公开(公告)号：US07852094B2

公开(公告)日：2010-12-14

申请号：US11567705

申请日：2006-12-06

Applicant: Matthew E. Chraft ,  Benjamin N. Eldridge ,  Roy J. Henson ,  A. Nicholas Sporck

Inventor： Matthew E. Chraft ,  Benjamin N. Eldridge ,  Roy J. Henson ,  A. Nicholas Sporck

IPC: G01R31/02

CPC classification number: G01R31/31926 ,  G01R31/318511

Abstract: Probes in a plurality of DUT probe groups can be connected in parallel to a single tester channel. In one aspect, digital potentiometers can be used to effectively switch the tester channel from a probe in one DUT probe group to a probe in another DUT probe group. In another aspect, switches in parallel with a resistor can accomplish such switching. In yet another aspect, a chip select terminal on each DUT can be used to effectively connect and disconnect internal DUT circuitry to the tester channel. Multiple DUT probe groups so connected can be used to create different patterns of DUT probe groups for testing different patterns of DUTs and thus facilitate sharing tester channels.

Abstract translation: 多个DUT探针组中的探针可以并联连接到单个测试仪通道。 在一个方面，数字电位器可用于有效地将测试仪通道从一个DUT探针组中的探头切换到另一个DUT探针组中的探针。 另一方面，与电阻并联的开关可以实现这种切换。 在另一方面，每个DUT上的芯片选择端可用于有效地连接和断开内部DUT电路到测试器通道。 如此连接的多个DUT探针组可用于创建不同的DUT探针组，以测试DUT的不同图案，从而便于共享测试仪通道。

公开(公告)号：US07845072B2

公开(公告)日：2010-12-07

申请号：US12343260

申请日：2008-12-23

Applicant: Eric D. Hobbs ,  Benjamin N. Eldridge ,  Lunyu Ma ,  Gaetan L. Mathieu ,  Steven T. Murphy ,  Makarand S. Shinde ,  Alexander H. Slocum

Inventor： Eric D. Hobbs ,  Benjamin N. Eldridge ,  Lunyu Ma ,  Gaetan L. Mathieu ,  Steven T. Murphy ,  Makarand S. Shinde ,  Alexander H. Slocum

IPC: H05K3/30

CPC classification number: G01R31/2886 ,  G01R1/073 ,  G01R31/31905 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49147 ,  Y10T29/49208 ,  Y10T29/49222

Abstract: A probe card assembly comprises multiple probe substrates attached to a mounting assembly. Each probe substrate includes a set of probes, and together, the sets of probes on each probe substrate compose an array of probes for contacting a device to be tested. Adjustment mechanisms are configured to impart forces to each probe substrate to move individually each substrate with respect to the mounting assembly. The adjustment mechanisms may translate each probe substrate in an “x,” “y,” and/or “z” direction and may further rotate each probe substrate about any one or more of the forgoing directions. The adjustment mechanisms may further change a shape of one or more of the probe substrates. The probes can thus be aligned and/or planarized with respect to contacts on the device to be tested.

Abstract translation: 探针卡组件包括附接到安装组件的多个探针基板。 每个探针衬底包括一组探针，并且每个探针衬底上的探针组合在一起组成一组探针，用于接触待测试的器件。 调整机构构造成赋予每个探针基板以相对于安装组件分别移动每个基板的力。 调节机构可以将每个探针基板转换成“x”，“y”和/或“z”方向，并且可以进一步围绕前述方向上的任何一个或多个旋转每个探针基板。 调节机构可以进一步改变一个或多个探针基板的形状。 因此，探针可以相对于要测试的装置上的触点对准和/或平坦化。

公开(公告)号：US07841863B2

公开(公告)日：2010-11-30

申请号：US12495405

申请日：2009-06-30

Applicant: Gaetan L. Mathieu ,  Benjamin N. Eldridge ,  Gary W. Grube ,  Richard A. Larder

