一波长传输线安装在接收路径中，用于传输模式下的接收隔离。 RF开关将四分之一波长传输线的负载缩短到地面，或者根据控制信号将四分之一波长传输线的负载连接到LNA。 LNA低噪声放大从RF开关接收的信号。

公开(公告)号：US06740976B2

公开(公告)日：2004-05-25

申请号：US10317693

申请日：2002-12-12

Applicant: Jong-Hyun Lee

Inventor： Jong-Hyun Lee

IPC: H01L2348

CPC classification number: H01L21/76844 ,  H01L21/76805 ,  H01L21/76807 ,  H01L21/76832 ,  H01L21/76834 ,  H01L21/76868 ,  H01L21/76877 ,  H01L23/5226 ,  H01L23/53238 ,  H01L2924/0002 ,  H01L2924/00

Abstract: In a semiconductor device with a via contact including a barrier metal layer and a method for fabricating the same, a lower metal interconnection is formed over a substrate. An ILD is formed on the lower metal interconnection and has a lower barrier layer and an upper barrier layer that have an etch selectivity with respect to each other. An upper metal interconnection is formed over the ILD and is separated from the lower metal interconnection by the ILD. A via contact plug penetrates the ILD to connect the lower and upper metal interconnections. The via contact plug is formed such that a portion crossing the lower barrier layer is formed to have a greater width as compared to a portion crossing the upper barrier layer. The barrier metal layer, which is formed to encompass sidewalls and a bottom of an inner metal layer of the via contact plug, forms a discontinuous part which does not exist at the portion crossing the lower barrier layer. Thus, the inner metal layer of the contact plug is in direct contact with the lower metal interconnection. The upper and lower barrier layers are layers that serve as a barrier to copper, such as a silicon nitride layer or silicon carbide layer. However, the upper and lower barrier layers are composed of different material layers so as to have etch selectivity with respect to each other.

Abstract translation: 在具有包括阻挡金属层的通孔接触的半导体器件及其制造方法中，在衬底上形成下部金属互连。 在下金属互连上形成有ILD，并且具有相对于彼此具有蚀刻选择性的下阻挡层和上阻挡层。 在ILD上形成上金属互连，并且通过ILD与下金属互连分离。 通孔接触插头穿透ILD以连接下部和上部金属互连。 通孔接触插塞形成为与穿过上阻挡层的部分相比，与下阻挡层交叉的部分形成为具有更大的宽度。 形成为包围通孔接触塞的内金属层的侧壁和底部的阻挡金属层在与下阻挡层交叉的部分形成不存在的不连续部分。 因此，接触插塞的内金属层与下金属互连直接接触。 上阻挡层和下阻挡层是用作铜的屏障的层，例如氮化硅层或碳化硅层。 然而，上阻挡层和下阻挡层由不同的材料层组成，以便相对于彼此具有蚀刻选择性。

公开(公告)号：US06606190B2

公开(公告)日：2003-08-12

申请号：US09997421

申请日：2001-11-28

Applicant: Jyung Chan Lee ,  Moo Jung Chu ,  Kwang Joon Kim ,  Jong Hyun Lee

Inventor： Jyung Chan Lee ,  Moo Jung Chu ,  Kwang Joon Kim ,  Jong Hyun Lee

IPC: H04B1012

CPC classification number: H01S3/06758

Abstract: Disclosed herein is an inhomogeneity tunable erbium-doped optical fiber amplifier with a long wavelength band and method of blocking a backward amplified spontaneous light emission in the same. The optical fiber amplifier includes a control device situated between a first amplification stage and a second amplification stage for controlling an isolation rate of a backward amplified spontaneous light emission being propagated from a second amplification stage to the first amplification stage. The method blocks a backward amplified spontaneous light emission in a two-stage inhomogeneity tunable erbium-doped optical fiber amplifier with a long wavelength gain band, in which the backward amplified spontaneous light emission being propagated from a second amplification stage to a first amplification stage is blocked, and an isolation rate of the backward amplified spontaneous light emission is controlled according to the intensity of an optical signal inputted to the first amplification stage.

公开(公告)号：US06564145B2

公开(公告)日：2003-05-13

申请号：US09752324

申请日：2000-12-27

Applicant: Hong-Soo Kim ,  Jong-Hyun Lee ,  Youn-Suk Jeong

Inventor： Hong-Soo Kim ,  Jong-Hyun Lee ,  Youn-Suk Jeong

IPC: G01C2123

CPC classification number: G01C21/3446 ,  G01C21/34

Abstract: A method is presented for finding a shortest path from a starting place to a destination place in a traffic network including one or more turn restrictions, one or more U-turns and one or more P-turns using a Dijkstra algorithm. The method as sets a virtual arc between nodes, and assigns a virtual arc value. A smallest travel time value is selected out of total travel time values for all nodes except for the starting node, by considering existing arcs between nodes and the virtual arc and assigning the smallest travel time value to a permanent label node. The shortest path is determined by tracing the permanent nodes starting from the destination node.

