Compositions containing copolymers of olefinic monomers
    102.
    发明授权
    Compositions containing copolymers of olefinic monomers 失效
    含有烯属单体共聚物的组合物

    公开(公告)号:US07619040B2

    公开(公告)日:2009-11-17

    申请号:US11116706

    申请日:2005-04-28

    IPC分类号: C08F8/32

    摘要: A composition that includes a non-gelled copolymer that contains residues having structural units (I): where n is an integer from 1 to 10,000; R1 is linear or branched C1 to C4 alkyl; R2 is selected from the group consisting of methyl, linear, cyclic or branched C2 to C20 alkyl, alkenyl, aryl, alkaryl and aralkyl, and R3 is a group resulting from a post polymerization reaction selected from transesterification, transamidification and hydrolysis with a compound selected from hydroxy functional compounds and amine functional compounds. The composition may contain co-reactive functional groups and may be a thermosetting composition. A substrate may be coated with the thermosetting composition singly or as part of a multi-layer composite coating that includes a base coat layer and a substantially pigment free top coat layer.

    摘要翻译: 包含含有具有结构单元(I)的残基的非胶凝共聚物的组合物:其中n为1至10,000的整数; R1是直链或支链C1-C4烷基; R 2选自甲基,直链,环状或支链C 2至C 20烷基,烯基,芳基,烷芳基和芳烷基,并且R 3是由选择酯交换,转酰胺化和水解的后聚合反应得到的基团, 由羟基官能化合物和胺官能化合物组成。 组合物可以含有共反应性官能团并且可以是热固性组合物。 基材可以单独地涂覆有热固性组合物,或者作为多层复合涂层的一部分,其包括底涂层和基本上不含颜料的顶涂层。

    Method for creating circuit assemblies
    105.
    发明申请
    Method for creating circuit assemblies 审中-公开
    创建电路组件的方法

    公开(公告)号:US20060141143A1

    公开(公告)日:2006-06-29

    申请号:US11280376

    申请日:2005-11-16

    IPC分类号: B05D5/06

    摘要: Provided is a method for preparing a circuit assembly. The method includes (a) applying a curable coating composition to a substrate, the curable coating composition formed from (i) one or more active hydrogen-containing resins, (ii) one or more polyester curing agents, and (iii) optionally, one or more transesterification catalysts; (b) curing the curable coating composition to form a coating on the substrate; and (c) applying a conductive layer to the surface of at least part of said cured composition. A circuit assembly prepared by the method also is provided.

    摘要翻译: 提供了一种制备电路组件的方法。 该方法包括(a)将可固化涂料组合物施用到基材上,所述可固化涂料组合物由(i)一种或多种含活性氢的树脂,(ii)一种或多种聚酯固化剂,和(iii)任选的一种 或更多的酯交换催化剂; (b)固化可固化涂料组合物以在基材上形成涂层; 和(c)将导电层施加到所述固化的组合物的至少一部分的表面上。 还提供了一种通过该方法制备的电路组件。

    Curable film-forming composition exhibiting improved impact strength and chip resistance
    106.
    发明授权
    Curable film-forming composition exhibiting improved impact strength and chip resistance 有权
    表现出改进的冲击强度和耐碎屑性的可固化成膜组合物

    公开(公告)号:US06770705B2

    公开(公告)日:2004-08-03

    申请号:US10361096

    申请日:2003-02-06

    IPC分类号: C08F21604

    摘要: A curable film-forming composition is provided comprising in a medium (i) 10 to 90 percent by weight based on the total weight of solids in the film-forming composition of a crosslinking agent; (ii) 10 to 90 percent by weight based on the total weight of solids in the film-forming composition of a polymer containing a plurality of functional groups reactive with the crosslinking agent; and (iii) at least 20 percent by volume based on the total volume of the film-forming composition of particles having a mean particle size less than 100 nm. A cured composition comprising the crosslinking agent of (i) and the polymer of (ii) has a cured softening point of less than 30° C. The particles of component (iii) further have a hardness value greater than 5 on the Moh hardness scale, and have an affinity for the medium sufficient to keep the particles suspended therein. The affinity of the particles for the medium is greater than the affinity of the particles for each other, thereby preventing agglomeration of the particles within the medium. Cured compositions having a film thickness of at least 5 microns demonstrate excellent chip resistance, superior sandability and resistance to scratching, water spotting and acid etch.

    摘要翻译: 提供了一种可固化成膜组合物,其包含在基于成膜组合物中交联剂的固体总重量的10至90重量%的介质中(i) (ii)10至90重量%,基于成膜组合物中含有与交联剂反应的多个官能团的聚合物的固体总重量; 和(iii)基于平均粒径小于100nm的成膜组合物的总体积至少20体积%。 包含(i)的交联剂和(ii)的聚合物的固化组合物的固化软化点小于30℃。组分(iii)的颗粒在莫氏硬度标度上还具有大于5的硬度值 并且对于足以使颗粒悬浮在其中的介质具有亲和力。 颗粒对介质的亲和力大于颗粒彼此的亲和力,从而防止颗粒在介质中的团聚。具有至少5微米的膜厚度的组合物表现出优异的耐碎性,优异的耐砂性和耐电性 划伤,水渍和酸蚀。