Inventor： Gaetan L. Mathieu ,  Benjamin N. Eldridge ,  Gary W. Grube ,  Richard A. Larder

IPC: H01R12/00

CPC classification number: G01R3/00 ,  G01R1/06727 ,  G01R1/06761 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/14 ,  H05K3/326 ,  H05K3/4092 ,  H01L2924/00

Abstract: An interconnection element of a spring (body) including a first resilient element with a first contact region and a second contact region and a first securing region and a second resilient element, with a third contact region and a second securing region. The second resilient element is coupled to the first resilient element through respective securing regions and positioned such that upon sufficient displacement of the first contact region toward the second resilient element, the second contact region will contact the third contact region. The interconnection, in one aspect, is of a size suitable for directly contacting a semiconductor device. A large substrate with a plurality of such interconnection elements can be used as a wafer-level contactor. The interconnection element, in another aspect, is of a size suitable for contacting a packaged semiconductor device, such as in an LGA package.

Abstract translation: 包括具有第一接触区域和第二接触区域的第一弹性元件和具有第三接触区域和第二固定区域的第一固定区域和第二弹性元件的弹簧（主体）的互连元件。 第二弹性元件通过相应的固定区域联接到第一弹性元件，并且定位成使得在第一接触区域朝着第二弹性元件充分移位时，第二接触区域将接触第三接触区域。 在一个方面，互连具有适于直接接触半导体器件的尺寸。 可以使用具有多个这种互连元件的大型衬底作为晶片级接触器。 在另一方面，互连元件的尺寸适合于例如LGA封装中的封装半导体器件的接触。

公开(公告)号：US20100297863A1

公开(公告)日：2010-11-25

申请号：US12783379

申请日：2010-05-19

Applicant: Benjamin N. Eldridge

Inventor： Benjamin N. Eldridge

IPC: H01R4/64

CPC classification number: G01R31/2887 ,  G01R1/0735 ,  G01R31/2886

Abstract: An electrical interconnect assembly and methods for making an electrical interconnect assembly. In one embodiment, an interconnect assembly includes a flexible wiring layer having a plurality of first contact elements and a fluid containing structure which is coupled to the flexible wiring layer. The fluid, when contained in the fluid containing structure, presses the flexible wiring layer towards a device under test to form electrical interconnections between the first contact elements and corresponding second contact elements on the device under test. In a further embodiment, an interconnect assembly includes a flexible wiring layer having a plurality of first contact terminals and a semiconductor substrate which includes a plurality of second contact terminals. A plurality of freestanding, resilient contact elements, in one embodiment, are mechanically coupled to one of the flexible wiring layers or the semiconductor substrate and make electrical contacts between corresponding ones of the first contact terminals and the second contact terminals. In another embodiment, a method of making electrical interconnections includes joining a flexible wiring layer and a substrate together in proximity and causing a pressure differential between a first side and a second side of the flexible wiring layer. The pressure differential deforms the flexible wiring layer and causes a plurality of first contact terminals on the flexible wiring layer to electrically connect with a corresponding plurality of second contact terminals on the substrate.

Abstract translation: 电互连组件和用于制造电互连组件的方法。 在一个实施例中，互连组件包括具有多个第一接触元件和耦合到柔性布线层的流体容纳结构的柔性布线层。 当容纳在流体容纳结构中时，流体将柔性布线层压向被测器件，以在被测器件上的第一接触元件和对应的第二接触元件之间形成电互连。 在另一实施例中，互连组件包括具有多个第一接触端子的柔性布线层和包括多个第二接触端子的半导体衬底。 在一个实施例中，多个独立的弹性接触元件机械耦合到柔性布线层或半导体衬底中的一个，并且在对应的第一接触端子和第二接触端子之间形成电接触。 在另一个实施例中，制造电互连的方法包括将柔性布线层和基板接合在一起并在柔性布线层的第一侧和第二侧之间形成压差。 压差使柔性布线层变形，使柔性布线层上的多个第一接触端子与基板上的对应的多个第二接触端子电连接。