Abstract translation: 提出了一种用于从包括一个或多个匝限制，一个或多个匝数以及一个或多个P匝使用Dijkstra算法的交通网络中的起始地点到目的地地点找到最短路径的方法。 该方法在节点之间设置虚拟弧，并分配虚拟弧值。 通过考虑节点之间的现有弧和虚拟弧，并将最小的行进时间值分配给永久标签节点，除了起始节点之外的所有节点的总旅行时间值中，选择最小行进时间值。 通过跟踪从目的地节点开始的永久节点来确定最短路径。

公开(公告)号：US06292084B1

公开(公告)日：2001-09-18

申请号：US09136613

申请日：1998-08-20

Applicant: Chang Auck Choi ,  Jong Hyun Lee ,  Won Ick Jang ,  Yong Il Lee ,  Jong Tae Baek ,  Hyung Joun Yoo

Inventor： Chang Auck Choi ,  Jong Hyun Lee ,  Won Ick Jang ,  Yong Il Lee ,  Jong Tae Baek ,  Hyung Joun Yoo

IPC: H01F500

CPC classification number: H01F5/003 ,  H01F17/0033

Abstract: A fine inductor having a 3-dimensional coil structure is disclosed. The inductor includes an insulating layer having a groove, a plurality of first conductive patterns wherein the respective first conductive patterns cover bottom and both walls of the groove formed in the insulating layer, both ends of the respective first conductive patterns are extended over upper surface of both sides of the groove, and each of the first conductive patterns is disposed at a predetermined space between adjacent first conductive patterns, and a plurality of second conductive patterns wherein one ends of the respective second conductive patterns are connected to the one ends of the first conductive patterns extended over upper surface and the other ends of the respective second conductive patterns are connected to the other ends of the adjacent first conductive patterns extended over upper surface, thereby forming a coil structure together with the first conductive patterns.

Abstract translation: 公开了具有3维线圈结构的精细电感器。 电感器包括具有凹槽的绝缘层，多个第一导电图案，其中相应的第一导电图案覆盖形成在绝缘层中的凹槽的底部和两个壁，各个第一导电图案的两个端部延伸到 沟槽的两侧，并且每个第一导电图案设置在相邻的第一导电图案之间的预定空间处，以及多个第二导电图案，其中各个第二导电图案的一端连接到第一导电图案的一端 在上表面延伸的导电图案和相应的第二导电图案的另一端连接到在上表面上延伸的相邻的第一导电图案的另一端，从而与第一导电图案一起形成线圈结构。

公开(公告)号：US06172423B2

公开(公告)日：2001-01-09

申请号：US09182195

申请日：1998-10-30

Applicant: Jong Hyun Lee

Inventor： Jong Hyun Lee

IPC: H01L2348

CPC classification number: H01L23/13 ,  H01L23/49805 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A layer-type ball grid array (BGA) semiconductor package, module and methods of manufacturing same is provided that expands the capability of the package in a limited area. The BGA semiconductor package and method of manufacturing same includes a substrate having a cavity formed therein and an interconnection pattern layer that has a plurality of conductive interconnections forming electric channels between or electrically coupling upper and lower surfaces of the substrate is attached to an external surface of the substrate. The interconnection pattern layer extends from the upper surface to the lower surface of the substrate. A semiconductor chip is provided in bottom of the cavity and a plurality of conductive wires electrically couple the semiconductor chip to one of the conductive interconnections. A molding part fills in the cavity for sealing the semiconductor chip and wires. A plurality of solder balls are correspondingly attached to the conductive interconnections of the interconnection pattern layer formed on the lower surface of the substrate.

Abstract translation: 提供了层状球栅阵列（BGA）半导体封装，模块及其制造方法，其在有限的区域内扩展了封装的能力。 BGA半导体封装及其制造方法包括其中形成有腔的衬底和在衬底的上表面和下表面之间形成电通道或电耦合衬底的上表面和下表面的多个导电互连的互连图案层附接到 底物。 互连图案层从基板的上表面延伸到下表面。 半导体芯片设置在空腔的底部，并且多个导线将半导体芯片电耦合到导电互连之一。 模制部件填充用于密封半导体芯片和电线的空腔。 多个焊球对应地连接到形成在基板的下表面上的互连图案层的导电互连。

公开(公告)号：US5983294A

公开(公告)日：1999-11-09

申请号：US915257

申请日：1997-08-20

Applicant: Hong-Ju Kim ,  Dong-Choon Lee ,  Chang-Ki Lee ,  Ho-Geon Kim ,  Jong-Hyun Lee

Inventor： Hong-Ju Kim ,  Dong-Choon Lee ,  Chang-Ki Lee ,  Ho-Geon Kim ,  Jong-Hyun Lee

IPC: H04L12/43 ,  H04Q11/04 ,  G06F13/14 ,  G06F13/20

CPC classification number: H04Q11/0478 ,  H04J2203/0041 ,  H04J2203/0042

Abstract: Disclosed is a synchronous cross-connect system with an integrated 2.5 Gbps (STM-16) I/O link and a ring network interworking. The synchronous cross-connect system includes: first and second I/O portions for performing I/O function with respect to a plurality of STM-16 signals, including a backplane signal pattern which takes four units among the plurality of STM-16 signals performing a protection switching and transmission functions; a signal intercrossing portion for crossing/connecting signals of the first and second I/O portions; and synchronizing portion for generating clock signals necessary to the first and second I/O portions and the signal intercrossing portion. As a result, the synchronous cross-connect system performs a transmission function without an additional apparatus in the transmission link with interoffice transmission capacity of 2.5 Gbps (STM-16), and has a high survivability because of a real-time fault recovery function using the ring network interworking.