公开(公告)号：US20100263432A1

公开(公告)日：2010-10-21

申请号：US12766101

申请日：2010-04-23

Applicant: Gaetan L. Mathieu ,  Benjamin N. Eldridge ,  Gary W. Grube

Inventor： Gaetan L. Mathieu ,  Benjamin N. Eldridge ,  Gary W. Grube

IPC: B21D31/00

CPC classification number: G01R1/07307 ,  G01R3/00

Abstract: A planarizer for a probe card assembly. A planarizer includes a first control member extending from a substrate in a probe card assembly. The first control member extends through at least one substrate in the probe card assembly and is accessible from an exposed side of an exterior substrate in the probe card assembly. Actuating the first control member causes a deflection of the substrate connected to the first control member.

Abstract translation: 用于探针卡组件的平面化器。 平面化器包括从探针卡组件中的衬底延伸的第一控制构件。 第一控制构件延伸穿过探针卡组件中的至少一个衬底，并且可从探针卡组件中的外部衬底的暴露侧进入。 驱动第一控制构件导致连接到第一控制构件的衬底的偏转。

公开(公告)号：US20100244873A1

公开(公告)日：2010-09-30

申请号：US12796457

申请日：2010-06-08

Applicant: Thomas H. Dozier, II ,  Benjamin N. Eldridge ,  David S. Hsu ,  Igor Y. Khandros ,  Charles A. Miller

Inventor： Thomas H. Dozier, II ,  Benjamin N. Eldridge ,  David S. Hsu ,  Igor Y. Khandros ,  Charles A. Miller

IPC: G01R31/02 ,  G01N1/00

CPC classification number: G01R31/2889 ,  G01R31/2893 ,  G01R31/31905

Abstract: An exemplary die carrier is disclosed. In some embodiments, the die carrier can hold a plurality of singulated dies while the dies are tested. The dies can be arranged on the carrier in a pattern that facilities testing the dies. The carrier can be configured to allow interchangeable interfaces to different testers to be attached to and detached from the carrier. The carrier can also be configured as a shipping container for the dies.

Abstract translation: 公开了一种示例性的模具载体。 在一些实施例中，模具载体可以在测试模具的同时保持多个单个模具。 模具可以以对模具进行测试的模式布置在载体上。 载体可以被配置为允许不同的测试仪的可互换的接口被附接到载体上并与载体分离。 载体也可以被配置为模具的运输容器。

公开(公告)号：US07798822B2

公开(公告)日：2010-09-21

申请号：US12511057

申请日：2009-07-28

Applicant: Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

IPC: H01R12/00

CPC classification number: G01R1/07314 ,  H01H1/0036 ,  H01L2224/02335 ,  H01L2924/00013 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49218 ,  Y10T29/49316 ,  H01L2224/13099

Abstract: Microelectronic contact structures are fabricated by separately forming, then joining together, various components thereof. Each contact structure has three components: a “post” component, a “beam” component, and a “tip” component. The resulting contact structure, mounted to an electronic component, is useful for making an electrical connection with another electronic component. The post component can be fabricated on a sacrificial substrate, joined to the electronic component and its sacrificial substrate removed. Alternatively, the post component can be formed on the electronic component. The beam and tip components can each be fabricated on a sacrificial substrate. The beam component is joined to the post component and its sacrificial substrate is removed, and the tip component is joined to the beam component and its sacrificial substrate is removed.

Abstract translation: 微电子接触结构通过分别形成，然后连接在一起而制成其各种部件。 每个接触结构具有三个部件：“后”部件，“梁”部件和“尖端”部件。 安装到电子部件上的所得接触结构对于与另一个电子部件进行电连接是有用的。 后部组件可以制造在牺牲基板上，连接到电子部件并且去除其牺牲基板。 或者，可以在电子部件上形成柱部件。 梁和尖端部件可以分别制造在牺牲衬底上。 梁组件连接到柱部件，并且其牺牲基板被移除，并且尖端部件接合到梁部件并且其牺牲基板被移除。

公开(公告)号：US07737709B2

公开(公告)日：2010-06-15

申请号：US11846012

申请日：2007-08-28

Applicant: Gaetan L. Mathieu ,  Benjamin N. Eldridge ,  Gary W. Grube

Inventor： Gaetan L. Mathieu ,  Benjamin N. Eldridge ,  Gary W. Grube

IPC: G01R31/02

CPC classification number: G01R1/07307 ,  G01R3/00

Abstract: A planarizer for a probe card assembly. A planarizer includes a first control member extending from a substrate in a probe card assembly. The first control member extends through at least one substrate in the probe card assembly and is accessible from an exposed side of an exterior substrate in the probe card assembly. Actuating the first control member causes a deflection of the substrate connected to the first control member.

Abstract translation: 用于探针卡组件的平面化器。 平面化器包括从探针卡组件中的衬底延伸的第一控制构件。 第一控制构件延伸穿过探针卡组件中的至少一个衬底，并且可从探针卡组件中的外部衬底的暴露侧进入。 驱动第一控制构件导致连接到第一控制构件的衬底的偏转。

公开(公告)号：US07724004B2

公开(公告)日：2010-05-25

申请号：US11566194

申请日：2006-12-01

Applicant: Benjamin N. Eldridge ,  Carl V. Reynolds ,  Takao Saeki ,  Yoichi Urakawa

Inventor： Benjamin N. Eldridge ,  Carl V. Reynolds ,  Takao Saeki ,  Yoichi Urakawa

IPC: G01R31/02

CPC classification number: G01R1/18 ,  G01R1/07307 ,  G01R31/2889

Abstract: A probing apparatus can comprise a substrate, conductive signal traces, probes, and electromagnetic shielding. The substrate can have a first surface and a second surface opposite the first surface, and the electrically conductive first signal traces can be disposed on the first surface of the first substrate. The probes can be attached to the first signal traces, and the electromagnetic shielding structures can be disposed about the signal traces.

Abstract translation: 探测装置可以包括衬底，导电信号迹线，探针和电磁屏蔽。 衬底可以具有与第一表面相对的第一表面和第二表面，并且导电的第一信号迹线可以设置在第一衬底的第一表面上。 探针可以附着到第一信号迹线上，并且电磁屏蔽结构可以围绕信号迹线设置。

公开(公告)号：US20100112828A1

公开(公告)日：2010-05-06

申请号：US11466039

申请日：2006-08-21

Applicant: Benjamin N. Eldridge ,  John K. Gritters ,  Igor Y. Khandros ,  Rod Martens ,  Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge ,  John K. Gritters ,  Igor Y. Khandros ,  Rod Martens ,  Gaetan L. Mathieu

IPC: H01R12/00 ,  H01R13/02 ,  H01R43/16

CPC classification number: G01R1/06755 ,  H01R13/03 ,  Y10T29/49204

Abstract: A carbon nanotube contact structure can be used for making pressure connections to a DUT. The contact structure can be formed using a carbon nanotube film or with carbon nanotubes in solution. The carbon nanotube film can be grown in a trench in a sacrificial substrate in which a contact structure such as a beam or contact element is then formed by metal plating. The film can also be formed on a contact element and have metal posts dispersed therein to provide rigidity and elasticity. Contact structures or portions thereof can also be plated with a solution containing carbon nanotubes. The resulting contact structure can be tough, and can provide good electrical conductivity.

Abstract translation: 可以使用碳纳米管接触结构来与DUT进行压力连接。 可以使用碳纳米管膜或溶液中的碳纳米管来形成接触结构。 碳纳米管膜可以在牺牲基板中的沟槽中生长，其中通过金属电镀形成诸如光束或接触元件的接触结构。 膜也可以形成在接触元件上，并且金属柱分散在其中以提供刚性和弹性。 接触结构或其部分也可以镀有含有碳纳米管的溶液。 所得到的接触结构可以是韧性的，并且可以提供良好的导电性。