Abstract translation: 公开了具有集成的2.5Gbps（STM-16）I / O链路和环网互通的同步交叉连接系统。 同步交叉连接系统包括：用于对多个STM-16信号执行I / O功能的第一和第二I / O部分，包括在执行的多个STM-16信号中占据四个单位的背板信号模式 保护切换和传输功能; 信号交叉部分，用于交叉/连接第一和第二I / O部分的信号; 以及用于产生第一和第二I / O部分和信号交叉部分所需的时钟信号的同步部分。 结果，同步交叉连接系统在传输链路中执行传输功能，传输链路的间隔传输容量为2.5Gbps（STM-16），并且由于使用了实时故障恢复功能而具有很高的生存性 环网互通。

公开(公告)号：US09107240B2

公开(公告)日：2015-08-11

申请号：US13811115

申请日：2011-08-04

Applicant: Jong Hyun Lee

Inventor： Jong Hyun Lee

IPC: H04L5/14 ,  H04W88/06 ,  H03F1/02 ,  H03F3/189 ,  H03F3/24

CPC classification number: H04L5/14 ,  H03F1/0205 ,  H03F1/0261 ,  H03F1/30 ,  H03F3/189 ,  H03F3/19 ,  H03F3/24 ,  H03F2200/18 ,  H03F2200/294 ,  H03F2200/408 ,  H03F2200/451 ,  H03F2200/468 ,  H04W88/06

Abstract: An amplifier and an amplifying method are provided. The amplifier includes: an amplifying unit amplifying and transferring a transmission target signal to a TDD switch; the TDD switch transferring a signal received from the amplifying unit to a filter unit when the amplifier operates in a TDD mode, and transferring a signal received from the filter unit to a duplex mode selection switch; the duplex mode selection switch transferring a signal received from the filter unit to a receiving side; and a controller controlling the duplex mode selection switch to transfer the signal received from the filter unit to the receiving side without passing through the TDD switch when the received duplex mode selection signal is a FDD mode selection signal.

Abstract translation: 提供放大器和放大方法。 放大器包括：放大单元，放大并将发送目标信号传送到TDD开关; 当放大器以TDD模式工作时，TDD开关将从放大单元接收的信号传送到滤波器单元，并将从滤波器单元接收的信号传送到双工模式选择开关; 所述双工模式选择开关将从所述滤波器单元接收到的信号传送到接收侧; 以及当所接收的双工模式选择信号是FDD模式选择信号时，控制双工模式选择开关以将从滤波器单元接收的信号传送到接收侧而不经过TDD开关的控制器。

公开(公告)号：US09037756B2

公开(公告)日：2015-05-19

申请号：US13413167

申请日：2012-03-06

Applicant: Jong Hyun Lee

Inventor： Jong Hyun Lee

IPC: G06F21/44 ,  H02J7/00 ,  G06F1/26 ,  G06F11/34 ,  H02J3/00

CPC classification number: H02J7/0044 ,  G06F1/26 ,  G06F11/3485 ,  G06F13/382 ,  H02J3/008 ,  H02J7/0008 ,  H02J7/0027 ,  H02J7/0047 ,  H04M1/0274 ,  H04M1/72527

Abstract: A mobile terminal and an interface method thereof for connecting external devices, such as an adapter, a Universal Serial Bus (USB) cable, a docking station, an accessory, and the like, to the mobile terminal are provided. The mobile terminal includes a battery, a connector including a pin for data communication and first and second power pins for charging the battery, a memory for storing a reference voltage indicating a dedicated adapter of the battery, and a controller for receiving a voltage input from the first and second power pins, for recognizing an external device connected with the connector as the dedicated adapter when a voltage input from the pin for data communication is the reference voltage, and for charging the battery with power input to the first and second power pins.

Abstract translation: 提供了一种用于将诸如适配器，通用串行总线（USB）电缆，对接站，附件等的外部设备连接到移动终端的移动终端及其接口方法。 移动终端包括电池，包括用于数据通信的引脚和用于对电池充电的第一和第二电源引脚的连接器，用于存储指示电池的专用适配器的参考电压的存储器，以及用于接收来自电池的电压输入的控制器 所述第一和第二电源引脚用于当从所述用于数据通信的引脚的电压输入为参考电压时识别与所述连接器连接的外部设备作为所述专用适配器，并且用于对所述电池充电以对所述第一和第二电源引脚的电力输入进行充电 。